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1. 发明授权

US6120937A Electrode for alkaline storage battery and method for manufacturing the same 失效
标题翻译：碱性蓄电池用电极及其制造方法
公开(公告)号：US6120937A
公开(公告)日：2000-09-19
申请号：US76254
申请日：1998-05-11
申请人： Tamao Kojima , Munehiro Tabata , Tomoyuki Washizaki , Masakazu Tanahashi , Yoshiki Murakami , Satoshi Kaida , Masayoshi Maruta
发明人： Tamao Kojima , Munehiro Tabata , Tomoyuki Washizaki , Masakazu Tanahashi , Yoshiki Murakami , Satoshi Kaida , Masayoshi Maruta
IPC分类号： H01M4/32 , H01M4/66 , H01M4/80 , H01M10/34 , H01M4/28
CPC分类号： H01M4/667 , H01M4/32 , H01M4/80 , H01M10/345 , Y02E60/124 , Y10T29/10
摘要： In a positive electrode for an alkaline storage battery, a layer is formed between a porous substrate as a core material and an active material including nickel hydroxide filled into the porous substrate. The layer includes an oxide containing cobalt and nickel and/or a hydroxide containing cobalt and nickel. In the hydroxide, the average of an oxidation number of a metal is more than +II. The layer has a high electric conductivity while keeping the high corrosion resistance. A utilization rate of the active material can be improved due to the high electric conductivity. An alkaline storage battery including such an electrode has a good cycle property.
摘要翻译：在碱性蓄电池用正极中，作为芯材的多孔质基材和填充于多孔质基材中的含有氢氧化镍的活性物质形成层。该层包括含有钴和镍的氧化物和/或含有钴和镍的氢氧化物。在氢氧化物中，金属的氧化数的平均值大于+ II。该层具有高导电性，同时保持高耐腐蚀性。由于高导电性，可以提高活性物质的利用率。包括这种电极的碱性蓄电池具有良好的循环特性。

2. 发明授权

US06493210B2 Electrode metal material, capacitor and battery formed of the material and method of producing the material and the capacitor and battery 失效
标题翻译：电极金属材料，电容器和电池组成的材料及其制造方法以及电容器和电池
公开(公告)号：US06493210B2
公开(公告)日：2002-12-10
申请号：US10035164
申请日：2002-01-04
申请人： Seiji Nonaka , Masakazu Tanahashi , Mikinari Shimada , Tamao Kojima , Munehiro Tabata
发明人： Seiji Nonaka , Masakazu Tanahashi , Mikinari Shimada , Tamao Kojima , Munehiro Tabata
IPC分类号： H01G900
CPC分类号： H01G9/04 , H01G11/24 , H01G11/30 , H01G11/38 , H01G11/42 , H01M4/13 , H01M4/625 , H01M4/661 , H01M4/663 , H01M4/667 , H01M10/052 , H01M2004/027 , Y02E60/13 , Y10T29/417
摘要： The present invention relates to an electrode metal material for batteries, capacitors, etc., used in contact with non-aqueous electrolyte, and particularly to a capacitor formed of the electrode metal material, and provides a valve metal material capable of decreasing the internal resistance of the capacitor. The electrode metal material includes a valve metal material and numerous carbon particles included in the surface of the valve metal material. The carbon particles are further fixed in the surface of the valve metal material so as to expose to the surface. The electrode metal material is coated with an activated carbon layer and used as a double-layer electrode for an electric double-layer capacitor. The carbon particles included in the surface ensure conduction between the activated carbon layer and the valve metal material. With this configuration, even if the surface of the valve metal material is oxidized, the internal resistance of the electrode is not decreased, the internal resistance of the capacitor is decreased, and the capacitance of the capacitor is increased.
摘要翻译：本发明涉及用于与非水电解质接触的电池，电容器等的电极金属材料，特别涉及由电极金属材料形成的电容器，并提供能够降低内阻的阀金属材料的电容器。电极金属材料包括阀金属材料和包括在阀金属材料表面中的许多碳颗粒。碳颗粒进一步固定在阀金属材料的表面上以暴露于表面。电极金属材料涂覆有活性炭层，并用作双层电容器的双层电极。包含在表面中的碳颗粒确保活性炭层和阀金属材料之间的导电。利用这种结构，即使阀金属材料的表面被氧化，电极的内部电阻也不会降低，电容器的内部电阻降低，并且电容器的电容增大。

