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1. 发明授权

US6108903A Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same 失效
标题翻译：电路基板的连接部件和使用该电路基板的多层电路基板的制造方法
公开(公告)号：US6108903A
公开(公告)日：2000-08-29
申请号：US582930
申请日：1996-01-04
申请人： Seiichi Nakatani , Akihito Hatakeyama , Kouji Kawakita , Hiroshi Sogou , Tatsuo Ogawa , Tamao Kojima
发明人： Seiichi Nakatani , Akihito Hatakeyama , Kouji Kawakita , Hiroshi Sogou , Tatsuo Ogawa , Tamao Kojima
IPC分类号： H05K3/40 , H05K3/42 , H05K3/46 , H05K3/10 , H05K3/36
CPC分类号： H05K3/462 , H01R12/523 , H05K3/4069 , H05K2201/0116 , H05K2201/0355 , H05K2201/09536 , H05K2201/10378 , H05K2203/0191 , H05K2203/1461 , H05K3/4623 , H05K3/4652 , Y10S428/901 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T428/24273 , Y10T428/24322 , Y10T428/24917
摘要： A connecting member of circuit substrates includes an organic porous base material provided with tackfree films on both sides, through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films. This structure enables inner-via-hole connection and can therefore attain a connecting member of circuit substrates and an electrical connector of high reliability and high quality. By using a connecting member of circuit substrates including the organic porous base material provided with tackfree films on both sides and through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films, it is possible to form a high-multilayer substrate easily from double sided boards or four-layer substrates which can be manufactured rather stably. In addition to that, since the conductive paste is filled up to the surface of the tackfree films, the conductive paste sticks out from the surface of the organic porous base material when the tackfree films are separated. As a result, the filled amount of the conductive substance increases after the lamination, and thus, the connection resistance is reduced considerably.
摘要翻译：电路基板的连接构件包括在两侧设置有无粘性薄膜的有机多孔基材，设置在要求位置的通孔，其填充有导电树脂组合物直到无粘膜的表面。这种结构能够实现内通孔连接，从而可以获得电路基板的连接构件和高可靠性和高质量的电连接器。通过使用包括在两侧设置有无粘膜的有机多孔基材的电路基板的连接构件，以及设置在填充有导电树脂组合物的所需位置的通孔，直到无粘膜的表面，可以形成来自可以制造得相当稳定的双面板或四层基板的高多层基板。除此之外，由于导电膏被填充到无粘性膜的表面，所以当无粘性膜分离时，导电糊从有机多孔基材的表面突出出来。结果，在层压之后导电物质的填充量增加，因此连接电阻显着降低。

2. 发明授权

US5972482A Printed circuit board and method of manufacturing the same 失效
标题翻译：印刷电路板及其制造方法
公开(公告)号：US5972482A
公开(公告)日：1999-10-26
申请号：US740261
申请日：1996-10-25
申请人： Akihito Hatakeyama , Seiichi Nakatani , Kouji Kawakita , Hiroshi Sogou , Tatsuo Ogawa , Tamao Kojima
发明人： Akihito Hatakeyama , Seiichi Nakatani , Kouji Kawakita , Hiroshi Sogou , Tatsuo Ogawa , Tamao Kojima
IPC分类号： H05K1/03 , H05K3/40 , H05K3/46 , B32B9/00
CPC分类号： H05K3/462 , H05K3/4069 , H05K1/0366 , H05K2201/0116 , H05K2201/0154 , H05K2201/0278 , H05K2201/0355 , H05K2201/10378 , H05K2201/2072 , H05K2203/0191 , H05K2203/1461 , H05K3/4614 , H05K3/4652 , Y10S428/901 , Y10T29/49126 , Y10T29/49155 , Y10T428/24917 , Y10T428/249953 , Y10T428/249996
摘要： A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.
摘要翻译：印刷电路板包括具有封闭空隙的未固化衬底材料，所述未固化衬底材料设置有通孔。当形成通孔时，存在于基板材料中的空隙从通孔的内壁开口形成中空形部分。通过用导电膏填充通孔和中空形部分，通过导电膏和通孔的壁表面之间的保持效果增加，粘附性得到改善。

