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1. 发明申请

US20070051777A1 SOLDERING METHOD 审中-公开
标题翻译：焊接方法
公开(公告)号：US20070051777A1
公开(公告)日：2007-03-08
申请号：US11470088
申请日：2006-09-05
申请人： Takahito Yamaguchi , Norio Hasegawa , Toru Kato , Hideki Mukuno , Masahiko Asano
发明人： Takahito Yamaguchi , Norio Hasegawa , Toru Kato , Hideki Mukuno , Masahiko Asano
IPC分类号： A47J36/02
CPC分类号： H05K3/3447 , B23K3/0653 , B23K2101/40 , H05K3/3468 , H05K2203/0746
摘要： This invention provides a soldering method capable of solving soldering defects due to excess molten solder in the case of soldering while applying an inner pressure into a through-hole of a lead component mounting substrate: (a) In a primary soldering step, a lead component mounting substrate is lowered, and the rear surface thereof is put close to or brought into close contact with an upper end opening edge of a nozzle. Simultaneously, the soldering surface of the molten solder supplied to the nozzle is elevated. (b) In a secondary soldering step, the rear surface of the lead component mounting substrate is relatively spaced from the soldering surface of molten solder by lowering the soldering surface. (c) In a lead separating step, the lead component mounting substrate is elevated while tilting the lead component mounting substrate.
摘要翻译：本发明提供了一种焊接方法，其能够在焊接的情况下解决由于多余的熔融焊料引起的焊接缺陷，同时将内部压力施加到引线部件安装基板的通孔中：（a）在初级焊接步骤中，引线部件安装基板被降低，并且其后表面靠近或与喷嘴的上端开口边缘紧密接触。同时，提供给喷嘴的熔融焊料的焊接表面升高。（b）在二次焊接步骤中，通过降低焊接表面，引线部件安装基板的后表面与熔融焊料的焊接表面相对地间隔开。（c）在引线分离步骤中，引线部件安装基板在使引线部件安装基板倾斜的同时升高。

2. 发明申请

US20070082311A1 METHOD FOR CONTROLLING HEATING APPARATUS 审中-公开
标题翻译：控制加热装置的方法
公开(公告)号：US20070082311A1
公开(公告)日：2007-04-12
申请号：US11532345
申请日：2006-09-15
申请人： Takahito Yamaguchi , Kiyoshi Dozono
发明人： Takahito Yamaguchi , Kiyoshi Dozono
IPC分类号： F26B11/02
CPC分类号： F26B21/10
摘要： A method for controlling a heating apparatus whereby the heating apparatus is started up effectively with limited power consumption. A heating priority is determined by multiplying the temperature deviation in each zone by a heat capacity coefficient specific for each zone. The heating priority of each zone is determined alternatively by multiplying an adjacency temperature deviation between adjacent zones by an adjacency coefficient that is set based on the adjacency relationship. The order of zones from the highest to lowest heating priorities is determined, and a plurality of zones are combined in such a manner as to include ones having, respectively, the highest and lowest heating priorities to prepare a group. Similarly, other plurality of zones are combined to prepare groups repeatedly. The power consumption of heaters is limited in each of these groups.
摘要翻译：一种用于控制加热装置的方法，由此在有限的功率消耗下有效启动加热装置。通过将每个区域中的温度偏差乘以每个区域特有的热容量系数来确定加热优先级。通过将相邻区域之间的邻接温度偏差乘以基于邻接关系设置的邻接系数来交替地确定每个区域的加热优先级。确定从最高到最低加热优先级的区域的顺序，并且多个区域以包括分别具有最高和最低加热优先级的区域的方式组合以制备组。类似地，组合其他多个区域以重复地准备组。加热器的功耗在这些组中是有限的。

3. 发明授权

US07809465B2 Device, method and program for soldering 有权
标题翻译：用于焊接的装置，方法和程序
公开(公告)号：US07809465B2
公开(公告)日：2010-10-05
申请号：US11950106
申请日：2007-12-04
申请人： Takahito Yamaguchi , Kiyoshi Dohzono
发明人： Takahito Yamaguchi , Kiyoshi Dohzono
IPC分类号： G06F19/00 , D06F75/24 , F27D11/00 , F27B14/00
CPC分类号： B23K1/008
摘要： Soldering can be performed in a state where the temperature in an object zone is stable, regardless of the heat capacity of a soldering object. A soldering device includes: a position calculation unit which calculates the position of a heated object according to operational information of a conveyer which sequentially transfers the heated object into a plurality of zones for heat processing communicated with each other; a heat capacity calculation unit which calculates the heat capacity of the heated object; and a temperature management unit which controls the temperature in an object zone into which the heated object is carried, upon receiving positional information from the position calculation unit. The temperature management unit feedforward-controls the temperature in the object zone by adjusting the heat capacity of the object zone according to the heat capacity calculated by the heat capacity calculation unit.
摘要翻译：可以在物体区域的温度稳定的状态下进行焊接，而与焊接对象的热容量无关。焊接装置包括：位置计算单元，其根据将加热物体依次传送到多个彼此进行热处理的区域的输送机的操作信息来计算被加热物体的位置; 热容量计算单元，其计算被加热物体的热容量; 以及温度管理单元，其在从所述位置计算单元接收到位置信息时，控制被加热物体承载的物体区域中的温度。温度管理单元前馈通过根据由热容量计算单元计算的热容量调节对象区域的热容量来控制对象区域中的温度。

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