3. 发明授权

US06808845B1 Electrode metal material, capacitor and battery formed of the material and method of producing the material and the capacitor and battery 有权
标题翻译：电极金属材料，电容器和电池组成的材料及其制造方法以及电容器和电池
公开(公告)号：US06808845B1
公开(公告)日：2004-10-26
申请号：US09679308
申请日：2000-10-06
申请人： Seiji Nonaka , Masakazu Tanahashi , Mikinari Shimada , Tamao Kojima , Munehiro Tabata
发明人： Seiji Nonaka , Masakazu Tanahashi , Mikinari Shimada , Tamao Kojima , Munehiro Tabata
IPC分类号： H01M460
CPC分类号： H01M4/0404 , H01G11/32 , H01G11/42 , H01M4/13 , H01M4/661 , H01M4/667 , Y02E60/13
摘要： The present invention relates to an electrode metal material for batteries, capacitors, etc, used in contact with non-aqueous electrolyte, and particularly to a capacitor formed of the electrode metal material, and provides a valve metal material capable of decreasing the internal resistance of the capacitor. The electrode metal material comprises a valve metal material and numerous carbon particles included in the surface of the valve metal material. The carbon particles are further fixed in the surface of the valve metal material so as to expose to the surface. The electrode metal material is coated with an activated carbon layer and used as a double-layer electrode for an electric double-layer capacitor. The carbon particles included in the surface ensure conduction between the activated carbon layer and the valve metal material. With this configuration, even if the surface of the valve metal material is oxidized, the internal resistance of the electrode is not decreased, the internal resistance of the capacitor is decreased, and the capacitance of the capacitor is increased.
摘要翻译：本发明涉及用于与非水电解质接触的电池，电容器等的电极金属材料，特别涉及由电极金属材料形成的电容器，并提供能够降低内部电阻的阀金属材料电容器。电极金属材料包括阀金属材料和包括在阀金属材料表面中的许多碳颗粒。碳颗粒进一步固定在阀金属材料的表面上以暴露于表面。电极金属材料涂覆有活性炭层，并用作双层电容器的双层电极。包含在表面中的碳颗粒确保活性炭层和阀金属材料之间的导电。利用这种结构，即使阀金属材料的表面被氧化，电极的内部电阻也不会降低，电容器的内部电阻降低，并且电容器的电容增大。

4. 发明授权

US6108903A Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same 失效
标题翻译：电路基板的连接部件和使用该电路基板的多层电路基板的制造方法
公开(公告)号：US6108903A
公开(公告)日：2000-08-29
申请号：US582930
申请日：1996-01-04
申请人： Seiichi Nakatani , Akihito Hatakeyama , Kouji Kawakita , Hiroshi Sogou , Tatsuo Ogawa , Tamao Kojima
发明人： Seiichi Nakatani , Akihito Hatakeyama , Kouji Kawakita , Hiroshi Sogou , Tatsuo Ogawa , Tamao Kojima
IPC分类号： H05K3/40 , H05K3/42 , H05K3/46 , H05K3/10 , H05K3/36
CPC分类号： H05K3/462 , H01R12/523 , H05K3/4069 , H05K2201/0116 , H05K2201/0355 , H05K2201/09536 , H05K2201/10378 , H05K2203/0191 , H05K2203/1461 , H05K3/4623 , H05K3/4652 , Y10S428/901 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T428/24273 , Y10T428/24322 , Y10T428/24917
摘要： A connecting member of circuit substrates includes an organic porous base material provided with tackfree films on both sides, through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films. This structure enables inner-via-hole connection and can therefore attain a connecting member of circuit substrates and an electrical connector of high reliability and high quality. By using a connecting member of circuit substrates including the organic porous base material provided with tackfree films on both sides and through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films, it is possible to form a high-multilayer substrate easily from double sided boards or four-layer substrates which can be manufactured rather stably. In addition to that, since the conductive paste is filled up to the surface of the tackfree films, the conductive paste sticks out from the surface of the organic porous base material when the tackfree films are separated. As a result, the filled amount of the conductive substance increases after the lamination, and thus, the connection resistance is reduced considerably.
摘要翻译：电路基板的连接构件包括在两侧设置有无粘性薄膜的有机多孔基材，设置在要求位置的通孔，其填充有导电树脂组合物直到无粘膜的表面。这种结构能够实现内通孔连接，从而可以获得电路基板的连接构件和高可靠性和高质量的电连接器。通过使用包括在两侧设置有无粘膜的有机多孔基材的电路基板的连接构件，以及设置在填充有导电树脂组合物的所需位置的通孔，直到无粘膜的表面，可以形成来自可以制造得相当稳定的双面板或四层基板的高多层基板。除此之外，由于导电膏被填充到无粘性膜的表面，所以当无粘性膜分离时，导电糊从有机多孔基材的表面突出出来。结果，在层压之后导电物质的填充量增加，因此连接电阻显着降低。

