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1. 发明授权

US5506755A Multi-layer substrate 失效
标题翻译：多层基板
公开(公告)号：US5506755A
公开(公告)日：1996-04-09
申请号：US291508
申请日：1994-08-18
申请人： Takeshi Miyagi , Kazuhiro Matsumoto , Tomiya Sasaki , Hideo Iwasaki , Katsumi Hisano
发明人： Takeshi Miyagi , Kazuhiro Matsumoto , Tomiya Sasaki , Hideo Iwasaki , Katsumi Hisano
IPC分类号： H01L23/367 , H01L23/538 , H05K1/00 , H05K1/02 , H05K1/14 , H05K7/20
CPC分类号： H01L23/5383 , H01L23/3677 , H01L2224/48091 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/16152 , H01L2924/19041 , H01L2924/3011 , H05K1/0201 , H05K1/0298 , H05K1/144
摘要： A multi-layer wiring substrate includes an aluminum nitride ceramic substrate, a multi-layer wiring part having an electric insulating layer of an organic polymer, a die pad for mounting thereon an electronic part, and a thermal via of a column shape for effectively dissipating heat generated in the mounted electric part. The multi-layer wiring part is integrally formed on the ceramic substrate. The die pad is provided on a surface of the multi-layer wiring part. One end of the thermal via connects to the die pad, while the other end of the thermal via passes through the multi-layer wiring part and extends at least to the ceramic substrate. The thermal via is electrically insulated from the multi-layer wiring part. In the second multi-layer wiring substrate, at least one of end portions of the above thermal via is wider than a section of the other portion of the thermal via, resulting in further improvement of the heat dissipating property.
摘要翻译：多层布线基板包括氮化铝陶瓷基板，具有有机聚合物的电绝缘层的多层布线部分，用于安装电子部件的管芯焊盘和用于有效散发的柱形热导体在安装的电气部件中产生的热量。多层配线部一体地形成在陶瓷基板上。芯片焊盘设置在多层布线部分的表面上。热通孔的一端连接到管芯焊盘，而热通孔的另一端穿过多层布线部分并至少延伸到陶瓷基板。热通孔与多层布线部分电绝缘。在第二多层布线基板中，上述热通孔的端部中的至少一个比热通孔的另一部分的部分宽，导致散热特性的进一步提高。

2. 发明授权

US5532906A Wiring substrate 失效
标题翻译：接线基板
公开(公告)号：US5532906A
公开(公告)日：1996-07-02
申请号：US505707
申请日：1995-07-21
申请人： Jun Hanari , Takeshi Miyagi , Kazuhiro Matsumoto , Ayako Tohdake , Yoshitaka Fukuoka
发明人： Jun Hanari , Takeshi Miyagi , Kazuhiro Matsumoto , Ayako Tohdake , Yoshitaka Fukuoka
IPC分类号： H01L23/12 , H01L23/50 , H01L23/538 , H01L25/16 , H05K1/00 , H05K1/03 , H05K1/11 , H05K1/14 , H05K1/16 , H05K1/18 , H05K3/32 , H05K3/34 , H05K3/36 , H05K3/46 , H01L23/48 , H01R23/68
CPC分类号： H01L23/5383 , H01L23/5385 , H01L23/5387 , H01L25/16 , H05K1/144 , H05K1/162 , H05K3/361 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L24/48 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/14 , H01L2924/1532 , H01L2924/19041 , H01L2924/19105 , H01L2924/3011 , H05K1/0306 , H05K1/0393 , H05K1/117 , H05K1/141 , H05K1/142 , H05K2201/0187 , H05K2201/09309 , H05K2201/094 , H05K3/323 , H05K3/3442 , H05K3/363
摘要： A wiring substrate includes a ceramic substrate having a first conductive connection pattern on an lower surface of the ceramic substrate and a second conductive connection pattern on an upper surface or the lower surface of the ceramic substrate, a multilayered wiring portion arranged on the lower surface of the ceramic substrate through the first conductive connection pattern and including an insulating layer made of an organic polymer, on which an integrated circuit and/or a circuit part are/is mounted, and a flexible wiring substrate, connected to the second conductive connection pattern, for connecting the integrated circuit and/or the circuit part to an external circuit.
摘要翻译：布线基板包括在陶瓷基板的下表面上具有第一导电连接图案的陶瓷基板和在陶瓷基板的上表面或下表面上的第二导电连接图案，布置在陶瓷基板的下表面上的多层布线部分所述陶瓷基板通过所述第一导电连接图案并且包括由其上安装有集成电路和/或电路部件的有机聚合物制成的绝缘层，以及连接到所述第二导电连接图案的柔性布线基板，用于将集成电路和/或电路部分连接到外部电路。

