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1. 发明授权

US5403558A Heat and fatigue resistant metallic carrier for automobile exhaust gas-purifying catalyst 失效
标题翻译：用于汽车废气净化催化剂的耐热疲劳金属载体
公开(公告)号：US5403558A
公开(公告)日：1995-04-04
申请号：US86376
申请日：1993-07-06
申请人： Takuo Kono , Mikio Yamanaka , Takashi Tanaka , Yasushi Ishikawa , Yutaka Sadano , Masao Yashiro , Tatuo Sugiura , Tadanobu Komai , Shinichi Matsumoto , Toshihiro Takada , Shinji Shibata , Hikaru Aoyagi , Masaaki Ohashi , Yoshio Nishizawa , Akihiko Kasahara
发明人： Takuo Kono , Mikio Yamanaka , Takashi Tanaka , Yasushi Ishikawa , Yutaka Sadano , Masao Yashiro , Tatuo Sugiura , Tadanobu Komai , Shinichi Matsumoto , Toshihiro Takada , Shinji Shibata , Hikaru Aoyagi , Masaaki Ohashi , Yoshio Nishizawa , Akihiko Kasahara
IPC分类号： B01J35/04 , F01N3/28 , F01N3/15
CPC分类号： F01N3/2853 , B01J35/04 , F01N3/281 , F01N2330/02 , F01N2330/322 , F01N2330/324 , F01N2350/04 , Y10S55/30
摘要： A metallic carrier composed of an end face portion formed in at least one of the axial end portions of a honeycomb body and an outer circumferential reinforcing layer in which foils in a range from the outermost layer to a quarter of the total number of layers are joined together in the axial intermediate portion. Thus, the metallic carrier is flexible in expansion and shrinkage. Further, the honeycomb body and a jacket are joined to each other mainly at the outer circumference of the outer circumferential reinforcing layer of the honeycomb body, to reduce thermal stress developed between the honeycomb body and jacket while maintaining the strength against a high temperature, to thereby prevent the metallic carrier from being ruptured.
摘要翻译：由形成在蜂窝体的轴向端部中的至少一个端面部的端面部和外周增强层构成的金属载体，其中从最外层到总层数的四分之一的范围内的箔被接合一起在轴向中间部分。因此，金属载体在膨胀和收缩方面是柔性的。此外，蜂窝体和护套主要在蜂窝体的外周增强层的外周彼此接合，以降低在蜂窝体和护套之间产生的热应力，同时保持对高温的强度，从而防止金属载体破裂。

2. 再颁专利

USRE35063E Method of soldering honeycomb body 失效
标题翻译：蜂窝体焊接方法
公开(公告)号：USRE35063E
公开(公告)日：1995-10-17
申请号：US188448
申请日：1994-01-21
申请人： Yutaka Sadano , Yuuji Nakashima , Takashi Tanaka , Takatoshi Kawasaki , Shinji Shibata , Hikaru Aoyagi , Yoshio Nishizawa , Akihiko Kasahara
发明人： Yutaka Sadano , Yuuji Nakashima , Takashi Tanaka , Takatoshi Kawasaki , Shinji Shibata , Hikaru Aoyagi , Yoshio Nishizawa , Akihiko Kasahara
IPC分类号： B23K1/00 , B23P13/00
CPC分类号： B23K1/0014
摘要： When soldering a honeycomb body formed by alternately piling flat foils (plates) and corrugated foils (plates), a binder liquid is sucked up from the end face of tile honeycomb body to form a binder streak in a space defined by contacting portions of the flat foil (plate) and corrugated foil (plate), a solder is scattered and applied onto the binder streak, and the honeycomb body is then dried and heated to effect a soldering of the honeycomb body. According to this method, soldering can be accomplished only in the vicinity of the contacting portions of the flat foil (plate) and corrugated foil (plate), with a desired soldering structure.
摘要翻译：当焊接通过交替打桩扁平箔（板）和波纹箔（板）形成的蜂窝体时，粘合剂液体从瓷砖蜂窝体的端面被吸起，以在平坦部分接触限定的空间中形成粘合剂条纹箔（板）和波纹箔（板），焊料被散射并施加到粘合剂条纹上，然后将蜂窝体干燥并加热以实现蜂窝体的焊接。根据该方法，只能在平板（板）和波纹箔（板）的接触部分附近具有期望的焊接结构。