5. 发明申请

US20100243772A1 METHOD OF SORTING RESIN 有权
标题翻译：分离树脂的方法
公开(公告)号：US20100243772A1
公开(公告)日：2010-09-30
申请号：US12282188
申请日：2008-02-28
申请人： Tamao Kojima , Kazutaka Nishikawa , Masatoshi Miyasaka , Akira Isomi , Daisuke Tabata , Hiroyuki Naka , Yoshinori Wada , Yasuyuki Sato
发明人： Tamao Kojima , Kazutaka Nishikawa , Masatoshi Miyasaka , Akira Isomi , Daisuke Tabata , Hiroyuki Naka , Yoshinori Wada , Yasuyuki Sato
IPC分类号： B29B17/02 , B29B13/02
CPC分类号： B29B17/02 , B29B2017/0203 , B29B2017/0255 , B29B2017/0258 , B29K2023/12 , B29K2025/00 , B29K2025/06 , B29K2055/02 , B29L2031/3044 , B29L2031/3061 , Y02W30/622
摘要： A sorting member with an optimized surface shape is adopted to pressurize a mixture heated on the sorting member to allow a melted resin mixed in the mixture to adhere to the sorting member to sort the resin from an unmelted resin. Thus, resin materials are sorted and recovered from unwanted home electric appliances and the like at a high purity.
摘要翻译：采用具有优化的表面形状的分选部件对加热到分选部件上的混合物加压，使混合物中混合的熔融树脂粘附到分选部件上，以从未熔化的树脂分类树脂。因此，树脂材料以高纯度从不想要的家用电器等中分类和回收。

6. 发明申请

US20080203599A1 Molding Method of Polylactic Resin 审中-公开
标题翻译：聚乳酸树脂成型方法
公开(公告)号：US20080203599A1
公开(公告)日：2008-08-28
申请号：US12064169
申请日：2003-06-20
申请人： Akira Isomi , Hiroki Nunose , Daisuke Tabata , Tamao Kojima , Kazutaka Nishikawa , Hiroyuki Naka
发明人： Akira Isomi , Hiroki Nunose , Daisuke Tabata , Tamao Kojima , Kazutaka Nishikawa , Hiroyuki Naka
IPC分类号： B29C45/17
CPC分类号： B29C45/568 , B29C33/56 , B29C45/37 , B29K2029/04 , B29K2995/0056 , B29L2031/712
摘要： In order to provide a molding method of polylactic resin by which a container or package having a transparent part can be fabricated with high heat resistance, polylactic resin is injected into a cavity, vibrations are added to the polylactic resin while a screw is kept at a charging completion position, and the process is switched to a pressure holding process after the addition of vibrations is completed.
摘要翻译：为了提供聚乳酸树脂的成型方法，通过该方法可以制造具有高耐热性的具有透明部分的容器或包装，将聚乳酸树脂注入空腔中，同时将螺杆保持在充电完成位置，并且在完成振动的添加之后将该过程切换到压力保持过程。