3. 发明授权

US08476741B2 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US08476741B2
公开(公告)日：2013-07-02
申请号：US13009212
申请日：2011-01-19
申请人： Susumu Obata , Takahiro Sogou , Yusaku Asano , Takeshi Miyagi
发明人： Susumu Obata , Takahiro Sogou , Yusaku Asano , Takeshi Miyagi
IPC分类号： H01L23/58 , H01L21/31 , H01L21/4763
CPC分类号： H01L29/84 , H01L2224/11
摘要： According to one embodiment, a semiconductor device includes: a substrate; an organic insulating film provided on the substrate; an inorganic insulating film formed thinner than the organic insulating film on the organic insulating film; a hollow sealing structure that is formed on the inorganic insulating film, and seals a MEMS element in an inside while ensuring a space between the hollow sealing structure itself and the MEMS element; a through hole formed so as to penetrate the organic insulating film and the inorganic insulating film; and a conductive member that is filled into the through hole, and electrically connects the MEMS element and an electrode formed by being filled into the through hole.
摘要翻译：根据一个实施例，半导体器件包括：衬底; 设置在基板上的有机绝缘膜; 无机绝缘膜比有机绝缘膜上的有机绝缘膜薄; 形成在无机绝缘膜上的中空密封结构，并且在确保空心密封结构本身和MEMS元件之间的空间的同时将MEMS元件密封在内部; 形成为穿透有机绝缘膜和无机绝缘膜的通孔; 以及填充到通孔中的导电构件，并且将MEMS元件和由填充形成的电极电连接到通孔中。

4. 发明申请

US20110316387A1 ULTRASONIC TRANSDUCER AND FABRICATING THE SAME 失效
标题翻译：超声波传感器和制造它们
公开(公告)号：US20110316387A1
公开(公告)日：2011-12-29
申请号：US13167276
申请日：2011-06-23
申请人： Takashi TOGASAKI , Takeshi Miyagi , Satoru Asagiri , Michiko Ooishi
发明人： Takashi TOGASAKI , Takeshi Miyagi , Satoru Asagiri , Michiko Ooishi
IPC分类号： G10K9/125 , H04R31/00
CPC分类号： B06B1/0622 , G10K9/125 , H01L41/22 , Y10T29/42 , Y10T29/49005
摘要： An aspect of one embodiment, there is provided an ultrasonic transducer including a plurality of oscillators, each of the oscillator having a convex portion, a printed wiring board provided to be opposed to the convex portion, an adhesive material including at least a portion of the convex portion, the adhesive material joining the oscillator and the printed wiring board, and a resin provided between the oscillator and the printed wiring board, the resin covering the convex portion and the adhesive material.
摘要翻译：一个实施例的方面，提供了一种包括多个振荡器的超声波换能器，每个振荡器具有凸部，设置成与凸部相对的印刷线路板，至少包括一部分连接振荡器和印刷线路板的粘合材料以及设置在振荡器和印刷线路板之间的树脂，覆盖凸部的树脂和粘合材料。

