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1. 发明授权

US06774490B2 Electronic device 失效
标题翻译：电子设备
公开(公告)号：US06774490B2
公开(公告)日：2004-08-10
申请号：US10395231
申请日：2003-03-25
申请人： Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Masato Nakamura , Yuji Fujita , Toshiharu Ishida , Masahide Okamoto , Koji Serizawa , Toshihiro Hachiya , Hideki Mukuno
发明人： Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Masato Nakamura , Yuji Fujita , Toshiharu Ishida , Masahide Okamoto , Koji Serizawa , Toshihiro Hachiya , Hideki Mukuno
IPC分类号： H01L2848
CPC分类号： H01L24/32 , B23K35/262 , B23K2101/36 , H01L24/33 , H01L24/73 , H01L24/81 , H01L2224/05155 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/131 , H01L2224/13144 , H01L2224/1319 , H01L2224/16225 , H01L2224/16227 , H01L2224/291 , H01L2224/29109 , H01L2224/29111 , H01L2224/2929 , H01L2224/29299 , H01L2224/293 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/15311 , H01L2924/15738 , H01L2924/1576 , H01L2924/16152 , H01L2924/181 , H01L2924/20106 , H05K3/3463 , Y10T428/12528 , H01L2924/00014 , H01L2224/13099 , H01L2924/00012 , H01L2924/01026 , H01L2924/01028 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199
摘要： An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0-2.0 mass %, In: 0.1-10 mass %, and Sn: remaining amount.
摘要翻译：电子设备能够改善电子设备中的抗冲击性或抗冲击性，并且提高半导体器件芯片接合Si芯片等中引起大变形的热冲击作用的焊点的可靠性，凸块安装的BGA，CSP，WPP，倒装芯片等，功率模块作用大的应力等等。电子设备具有电路板和电连接到电路板的电极的电子部件。电路板的电极和电子部件的电极通过使用由Cu：0-2.0质量％，In：0.1-10质量％和Sn：剩余量组成的无铅焊料进行焊接而连接。

2. 发明授权

US06555052B2 Electron device and semiconductor device 失效
公开(公告)号：US06555052B2
公开(公告)日：2003-04-29
申请号：US09799486
申请日：2001-03-07
申请人： Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Masato Nakamura , Yuji Fujita , Toshiharu Ishida , Masahide Okamoto , Koji Serizawa , Toshihiro Hachiya , Hideki Mukuno
发明人： Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Masato Nakamura , Yuji Fujita , Toshiharu Ishida , Masahide Okamoto , Koji Serizawa , Toshihiro Hachiya , Hideki Mukuno
IPC分类号： C22C1302
CPC分类号： H01L24/32 , B23K35/262 , B23K2101/36 , H01L24/33 , H01L24/73 , H01L24/81 , H01L2224/05155 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/131 , H01L2224/13144 , H01L2224/1319 , H01L2224/16225 , H01L2224/16227 , H01L2224/291 , H01L2224/29109 , H01L2224/29111 , H01L2224/2929 , H01L2224/29299 , H01L2224/293 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/15311 , H01L2924/15738 , H01L2924/1576 , H01L2924/16152 , H01L2924/181 , H01L2924/20106 , H05K3/3463 , Y10T428/12528 , H01L2924/00014 , H01L2224/13099 , H01L2924/00012 , H01L2924/01026 , H01L2924/01028 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199
摘要： An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0˜2.0 mass %, In: 0.1˜10 mass %, and Sn: remaining amount.

3. 发明授权

US06761301B2 Soldering machine 有权
标题翻译：焊机
公开(公告)号：US06761301B2
公开(公告)日：2004-07-13
申请号：US10097610
申请日：2002-03-15
申请人： Hideki Mukuno , Kazumi Tashiro , Hideaki Arita , Kiyoshi Kanai , Teruo Okano , Fumihiro Yamashita , Shoichirou Matsuhisa , Hidekazu Imai
发明人： Hideki Mukuno , Kazumi Tashiro , Hideaki Arita , Kiyoshi Kanai , Teruo Okano , Fumihiro Yamashita , Shoichirou Matsuhisa , Hidekazu Imai
IPC分类号： B23K100
CPC分类号： B23K1/012 , B23K2101/42
摘要： A soldering machine using lead-free solders is provided which can uniformly heat a printed circuit board and electronic parts to be mounted thereon, and which can solder the electronic parts without thermally damaging them. A porous member having a number of holes formed therein is disposed between a blower fan and a heater for making uniform the pressure of a fluid. A radiation plate is disposed between the heater and a heating target for blowing the fluid having been heated by the heater to the heating target in the form of a turbulent flow. The heated fluid is blown to the heating target for heating the same, whereby solder is melted.
摘要翻译：提供了一种使用无铅焊料的焊接机，其能够均匀地加热印刷电路板和要安装在其上的电子部件，并且可以焊接电子部件而不会对其造成热损害。在鼓风扇和加热器之间设置有多个孔的多孔构件，用于使流体的压力均匀。辐射板设置在加热器和加热靶之间，用于将被加热器加热的流体以湍流的形式吹送到加热靶。被加热的流体被吹送到加热对象以加热，从而焊料熔化。