3. 发明授权

US5082167A Method of soldering honeycomb body 失效
标题翻译：蜂窝体焊接方法
公开(公告)号：US5082167A
公开(公告)日：1992-01-21
申请号：US583331
申请日：1990-09-17
申请人： Yutaka Sadano , Yuuji Nakashima , Takashi Tanaka , Takatoshi Kawasaki , Shinji Shibata , Hikaru Aoyagi , Yoshio Nishizawa , Akihiko Kasahara
发明人： Yutaka Sadano , Yuuji Nakashima , Takashi Tanaka , Takatoshi Kawasaki , Shinji Shibata , Hikaru Aoyagi , Yoshio Nishizawa , Akihiko Kasahara
IPC分类号： B23K1/00
CPC分类号： B23K1/0014
摘要： When soldering a honeycomb body formed by alternately piling flat foils (plates) and corrugated foils (plates), a binder liquid is sucked up from the end face of the honeycomb body to form a binder streak in a space defined by contacting portions of the flat foil (plate) and corrugated foil (plate), a solder is scattered and applied onto the binder streak, and the honeycomb body is then dried and heated to effect a soldering of the honeycomb body. According to this method, soldering can be accomplished only in the vicinity of the contacting portions of the flat foil (plate) and corrugated foil (plate), with a desired soldering structure.
摘要翻译：当焊接通过交替打桩扁平箔（板）和波纹箔（板）形成的蜂窝体时，粘合剂液体从蜂窝体的端面被吸出，以在由平坦部分接触的部分限定的空间中形成粘合剂条纹箔（板）和波纹箔（板），焊料被散射并施加到粘合剂条纹上，然后将蜂窝体干燥并加热以实现蜂窝体的焊接。根据该方法，只能在平板（板）和波纹箔（板）的接触部分附近具有期望的焊接结构。

4. 发明授权

US5304351A Semi-oval shaped carrier having excellent thermal stress resistance and thermal fatigue resistance for automobile exhaust gas-purifying catalyst 失效
标题翻译：具有优异的耐热应力和汽车废气净化催化剂的耐热疲劳性的半椭圆形载体
公开(公告)号：US5304351A
公开(公告)日：1994-04-19
申请号：US790497
申请日：1991-11-12
申请人： Takashi Tanaka , Mikio Yamanaka , Yutaka Sadano , Kouki Yotsuya , Yasushi Ishikawa , Toshihiro Takada
发明人： Takashi Tanaka , Mikio Yamanaka , Yutaka Sadano , Kouki Yotsuya , Yasushi Ishikawa , Toshihiro Takada
IPC分类号： B01D53/86 , B01J35/04 , F01N3/28 , F01N3/15
CPC分类号： B01J35/04 , F01N3/281 , F01N3/2842 , F01N2330/02 , F01N2450/02 , F01N2450/22 , Y10T428/24149
摘要： A semi-oval shaped metallic carrier having an excellent thermal stress resistance and thermal fatigue resistance and used for an automobile exhaust gas-purifying catalyst, in which the carrier is composed of a metallic honeycomb body constituted by superimposing flat metal foils and corrugated metal foils one on the other and winding them together, and a metallic jacket enclosing the lateral face of the honeycomb body, the transverse section of the metallic carrier constituting the parallel portions and semi-circular arc portions and the honeycomb body is joined to the jacket mainly at the semi-circular arc portions or at the parallel portions of the honeycomb body.
摘要翻译：一种具有优异的耐热应力和耐热疲劳性的半椭圆形金属载体，用于汽车废气净化催化剂，其中载体由金属蜂窝体组成，该金属蜂窝体由叠置平板金属箔和波纹金属箔构成，一个另一方面将它们缠绕在一起，并且包围蜂窝体的侧面的金属护套，构成平行部分和半圆弧部分的金属载体的横截面和蜂窝体主要在半圆弧部分或蜂窝体的平行部分。