3. 发明授权

US06326694B1 Printed circuit board 有权
标题翻译：印刷电路板
公开(公告)号：US06326694B1
公开(公告)日：2001-12-04
申请号：US09337407
申请日：1999-06-21
申请人： Akihito Hatakeyama , Seiichi Nakatani , Kouji Kawakita , Hiroshi Sogou , Tatsuo Ogawa , Tamao Kojima
发明人： Akihito Hatakeyama , Seiichi Nakatani , Kouji Kawakita , Hiroshi Sogou , Tatsuo Ogawa , Tamao Kojima
IPC分类号： H01L2348
CPC分类号： H05K3/462 , H05K1/0366 , H05K3/4069 , H05K3/4614 , H05K3/4652 , H05K2201/0116 , H05K2201/0154 , H05K2201/0278 , H05K2201/0355 , H05K2201/10378 , H05K2201/2072 , H05K2203/0191 , H05K2203/1461 , Y10S428/901 , Y10T29/49126 , Y10T29/49155 , Y10T428/24917 , Y10T428/249953 , Y10T428/249996
摘要： A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.
摘要翻译：印刷电路板包括具有封闭空隙的未固化衬底材料，所述未固化衬底材料设置有通孔。当形成通孔时，存在于基板材料中的空隙从通孔的内壁开口形成中空形部分。通过用导电膏填充通孔和中空形部分，通过导电膏和通孔的壁表面之间的保持效果增加，粘附性得到改善。

4. 发明授权

US06211487B1 Printed circuit board and method of manufacturing the same 有权
公开(公告)号：US06211487B1
公开(公告)日：2001-04-03
申请号：US09379008
申请日：1999-08-23
申请人： Akihito Hatakeyama , Seiichi Nakatani , Kouji Kawakita , Hiroshi Sogou , Tatsuo Ogawa , Tamao Kojima
发明人： Akihito Hatakeyama , Seiichi Nakatani , Kouji Kawakita , Hiroshi Sogou , Tatsuo Ogawa , Tamao Kojima
IPC分类号： H05K336
CPC分类号： H05K3/462 , H05K1/0366 , H05K3/4069 , H05K3/4614 , H05K3/4652 , H05K2201/0116 , H05K2201/0154 , H05K2201/0278 , H05K2201/0355 , H05K2201/10378 , H05K2201/2072 , H05K2203/0191 , H05K2203/1461 , Y10S428/901 , Y10T29/49126 , Y10T29/49155 , Y10T428/24917 , Y10T428/249953 , Y10T428/249996
摘要： A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.

5. 发明授权

US5484647A Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same 失效
标题翻译：电路基板的连接部件和使用该电路基板的多层电路基板的制造方法
公开(公告)号：US5484647A
公开(公告)日：1996-01-16
申请号：US308982
申请日：1994-09-20
申请人： Seiichi Nakatani , Akihito Hatakeyama , Kouji Kawakita , Hirishi Sogou , Tatsuo Ogawa , Tamao Kojima
发明人： Seiichi Nakatani , Akihito Hatakeyama , Kouji Kawakita , Hirishi Sogou , Tatsuo Ogawa , Tamao Kojima
IPC分类号： H05K3/40 , H05K3/42 , H05K3/46 , B32B9/00
CPC分类号： H05K3/462 , H01R12/523 , H05K3/4069 , H05K2201/0116 , H05K2201/0355 , H05K2201/09536 , H05K2201/10378 , H05K2203/0191 , H05K2203/1461 , H05K3/4623 , H05K3/4652 , Y10S428/901 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T428/24273 , Y10T428/24322 , Y10T428/24917 , Y10T428/249994 , Y10T428/249996 , Y10T442/2475 , Y10T442/674
摘要： A connecting member of circuit substrates includes an organic porous base material provided with tackfree films on both sides, through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films. This structure enables inner-via-hole connection and can therefore attain a connecting member of circuit substrates and an electrical connector of high reliability and high quality.By using a connecting member of circuit substrates including the organic porous base material provided with tackfree films on both sides and through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films, it is possible to form a high-multilayer substrate easily from double sided boards or four-layer substrates which can be manufactured rather stably. In addition to that, since the conductive paste is filled up to the surface of the tackfree films, the conductive paste sticks out from the surface of the organic porous base material when the tackfree-films are separated. As a result, the filled amount of the conductive substance increases after the lamination, and thus, the connection resistance is reduced considerably.
摘要翻译：电路基板的连接构件包括在两侧设置有无粘性薄膜的有机多孔基材，设置在要求位置的通孔，其填充有导电树脂组合物直到无粘膜的表面。这种结构能够实现内通孔连接，从而可以获得电路基板的连接构件和高可靠性和高质量的电连接器。通过使用包括在两侧设置有无粘膜的有机多孔基材的电路基板的连接构件以及设置在导电性树脂组合物的要求位置处的通孔，直到无粘膜的表面，可以形成来自可以制造得相当稳定的双面板或四层基板的高多层基板。除此之外，由于导电膏被填充到无粘性膜的表面，所以当无粘膜分离时，导电糊从有机多孔基材的表面突出出来。结果，在层压之后导电物质的填充量增加，因此连接电阻显着降低。

