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    • 5. 发明授权
    • Multi-layer laminate molding
    • 多层层压成型
    • US5902655A
    • 1999-05-11
    • US754945
    • 1996-11-25
    • Masami MatsuokaHikaru AoyagiKazuaki NaitoKatsunori Saito
    • Masami MatsuokaHikaru AoyagiKazuaki NaitoKatsunori Saito
    • B32B7/12B32B27/32B65D65/40B29D22/00
    • B32B27/32B32B7/12Y10T428/1334Y10T428/1352Y10T428/2495
    • There is disclosed a multi-layer laminate molding having a layer structure that a main material layer made mainly of a polyethylenic resin at the outer side and an ethylene-vinyl acetate copolymer saponified product layer or polyamide resin layer at the inner side are laminated through at least an adhesive material layer, the adhesive material layer comprising a resin composition containing (A) 60 to 95% by weight of at least one resin selected from the-group consisting of (1) a high density polyethylenic resin having specified physical properties, (2) a linear low density polyethylenic resin having specified physical properties, (3) a modified high density polyethylenic resin obtained by grafting unsaturated carboxylic acid and the like onto the above (1), and (4) a modified linear low density polyethylenic resin obtained by grafting unsaturated carboxylic acid and the-like onto the above (2), and containing at least 0.1% by weight of (3) and/or (4) and (B) 40 to 5% by weight of a linear ultra low density polyethylenic resin having specified, physical properties said resin composition having a proportion of the unsaturated carboxylic acid and the like grafted of 0.001 to 50% by weight, the difference in acoustic impedance between the main material layer and adhesive material layer being at least 8.5.times.10.sup.-3 g/cm.sup.2 .multidot..mu.sec. This multi-layer laminate molding is excellent in barrier properties, and non-destructive detection of the adhesive material layer can be carried out easily by the supersonic wave reflection method.
    • 公开了一种多层层压成形体,其具有主要由外侧的聚乙烯树脂构成的主要材料层和内侧的乙烯 - 乙酸乙烯酯共聚物皂化产物层或聚酰胺树脂层的层结构,层叠 粘合剂材料层至少包含一种树脂组合物,该树脂组合物含有(A)60至95重量%的至少一种选自(1)具有特定物理性质的高密度聚乙烯树脂的树脂( 2)具有特定物理性能的线性低密度聚乙烯树脂,(3)通过将不饱和羧酸等接枝到上述(1)上获得的改性高密度聚乙烯树脂,和(4)获得的改性线型低密度聚乙烯树脂 通过将不饱和羧酸等接枝到上述(2)上,并含有至少0.1重量%的(3)和/或(4)和(B)40至5重量%的lin 耳朵超低密度聚乙烯树脂具有规定的物理性质,所述树脂组合物的不饱和羧酸等的比例接枝为0.001〜50重量%,主材料层和粘合材料层之间的声阻抗差为 至少8.5x10-3 g / cm2x mu sec。 这种多层层叠成型体的阻隔性优异,可以通过超声波反射法容易地进行粘合材料层的无损检测。
    • 8. 发明授权
    • Polyethylenic resin composition
    • 聚乙烯树脂组合物
    • US5643997A
    • 1997-07-01
    • US474958
    • 1995-06-07
    • Masami MatsuokaHikaru Aoyagi
    • Masami MatsuokaHikaru Aoyagi
    • C08L23/06C08L23/08C08L51/06C08L23/04C08L23/26
    • C08L23/0815C08L23/06C08L51/06C08L2205/02C08L2205/03C08L2205/035
    • A polyethylenic resin composition comprising: at least one high density polyethylenic resin selected from (a) a high density polyethylenic resin (Resin A) and (b) a modified high density polyethylenic resin as derived by grafting on the Resin A a monomer of unsaturated carboxylic acid or its derivative (Resin B), at least one linear low density polyethylenic resin selected from (c) a linear low density polyethylenic resin (Resin C) and (d) a modified linear low density polyethylenic resin as derived by grafting on the Resin C the monomer as described in (b) above (Resin D), and (e) a linear very low density polyethylenic resin (Resin E) having a density (g/cm.sup.3) of at least 0.890, but less than 0.910, and a melting point of 110.degree. to 125.degree. C. This polyethylenic resin composition is excellent in fuel oil resistance, low temperature impact resistance, and heat resistance, and provides a material having affinity or adhesive properties to various resinous and metallic materials.
    • 1.一种聚乙烯系树脂组合物,其含有:(a)高密度聚乙烯系树脂(树脂A)和(b)通过在树脂A上接枝不饱和羧酸的单体而得到的改性高密度聚乙烯树脂的至少一种高密度聚乙烯树脂 酸或其衍生物(树脂B),至少一种线性低密度聚乙烯树脂,其选自(c)线性低密度聚乙烯树脂(树脂C)和(d)通过在树脂上接枝而衍生的改性线型低密度聚乙烯树脂 C(b)中所述的单体(树脂D)和(e)密度(g / cm 3)为至少0.890但小于0.910的线性极低密度聚乙烯树脂(树脂E)和 熔点为110℃〜125℃。该聚乙烯系树脂组合物的耐燃油性,耐低温冲击性和耐热性优异,并且提供了对各种树脂和金属材料具有亲和性或粘合性的材料。