5. 发明授权

US09421569B2 Plating apparatus, plating method and storage medium 有权
标题翻译：电镀装置，电镀方法和储存介质
公开(公告)号：US09421569B2
公开(公告)日：2016-08-23
申请号：US13981124
申请日：2012-01-13
申请人： Takashi Tanaka , Yusuke Saito , Mitsuaki Iwashita , Takayuki Toshima
发明人： Takashi Tanaka , Yusuke Saito , Mitsuaki Iwashita , Takayuki Toshima
IPC分类号： B05C5/00 , B05C9/14 , H01L21/3205 , B05B7/16 , C23C18/16 , H01L21/288 , B05D1/02 , C25D17/00 , H01L21/67 , G03F7/16
CPC分类号： B05C5/001 , B05D1/02 , C23C18/1614 , C23C18/1619 , C23C18/1676 , C23C18/168 , C25D17/001 , G03F7/162 , H01L21/288 , H01L21/67017
摘要： A plating apparatus includes a substrate holding/rotating device that holds/rotates a substrate; and a plating liquid supplying device that supplies a plating liquid onto the substrate. The plating liquid supplying device includes a supply tank that stores the plating liquid; a discharge nozzle that discharges the plating liquid onto the substrate; and a plating liquid supplying line through which the plating liquid of the supply tank is supplied into the discharge nozzle. Further, a first heating device is provided at either one of the supply tank and the plating liquid supplying line of the plating liquid supplying device, and heats the plating liquid to a first temperature. Furthermore, a second heating device is provided at the plating liquid supplying line between the first heating device and the discharge nozzle, and heats the plating liquid to a second temperature equal to or higher than the first temperature.
摘要翻译：电镀装置包括：保持/旋转基板的基板保持/旋转装置; 以及将电镀液体供给到基板上的电镀液供给装置。电镀液供给装置包括：储存电镀液的供给槽; 排出喷嘴，其将所述电镀液体排出到所述基板上; 以及电镀液体供给管路，供给槽的镀液通过该供给线供给到排出喷嘴。此外，第一加热装置设置在电镀液供给装置的供给罐和电镀液供给管线中的任一个处，并将电镀液加热至第一温度。此外，在第一加热装置和排出喷嘴之间的电镀液供给管线处设置第二加热装置，并将镀液加热到等于或高于第一温度的第二温度。

6. 发明授权

US09236212B2 Tungsten wire, cathode heater and vibration service lamp filament 有权
标题翻译：钨丝，阴极加热器和振动服务灯丝
公开(公告)号：US09236212B2
公开(公告)日：2016-01-12
申请号：US13471733
申请日：2012-05-15
申请人： Takashi Tanaka , Motohisa Sakai , Yasuhiko Nakano , Kan Suganomata , Motoaki Esaki , Kayo Nakano
发明人： Takashi Tanaka , Motohisa Sakai , Yasuhiko Nakano , Kan Suganomata , Motoaki Esaki , Kayo Nakano
IPC分类号： C22F1/18 , H01J1/146 , B21C1/00 , B21C37/04 , B22F5/12 , C22C1/04 , C22C27/04 , H01J1/14 , H01J1/22 , H01J9/04 , H01J9/08 , H01K1/02 , H01K3/02 , B21B1/18 , B21B15/00 , B21B3/00
CPC分类号： H01J1/146 , B21B1/18 , B21B15/0035 , B21B2003/006 , B21B2015/0028 , B21C1/003 , B21C37/045 , B22F5/12 , B22F2998/10 , C22C1/045 , C22C27/04 , H01J1/14 , H01J1/22 , H01J9/04 , H01J9/08 , H01J2201/2889 , H01K1/02 , H01K3/02 , B22F3/10 , B22F3/18 , B22F3/17 , B22F3/20
摘要： One embodiment provides a tungsten wire containing 1 to 10% by mass of rhenium, the wire having a point indicating a 2% elongation within a quadrangle formed by joining points with straight lines, where the values of x and y are point (20, 75), point (20, 87), point (90, 75), and point (90, 58), in this order; wherein the wire diameter of the tungsten wire is represented by x μm, and the elongation of the tungsten wire is 2% after electrically heating with an electrical current which is a ratio of y % to the fusion current (FC) at the wire diameter x μm, and wherein a semi-logarithmic system of coordinates is expressed by a horizontal axis using a logarithmic scale of the wire diameter x and a vertical axis using a normal scale of ratio y to the fusion current.
摘要翻译：一个实施方案提供了含有1〜10质量％的铼的钨丝，该丝具有通过连接点与直线形成的四边形内的2％伸长率的点，其中x和y的值为点（20,75 ），点（20,87），点（90,75）和点（90,58）; 其中钨丝的线直径由x m表示，并且在电加热后，钨线的伸长率为2％，电流是电线直径x上的y％与熔化电流（FC）的比值并且其中使用线径x的对数刻度和使用与融合电流的比率y的正常刻度的垂直轴由水平轴表示坐标的半对数坐标系。