6. 发明授权

US6096411A Conductive paste composition for via hole filling and printed circuit board using the same 失效
标题翻译：用于通孔填充的导电糊组合物和使用其的印刷电路板
公开(公告)号：US6096411A
公开(公告)日：2000-08-01
申请号：US38625
申请日：1998-03-12
申请人： Seiichi Nakatani , Kouji Kawakita , Tatsuo Ogawa
发明人： Seiichi Nakatani , Kouji Kawakita , Tatsuo Ogawa
IPC分类号： C08K3/00 , C08K3/08 , C08L63/00 , H05K1/09 , H05K3/40 , H05K3/46 , B32B3/00
CPC分类号： H05K3/4069 , C08K3/08 , H05K1/095 , C08K2003/085 , H05K2201/0355 , H05K2203/1461 , H05K3/4652 , Y10S428/901 , Y10T428/24917
摘要： The invention related to a paste for via hole filling which enables inner via hole connection between electrode layers without employing through hole plating techniques, and a multi-layered printed circuit board using the same. The conductive paste composition of the invention comprises a) 70-90 wt % of copper particles of an average particle size of 0.5-8 .mu.m; b) 0.5-15 wt % of insulating particles of an average particle size of 8-20 .mu.m; and, c) 6-17 wt % of heat setting type liquid epoxy resin, in order to exhibit low viscosity and low volatility. The conductive paste is printed and filled into through holes passing through a laminated substrate which is provide with copper foils on both sides thereof, to form a printed circuit board in which the via holes are electrically connected after thermosetting. By adding insulating particles of large particle size, the amount of copper particles to be added is decreased so that a via hole connection of low specific resistance and high reliability is obtained, and improvements in a decrease of viscosity and continuous printability of the paste itself can be achieved.
摘要翻译：本发明涉及一种用于通孔填充的糊剂，其能够在不使用通孔电镀技术的情况下实现电极层之间的内部通孔连接，以及使用该糊状物的多层印刷电路板。本发明的导电糊组合物包含a）70-90重量％的平均粒径为0.5-8μm的铜颗粒; b）0.5-15重量％的平均粒径为8-20μm的绝缘颗粒; 和c）6-17重量％的热固定型液体环氧树脂，以显示低粘度和低挥发性。将导电性糊料印刷填充到通过其两侧设置有铜箔的层叠基板的通孔中，形成印刷电路基板，其中通孔在热固化后电连接。通过添加大粒径的绝缘粒子，可以减少添加的铜粒子的量，从而获得低电阻率和高可靠性的通孔连接，并且可以提高糊剂本身的粘度和连续印刷性的降低实现。