7. 发明授权

US5972482A Printed circuit board and method of manufacturing the same 失效
标题翻译：印刷电路板及其制造方法
公开(公告)号：US5972482A
公开(公告)日：1999-10-26
申请号：US740261
申请日：1996-10-25
申请人： Akihito Hatakeyama , Seiichi Nakatani , Kouji Kawakita , Hiroshi Sogou , Tatsuo Ogawa , Tamao Kojima
发明人： Akihito Hatakeyama , Seiichi Nakatani , Kouji Kawakita , Hiroshi Sogou , Tatsuo Ogawa , Tamao Kojima
IPC分类号： H05K1/03 , H05K3/40 , H05K3/46 , B32B9/00
CPC分类号： H05K3/462 , H05K3/4069 , H05K1/0366 , H05K2201/0116 , H05K2201/0154 , H05K2201/0278 , H05K2201/0355 , H05K2201/10378 , H05K2201/2072 , H05K2203/0191 , H05K2203/1461 , H05K3/4614 , H05K3/4652 , Y10S428/901 , Y10T29/49126 , Y10T29/49155 , Y10T428/24917 , Y10T428/249953 , Y10T428/249996
摘要： A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.
摘要翻译：印刷电路板包括具有封闭空隙的未固化衬底材料，所述未固化衬底材料设置有通孔。当形成通孔时，存在于基板材料中的空隙从通孔的内壁开口形成中空形部分。通过用导电膏填充通孔和中空形部分，通过导电膏和通孔的壁表面之间的保持效果增加，粘附性得到改善。

8. 发明授权

US5484647A Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same 失效
标题翻译：电路基板的连接部件和使用该电路基板的多层电路基板的制造方法
公开(公告)号：US5484647A
公开(公告)日：1996-01-16
申请号：US308982
申请日：1994-09-20
申请人： Seiichi Nakatani , Akihito Hatakeyama , Kouji Kawakita , Hirishi Sogou , Tatsuo Ogawa , Tamao Kojima
发明人： Seiichi Nakatani , Akihito Hatakeyama , Kouji Kawakita , Hirishi Sogou , Tatsuo Ogawa , Tamao Kojima
IPC分类号： H05K3/40 , H05K3/42 , H05K3/46 , B32B9/00
CPC分类号： H05K3/462 , H01R12/523 , H05K3/4069 , H05K2201/0116 , H05K2201/0355 , H05K2201/09536 , H05K2201/10378 , H05K2203/0191 , H05K2203/1461 , H05K3/4623 , H05K3/4652 , Y10S428/901 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T428/24273 , Y10T428/24322 , Y10T428/24917 , Y10T428/249994 , Y10T428/249996 , Y10T442/2475 , Y10T442/674
摘要： A connecting member of circuit substrates includes an organic porous base material provided with tackfree films on both sides, through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films. This structure enables inner-via-hole connection and can therefore attain a connecting member of circuit substrates and an electrical connector of high reliability and high quality.By using a connecting member of circuit substrates including the organic porous base material provided with tackfree films on both sides and through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films, it is possible to form a high-multilayer substrate easily from double sided boards or four-layer substrates which can be manufactured rather stably. In addition to that, since the conductive paste is filled up to the surface of the tackfree films, the conductive paste sticks out from the surface of the organic porous base material when the tackfree-films are separated. As a result, the filled amount of the conductive substance increases after the lamination, and thus, the connection resistance is reduced considerably.
摘要翻译：电路基板的连接构件包括在两侧设置有无粘性薄膜的有机多孔基材，设置在要求位置的通孔，其填充有导电树脂组合物直到无粘膜的表面。这种结构能够实现内通孔连接，从而可以获得电路基板的连接构件和高可靠性和高质量的电连接器。通过使用包括在两侧设置有无粘膜的有机多孔基材的电路基板的连接构件以及设置在导电性树脂组合物的要求位置处的通孔，直到无粘膜的表面，可以形成来自可以制造得相当稳定的双面板或四层基板的高多层基板。除此之外，由于导电膏被填充到无粘性膜的表面，所以当无粘膜分离时，导电糊从有机多孔基材的表面突出出来。结果，在层压之后导电物质的填充量增加，因此连接电阻显着降低。