7. 发明授权

US08866183B2 LED module 有权
标题翻译： LED模块
公开(公告)号：US08866183B2
公开(公告)日：2014-10-21
申请号：US13822454
申请日：2011-09-26
申请人： Sachio Higuchi , Takashi Tanaka , Mitunori Mizoguti , Tsuyoshi Inui , Atsuo Fukuda
发明人： Sachio Higuchi , Takashi Tanaka , Mitunori Mizoguti , Tsuyoshi Inui , Atsuo Fukuda
IPC分类号： H01L33/00 , H01L33/64 , H01L33/48 , H01L33/62
CPC分类号： H01L33/64 , H01L24/48 , H01L25/167 , H01L33/486 , H01L33/62 , H01L33/642 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/12035 , H01L2924/12041 , H01L2924/15156 , H01L2924/181 , H01L2224/48091 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An LED module includes: a package having electrodes provided on the outer surface of opposing sidewalls, and a light-emitting element connected to the electrodes and mounted on the package; a base member having a copper metal; an insulating layer stacked on the surface of the base member and having an insulating material; and a conductive wiring pattern connected to the electrodes by soldering and formed on the surface of the insulating layer. The insulating layer has a through-hole formed by removing a part of the section where the package is positioned, and a heat dissipation unit formed by soldering between the back surface of the package and the base member, which face one another with the through-hole interposed therebetween.
摘要翻译： LED模块包括：具有设置在相对侧壁的外表面上的电极的封装和连接到电极并安装在封装上的发光元件; 具有铜金属的基底构件; 绝缘层，堆叠在所述基底构件的表面上并具有绝缘材料; 以及通过焊接连接到电极并形成在绝缘层的表面上的导电布线图案。所述绝缘层具有通过去除所述封装所位于的部分的一部分而形成的通孔，以及通过在所述封装的背面与所述基部构件之间焊接而形成的通孔，孔之间。

8. 发明申请

US20140302242A1 PLATING APPARATUS, PLATING METHOD AND STORAGE MEDIUM HAVING PLATING PROGRAM STORED THEREON 有权
标题翻译：电镀设备，存放方法及其储存介质
公开(公告)号：US20140302242A1
公开(公告)日：2014-10-09
申请号：US13881431
申请日：2011-08-24
申请人： Takashi Tanaka , Yusuke Saito , Mitsuaki Iwashita , Takayuki Toshima
发明人： Takashi Tanaka , Yusuke Saito , Mitsuaki Iwashita , Takayuki Toshima
IPC分类号： B05B12/14 , B05D1/02 , B05D7/00 , B05B12/04
CPC分类号： B05D7/50 , B05B12/04 , B05B12/14 , B05D1/02 , C23C18/1632 , C23C18/1651 , C23C18/31 , C23C18/54 , C25D17/001
摘要： A plating apparatus 1 can perform plating processes by supplying plating liquids onto a surface of a substrate 2. The plating apparatus 1 includes a substrate rotating holder configured to hold and rotate the substrate 2; plating liquid supply units 29 and 30 configured to supply different kinds of plating liquids onto the surface of the substrate 2; a plating liquid drain unit 31 configured to drain out the plating liquids dispersed from the substrate 2 depending on the kinds of the plating liquids; and a controller 32 configured to control the substrate rotating holder 25, the plating liquid supply units 29 and 30, the plating liquid drain unit 31. While the substrate 2 is held and rotated, the plating processes are performed on the surface of the substrate 2 in sequence by supplying the different kinds of the plating liquids onto the surface of the substrate 2.
摘要翻译：电镀装置1可以通过将电镀液供给到基板2的表面来进行电镀处理。电镀装置1包括：基板旋转保持器，其构造成保持和旋转基板2; 电镀液供给单元29,30，被配置为向基板2的表面供给不同种类的电镀液; 电镀液排出单元31，其被配置为根据电镀液的种类排出从基板2分散的镀液; 以及控制器32，被配置为控制基板旋转保持器25，电镀液供给单元29和30，电镀液排出单元31.在保持基板2并旋转的同时，在基板2的表面上进行电镀处理依次通过将不同种类的电镀液体供给到基板2的表面上。