7. 发明授权

US5977490A Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same 失效
标题翻译：用于通孔填充的导电浆料化合物，使用导电浆料的印刷电路板及其制造方法
公开(公告)号：US5977490A
公开(公告)日：1999-11-02
申请号：US780329
申请日：1997-01-08
申请人： Kouji Kawakita , Seiichi Nakatani , Tatsuo Ogawa , Masatoshi Suehiro , Kouichi Iwaisako , Hideo Akiyama
发明人： Kouji Kawakita , Seiichi Nakatani , Tatsuo Ogawa , Masatoshi Suehiro , Kouichi Iwaisako , Hideo Akiyama
IPC分类号： H01B1/22 , H05K1/09 , H05K3/40 , H05K3/46 , H05K1/11 , C08K3/08
CPC分类号： H05K1/095 , H01B1/22 , H05K3/4069 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29399 , H01L2924/01079 , H05K2201/0355 , H05K2201/10378 , H05K2203/1461 , H05K3/4614 , H05K3/462 , H05K3/4623 , H05K3/4652 , Y10S428/901 , Y10T428/24917 , Y10T428/25
摘要： A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 .mu.m and specific surface of from 0.1 to 1.5 m.sup.2 /g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique.The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate. Then, this substrate is heated and pressurized together with copper foil on both sides to attain a printed circuit board where both sides are electrically inner-via-hole connected.
摘要翻译：用于通孔填充的导电糊剂化合物包括平均粒度为0.5至20μm，比表面积为0.1至1.5m 2 / g的80至92重量％的导电填料，4.5至20的液体环氧树脂含有2个以上环氧树脂的室温粘度为15Pa·sec以下的固化剂和0.5〜5重量％的固化剂，其中粘度为2,000Pa·s以下，挥发量为2.0重量％以下。提供了一种填充膏和使用它们的印刷电路板，其可以在不使用通孔电镀技术的情况下进行电极层之间的内部通孔连接。导电糊料包括金属颗粒如铜，环氧树脂，硬化剂，如果需要，可以使用分散剂。使用在高剪切下具有低粘度和低挥发性的糊料来填充设置在层压基板中的孔。然后，将该基板与铜箔一起加热和加压两侧，以获得印刷电路板，其中两侧电连通内部通孔。

8. 发明授权

US5733467A Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same 失效
标题翻译：用于通孔填充的导电浆料化合物，使用导电浆料的印刷电路板及其制造方法
公开(公告)号：US5733467A
公开(公告)日：1998-03-31
申请号：US814026
申请日：1997-03-10
申请人： Kouji Kawakita , Seiichi Nakatani , Tatsuo Ogawa , Masatoshi Suehiro , Kouichi Iwaisako , Hideo Akiyama
发明人： Kouji Kawakita , Seiichi Nakatani , Tatsuo Ogawa , Masatoshi Suehiro , Kouichi Iwaisako , Hideo Akiyama
IPC分类号： H01B1/22 , H05K1/09 , H05K3/40 , H05K3/46 , B44C1/22 , C23F1/00
CPC分类号： H05K1/095 , H01B1/22 , H05K3/4069 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29399 , H01L2924/01079 , H05K2201/0355 , H05K2201/10378 , H05K2203/1461 , H05K3/4614 , H05K3/462 , H05K3/4623 , H05K3/4652 , Y10S428/901 , Y10T428/24917 , Y10T428/25
摘要： A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 .mu.m and specific surface of from 0.1 to 1.5 m.sup.2 / g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique. The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate. Then, this substrate is heated and pressurized together with copper foil on both sides to attain a printed circuit board where both sides are electrically inner-via-hole connected.
摘要翻译：用于通孔填充的导电糊剂化合物包括平均粒度为0.5至20μm，比表面积为0.1至1.5m 2 / g的80至92重量％的导电填料，4.5至20的液体环氧树脂含有2个以上环氧树脂的室温粘度为15Pa·sec以下的固化剂和0.5〜5重量％的固化剂，其中粘度为2,000Pa·s以下，挥发量为2.0重量％以下。提供了一种填充膏和使用它们的印刷电路板，其可以在不使用通孔电镀技术的情况下进行电极层之间的内部通孔连接。导电糊料包括金属颗粒如铜，环氧树脂，硬化剂，如果需要，可以使用分散剂。使用在高剪切下具有低粘度和低挥发性的糊料来填充设置在层压基板中的孔。然后，将该基板与铜箔一起加热和加压两侧，以获得印刷电路板，其中两侧电连通内部通孔。