5. 发明申请

US20110237952A1 TWO-DIMENSIONAL-ARRAY ULTRASONIC PROBE AND ULTRASONIC DIAGNOSTIC APPARATUS 审中-公开
标题翻译：二维阵列超声探头和超声诊断装置
公开(公告)号：US20110237952A1
公开(公告)日：2011-09-29
申请号：US13051451
申请日：2011-03-18
申请人： Michiko Ooishi , Satoru Asagiri , Takeshi Miyagi , Takashi Togasaki
发明人： Michiko Ooishi , Satoru Asagiri , Takeshi Miyagi , Takashi Togasaki
IPC分类号： A61B8/00
CPC分类号： A61B8/00 , A61B8/4405 , A61B2562/222 , B06B1/0629 , G01S15/8925 , G10K11/004
摘要： According to one embodiment, an ultrasonic probe comprises piezoelectric elements arranged in the form of a two-dimensional array, a processing IC configured to process signal information obtained from the piezoelectric elements, and a flexible wiring substrate disposed between the piezoelectric elements and the processing IC, with the piezoelectric elements mounted on a front surface, and the processing IC mounted on a rear surface.
摘要翻译：根据一个实施例，超声波探头包括以二维阵列形式布置的压电元件，被配置为处理从压电元件获得的信号信息的处理IC以及设置在压电元件和处理IC之间的柔性布线基板，其中压电元件安装在前表面上，并且处理IC安装在后表面上。

6. 发明申请

US20080294054A1 ULTRASOUND PROBE AND DIAGNOSTIC ULTRASOUND SYSTEM 审中-公开
标题翻译：超声探头和诊断超声系统
公开(公告)号：US20080294054A1
公开(公告)日：2008-11-27
申请号：US12124463
申请日：2008-05-21
申请人： Satoru ASAGIRI , Takeshi Miyagi
发明人： Satoru ASAGIRI , Takeshi Miyagi
IPC分类号： A61B8/00
CPC分类号： A61B8/4455 , A61B8/4281 , G01S7/5208 , G01S15/8909 , H05K1/147
摘要： An ultrasound probe is provided with a piezoelectric sensor module, which includes a plurality of piezoelectric elements arranged two-dimensionally and configured to generate an ultrasound beam so that the beam is reflected by a subject's body and to capture a resulting reflection signal, and a control circuit board that is electrically connected to the piezoelectric sensor module through a flexible substrate and transmits or receives a signal to or from the piezoelectric sensor module. The control circuit board is composed of a transmit-only circuit board, a receive-only circuit board, and a relay flexible substrate that electrically connects the transmit-only and receive-only circuit boards.
摘要翻译：超声波探头设置有压电传感器模块，该压电传感器模块包括多个压电元件，二维布置并被配置为产生超声波束，使得该束被受检者的身体反射并捕获所得到的反射信号，并且控制电路板，其通过柔性基板电连接到压电传感器模块，并将信号传送到压电传感器模块或从压电传感器模块接收信号。控制电路板由仅发送电路板，仅接收电路板和将发送和接收电路板电连接的继电器柔性基板组成。

7. 发明授权

US06729988B2 Hydraulic system for automatic transmission for vehicle having idle-stop control 失效
标题翻译：用于车辆自动变速器的液压系统具有怠速停止控制
公开(公告)号：US06729988B2
公开(公告)日：2004-05-04
申请号：US10157873
申请日：2002-05-31
申请人： Yoshiaki Katou , Isamu Ohtake , Takeshi Miyagi
发明人： Yoshiaki Katou , Isamu Ohtake , Takeshi Miyagi
IPC分类号： F16H300
CPC分类号： F16H61/20 , F16H61/0206 , F16H2061/0477 , F16H2312/14 , Y10T477/6936 , Y10T477/6939 , Y10T477/693962
摘要： A hydraulic system for an automatic transmission for a vehicle with an engine having idle-stop control includes a bypass passage which allows communication between a first hydraulic passage downstream of a manual valve and a forward engagement element, a first switching valve arranged on the bypass passage to be switched between a communicating state and a non-communicating state, and a first switching device which switches the first switching valve between the communicating state and the non-communicating state. The first switching device switches the first switching valve to the communicating state when the hydraulic pressure is lower than a predetermined pressure.
摘要翻译：一种用于具有怠速停止控制的发动机的用于车辆的自动变速器的液压系统，包括旁通通道，其允许手动阀下游的第一液压通道与前接合元件之间的连通;布置在旁通通道在通信状态和非通信状态之间切换的第一切换装置以及在通信状态和非通信状态之间切换第一切换阀的第一切换装置。当液压低于预定压力时，第一开关装置将第一切换阀切换到连通状态。