4. 发明授权

US06541364B2 Bump forming method and bump forming apparatus 有权
公开(公告)号：US06541364B2
公开(公告)日：2003-04-01
申请号：US09986768
申请日：2001-11-09
申请人： Hideki Mukuno , Jun Matsui , Kaoru Uchiyama , Takayuki Itsuji , Kunio Kondo
发明人： Hideki Mukuno , Jun Matsui , Kaoru Uchiyama , Takayuki Itsuji , Kunio Kondo
IPC分类号： H01L2144
CPC分类号： B23K3/0623 , B23K2101/36 , H01L21/4853 , H05K3/3478
摘要： A mask 11 has a plurality of holes formed at positions corresponding to positions of a plurality of electrode portions 10a on one surface of an object to be processed 10 to mount thereon conductive particles 13, and the plurality of holes are opposite to the plurality of electrode portions 10a formed on the object to be processed. A table 12 has a plurality of holes 12a for sucking the object to be processed 10 from the other surface of the object to be processed 10, and for sucking the particles 13 through the plurality of holes 11a in the mask 11 so that the particles 13 may be mounted on the electrode portions 10a formed on the object to be processed 10. A hopper 14 contains therein the plurality of conductive particles 13, prevents the plurality of conductive particles 13 from adhering to each other, and has a slit portion 17 for dropping the plurality of conductive particles 13 by the self-weight. A slit portion 17 in the hopper 14 is moved, facing the upper surface of the mask 11 with a gap between the slit portion 17 and the upper surface of the mask 11 larger than a diameter of the particle 13, and the hopper 14 is arranged in the front side in the moving direction, and the unit 15 is arranged in the rear side, and the particles 13 not dropped into the holes of the mask being collected by the collecting unit 15.

5. 发明授权

US06412681B2 Soldering machine 有权
公开(公告)号：US06412681B2
公开(公告)日：2002-07-02
申请号：US09732939
申请日：2000-12-11
申请人： Hideki Mukuno , Kazumi Tashiro , Hideaki Arita , Kiyoshi Kanai , Teruo Okano , Fumihiro Yamashita , Shoichirou Matsuhisa , Hidekazu Imai
发明人： Hideki Mukuno , Kazumi Tashiro , Hideaki Arita , Kiyoshi Kanai , Teruo Okano , Fumihiro Yamashita , Shoichirou Matsuhisa , Hidekazu Imai
IPC分类号： B23K100
CPC分类号： B23K1/012 , B23K2101/42
摘要： A soldering machine using lead-free solders is provided which can uniformly heat a printed circuit board and electronic parts to be mounted thereon, and which can solder the electronic parts without thermally damaging them. A porous member having a number of holes formed therein is disposed between a blower fan and a heater for making uniform the pressure of a fluid. A radiation plate is disposed between the heater and a heating target for blowing the fluid having been heated by the heater to the heating target in the form of a turbulent flow. The heated fluid is blown to the heating target for heating the same, whereby solder is melted.

6. 发明申请

US20070051777A1 SOLDERING METHOD 审中-公开
标题翻译：焊接方法
公开(公告)号：US20070051777A1
公开(公告)日：2007-03-08
申请号：US11470088
申请日：2006-09-05
申请人： Takahito Yamaguchi , Norio Hasegawa , Toru Kato , Hideki Mukuno , Masahiko Asano
发明人： Takahito Yamaguchi , Norio Hasegawa , Toru Kato , Hideki Mukuno , Masahiko Asano
IPC分类号： A47J36/02
CPC分类号： H05K3/3447 , B23K3/0653 , B23K2101/40 , H05K3/3468 , H05K2203/0746
摘要： This invention provides a soldering method capable of solving soldering defects due to excess molten solder in the case of soldering while applying an inner pressure into a through-hole of a lead component mounting substrate: (a) In a primary soldering step, a lead component mounting substrate is lowered, and the rear surface thereof is put close to or brought into close contact with an upper end opening edge of a nozzle. Simultaneously, the soldering surface of the molten solder supplied to the nozzle is elevated. (b) In a secondary soldering step, the rear surface of the lead component mounting substrate is relatively spaced from the soldering surface of molten solder by lowering the soldering surface. (c) In a lead separating step, the lead component mounting substrate is elevated while tilting the lead component mounting substrate.
摘要翻译：本发明提供了一种焊接方法，其能够在焊接的情况下解决由于多余的熔融焊料引起的焊接缺陷，同时将内部压力施加到引线部件安装基板的通孔中：（a）在初级焊接步骤中，引线部件安装基板被降低，并且其后表面靠近或与喷嘴的上端开口边缘紧密接触。同时，提供给喷嘴的熔融焊料的焊接表面升高。（b）在二次焊接步骤中，通过降低焊接表面，引线部件安装基板的后表面与熔融焊料的焊接表面相对地间隔开。（c）在引线分离步骤中，引线部件安装基板在使引线部件安装基板倾斜的同时升高。

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