9. 发明授权

US08770138B2 Semiconductor manufacturing apparatus and semiconductor manufacturing method 有权
标题翻译：半导体制造装置及半导体制造方法
公开(公告)号：US08770138B2
公开(公告)日：2014-07-08
申请号：US13180702
申请日：2011-07-12
申请人： Kenichi Hara , Mitsuaki Iwashita , Takashi Tanaka , Takayuki Toshima , Takehiko Orii
发明人： Kenichi Hara , Mitsuaki Iwashita , Takashi Tanaka , Takayuki Toshima , Takehiko Orii
IPC分类号： B05C11/10 , B05B13/02 , B05B3/00
CPC分类号： H01L21/288 , C23C18/1628 , H01L21/76849
摘要： A plated film having a uniform film thickness is formed on a surface of a substrate. A semiconductor manufacturing apparatus includes: a holding mechanism for holding a substrate rotatably; a nozzle for supplying a processing solution for performing a plating process on a processing target surface of the substrate; a substrate rotating mechanism for rotating the substrate held by the holding mechanism in a direction along the processing target surface; a nozzle driving mechanism for moving the nozzle in a direction along the processing target surface at a position facing the processing target surface of the substrate held by the holding mechanism; and a control unit for controlling the supply of the processing solution by the nozzle and the movement of the nozzle by the nozzle driving mechanism.
摘要翻译：在基板的表面上形成具有均匀膜厚的镀膜。半导体制造装置包括：可旋转地保持基板的保持机构; 用于向所述基板的处理目标表面供给用于进行电镀处理的处理液的喷嘴; 基板旋转机构，用于沿着所述处理对象表面的方向旋转由所述保持机构保持的所述基板; 喷嘴驱动机构，用于沿着与所述保持机构保持的所述基板的处理对象面对置的位置沿着所述处理对象面的方向移动所述喷嘴; 以及控制单元，用于控制由喷嘴供应处理溶液和通过喷嘴驱动机构移动喷嘴。

10. 发明申请

US20140148006A1 LIQUID TREATMENT APPARATUS AND LIQUID TREATMENT METHOD 有权
标题翻译：液体处理装置和液体处理方法
公开(公告)号：US20140148006A1
公开(公告)日：2014-05-29
申请号：US13879175
申请日：2011-08-31
申请人： Takashi Tanaka , Yusuke Saito , Mitsuaki Iwashita
发明人： Takashi Tanaka , Yusuke Saito , Mitsuaki Iwashita
IPC分类号： H01L21/67 , H01L21/288
CPC分类号： H01L21/6723 , C23C18/1619 , C23C18/1653 , C23C18/1675 , C23C18/1676 , C23C18/168 , C23C18/50 , H01L21/288
摘要： A liquid treatment apparatus of continuously performing a plating process on multiple substrates includes a temperature controlling container for accommodating a plating liquid; a temperature controller for controlling a temperature of the plating liquid in the temperature controlling container; a holding unit for holding the substrates one by one at a preset position; a nozzle having a supply hole through which the temperature-controlled plating liquid in the temperature controlling container is discharged to a processing surface of the substrate; a pushing unit for pushing the temperature-controlled plating liquid in the temperature controlling container toward the supply hole of the nozzle; and a supply control unit for controlling a timing when the plating liquid is pushed by the pushing unit. The temperature controller controls the temperature of the plating liquid in the temperature controlling container based on the timing when the plating liquid is pushed by the pushing unit.
摘要翻译：在多个基板上连续进行电镀处理的液体处理装置包括：容纳电镀液的温度控制容器; 温度控制器，用于控制温度控制容器中的电镀液的温度; 保持单元，用于将预定位置一个接一个地保持; 具有供给孔的喷嘴，所述温度控制容器中的所述温度控制电镀液通过所述供给孔排出到所述基板的处理面; 推压单元，用于将温度控制容器中的温度控制电镀液朝向喷嘴的供给孔推动; 以及供应控制单元，用于控制当推动单元推动电镀液体时的定时。温度控制器基于由推动单元推动电镀液的时机，控制温度控制容器中的电镀液的温度。

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