9. 发明授权

US5914358A Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same 失效
标题翻译：用于通孔填充的导电浆料化合物，使用导电浆料的印刷电路板及其制造方法
公开(公告)号：US5914358A
公开(公告)日：1999-06-22
申请号：US649189
申请日：1996-05-17
申请人： Kouji Kawakita , Seiichi Nakatani , Tatsuo Ogawa , Masatoshi Suehiro , Kouichi Iwaisako , Hideo Akiyama
发明人： Kouji Kawakita , Seiichi Nakatani , Tatsuo Ogawa , Masatoshi Suehiro , Kouichi Iwaisako , Hideo Akiyama
IPC分类号： H01B1/22 , H05K1/09 , H05K3/40 , H05K3/46 , C08K3/08 , C08L63/00
CPC分类号： H05K1/095 , H01B1/22 , H05K3/4069 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29399 , H01L2924/01079 , H05K2201/0355 , H05K2201/10378 , H05K2203/1461 , H05K3/4614 , H05K3/462 , H05K3/4623 , H05K3/4652 , Y10S428/901 , Y10T428/24917 , Y10T428/25
摘要： A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 .mu.m and specific surface of from 0.1 to 1.5 m.sup.2 /g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.multidot.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.multidot.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique.The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate. Then, this substrate is heated and pressurized together with copper foil on both sides to attain a printed circuit board where both sides are electrically inner-via-hole connected.
摘要翻译：用于通孔填充的导电糊剂化合物包括平均粒度为0.5至20μm，比表面积为0.1至1.5m 2 / g的80至92重量％的导电填料，4.5至20的液体环氧树脂含有2个以上环氧树脂的室温粘度为15Pa·s以下的固化剂和0.5〜5重量％的固化剂，其中粘度为2,000帕秒以下，挥发量为2.0重量％以下。提供了一种填充膏和使用它们的印刷电路板，其可以在不使用通孔电镀技术的情况下进行电极层之间的内部通孔连接。导电糊料包括金属颗粒如铜，环氧树脂，硬化剂，如果需要，可以使用分散剂。使用在高剪切下具有低粘度和低挥发性的糊料来填充设置在层压基板中的孔。然后，将该基板与铜箔一起加热和加压两侧，以获得印刷电路板，其中两侧电连通内部通孔。

10. 发明授权

US5652042A Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste 失效
标题翻译：用于通孔填充的导电浆料化合物，使用导电浆料的印刷电路板
公开(公告)号：US5652042A
公开(公告)日：1997-07-29
申请号：US330733
申请日：1994-10-28
申请人： Kouji Kawakita , Seiichi Nakatani , Tatsuo Ogawa , Masatoshi Suehiro , Kouichi Iwaisako , Hideo Akiyama
发明人： Kouji Kawakita , Seiichi Nakatani , Tatsuo Ogawa , Masatoshi Suehiro , Kouichi Iwaisako , Hideo Akiyama
IPC分类号： H01B1/22 , H05K1/09 , H05K3/40 , H05K3/46 , B32B9/00
CPC分类号： H05K1/095 , H01B1/22 , H05K3/4069 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29399 , H01L2924/01079 , H05K2201/0355 , H05K2201/10378 , H05K2203/1461 , H05K3/4614 , H05K3/462 , H05K3/4623 , H05K3/4652 , Y10S428/901 , Y10T428/24917 , Y10T428/25
摘要： A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 .mu.m and specific surface of from 0.1 to 1.5 m.sup.2 /g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.multidot.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.multidot.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique.The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate. Then, this substrate is heated and pressurized together with copper foil on both sides to attain a printed circuit board where both sides are electrically inner-via-hole connected.
摘要翻译：用于通孔填充的导电糊剂化合物包括平均粒度为0.5至20μm，比表面积为0.1至1.5m 2 / g的80至92重量％的导电填料，4.5至20的液体环氧树脂含有2个以上环氧树脂的室温粘度为15Pa·s以下的固化剂和0.5〜5重量％的固化剂，其中粘度为2,000帕秒以下，挥发量为2.0重量％以下。提供了一种填充膏和使用它们的印刷电路板，其可以在不使用通孔电镀技术的情况下进行电极层之间的内部通孔连接。导电糊料包括金属颗粒如铜，环氧树脂，硬化剂，如果需要，可以使用分散剂。使用在高剪切下具有低粘度和低挥发性的糊料来填充设置在层压基板中的孔。然后，将该基板与铜箔一起加热和加压两侧，以获得印刷电路板，其中两侧电连通内部通孔。

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