9. 发明授权

US5481795A Method of manufacturing organic substrate used for printed circuits 失效
标题翻译：制造印刷电路用有机基板的方法
公开(公告)号：US5481795A
公开(公告)日：1996-01-09
申请号：US258383
申请日：1994-06-10
申请人： Akihito Hatakeyama , Hiroshi Sogo , Tamao Kojima , Yasuhiko Horio , Masahide Tsukamoto , Yasushi Fukumura
发明人： Akihito Hatakeyama , Hiroshi Sogo , Tamao Kojima , Yasuhiko Horio , Masahide Tsukamoto , Yasushi Fukumura
IPC分类号： H05K1/03 , H05K1/11 , H05K3/22 , H05K3/28 , H05K3/40 , H05K3/46 , H01K3/10
CPC分类号： H05K3/462 , H05K3/4069 , H05K2201/0116 , H05K2201/0269 , H05K2201/0355 , H05K2201/10378 , H05K2203/0191 , H05K2203/1461 , H05K3/28 , H05K3/4623 , Y10S428/901 , Y10T29/49124 , Y10T29/49126 , Y10T29/49165 , Y10T428/24917 , Y10T428/249953 , Y10T428/249996
摘要： A method of manufacturing an organic substrate used for printed circuits, which includes the steps of forming through-holes in a porous raw material provided with cover films and having compressive shrinkage, filling electro-conductive paste into the through-holes, separating the cover films from the porous raw material filled with the electro-conductive paste in its through-holes, applying metal foils onto the surfaces of the porous raw material from which the cover films have been separated, and compressing the porous raw material applied with the metal foils through heating and pressurization, whereby the electro-conductive substances in the electro-conductive paste are connected for electrical connection between the metal foils.
摘要翻译：一种印刷电路用有机基板的制造方法，其特征在于，包括以下步骤：在设置有覆盖膜的多孔原料中形成通孔，并具有压缩收缩率，将导电性浆料填充到通孔中，从填充有导电糊的多孔原料在其通孔中，将金属箔施加到已经从其分离了覆盖膜的多孔原料的表面上，并且将施加有金属箔的多孔原料压缩通过加热和加压，由此将导电浆料中的导电物质连接用于金属箔之间的电连接。

10. 发明申请

US20140197078A1 SEPARATION APPARATUS AND SEPARATION METHOD 有权
标题翻译：分离装置和分离方法
公开(公告)号：US20140197078A1
公开(公告)日：2014-07-17
申请号：US13809458
申请日：2012-09-12
申请人： Tamao Kojima , Masatoshi Miyasaka , Hideshi Ueda , Shinji Yoshino
发明人： Tamao Kojima , Masatoshi Miyasaka , Hideshi Ueda , Shinji Yoshino
IPC分类号： B07C5/00
CPC分类号： B07C5/00 , B07C5/368 , B07C2501/0018
摘要： A separation apparatus according to the present invention includes: a conveyor that conveys a group of pieces; a material distinguishing unit that distinguishes between first pieces and second pieces that are placed on the conveyor, according to material; a blower that generates airflow supplied from a middle of the conveyor toward a conveying end along a conveying surface; a first separation unit that blows off the first pieces thrown forward from the conveying end, based on a differentiation result obtained by the material distinguishing unit; a second separation unit that blows off the second pieces toward a different place; and a current plate provided below the group of pieces thrown forward and protruding from the conveyor.
摘要翻译：根据本发明的分离装置包括：传送器，其输送一组件; 材料识别单元，根据材料区分放置在输送机上的第一片和第二片; 鼓风机，其沿着输送面从输送机的中途向输送端产生气流; 基于由所述材料区分单元获得的微分结果，吹出从所述输送端向前抛出的第一片的第一分离单元; 第二分离单元，将第二块朝向不同的位置吹出; 以及设置在前面并从输送机突出的一组件下方的当前板。

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