8. 发明授权

US5801797A Image display apparatus includes an opposite board sandwiched by array boards with end portions of the array boards being offset 失效
标题翻译：图像显示装置包括夹在阵列板之间的相对板，排列的板的端部被偏移
公开(公告)号：US5801797A
公开(公告)日：1998-09-01
申请号：US816725
申请日：1997-03-13
申请人： Atsuko Iida , Tatsuro Uchida , Akira Kinno , Masayuki Saito , Yukio Kizaki , Takeshi Miyagi , Miki Mori , Yumi Fukuda
发明人： Atsuko Iida , Tatsuro Uchida , Akira Kinno , Masayuki Saito , Yukio Kizaki , Takeshi Miyagi , Miki Mori , Yumi Fukuda
IPC分类号： G02F1/1333 , G02F1/1347 , G02F1/1362 , G02F1/133 , G02F1/1339 , G02F1/1343
CPC分类号： G02F1/13336 , G02F1/13452 , G02F1/1347
摘要： The image display apparatus is capable of displaying an image on a large screen in which non-display regions are completely eliminated or minimized. The image display apparatus comprises an opposite board in which common electrodes made of transparent conductive resin are respectively formed on both surfaces of a transparent substrate. A plurality of array boards in each of which semiconductor element and a signal line are formed on a transparent substrate are arranged on both surfaces of the opposite board, such that display regions of end portions of the array boards face each other a sandwich of the opposite board inserted therebetween. Frame-like sealing members made of transparent resin are respectively inserted in clearances between the opposite board and the array boards. Liquid crystal is enclosed in each of spaces surrounded by the frame-like sealing members between the opposite board and the array boards.
摘要翻译：图像显示装置能够在大屏幕上显示图像，其中非显示区域被完全消除或最小化。图像显示装置包括在透明基板的两个表面上分别形成由透明导电树脂制成的公共电极的相对板。在透明基板上形成有多个阵列基板的半导体元件和信号线形成在对置基板的两面上，使得阵列板的端部的显示区域彼此面对相反的三明治板插入其间。由透明树脂制成的框状密封件分别插入相对的板和阵列板之间的间隙中。液晶被封闭在由相对板和阵列板之间的框状密封构件包围的每个空间中。

9. 发明授权

US08647280B2 Ultrasonic probe and method for manufacturing ultrasonic probe 失效
标题翻译：超声波探头及超声波探头制造方法
公开(公告)号：US08647280B2
公开(公告)日：2014-02-11
申请号：US13424873
申请日：2012-03-20
申请人： Michiko Ooishi , Satoru Asagiri , Takashi Togasaki , Takeshi Miyagi
发明人： Michiko Ooishi , Satoru Asagiri , Takashi Togasaki , Takeshi Miyagi
IPC分类号： A61B8/14
CPC分类号： A61B8/4444 , A61B8/4483
摘要： An ultrasonic probe includes, a transducer, a substrate includes electrodes formed on a front surface and a back surface and electronic components, first flexible wire substrates connected in such a manner that a first end is connected to the transducer and a second end is connected to a electrode at a side of the front surface of the substrate, second flexible wire substrates connected in such a manner that a first end is connected to the transducer and a second end is connected to a electrode at a side of the back surface of the substrate, and a dummy materials including the same rigidity and thickness as those of the first flexible wire substrate is arranged at a space, adjacent to a electrode at the side of the front surface of the substrate, corresponding to the second end of the second flexible wire substrate.
摘要翻译：超声波探头包括换能器，基板包括形成在前表面和后表面上的电极和电子部件，第一柔性线基板以使得第一端连接到换能器的方式连接，第二端连接到在所述基板的前表面的一侧的电极，以使得第一端连接到所述换能器的方式连接的第二柔性线基板，并且第二端连接到所述基板的背面侧的电极并且与第一柔性线基板的刚性和厚度相同的虚拟材料布置在与基板的前表面侧的电极相邻的空间处，对应于第二柔性线的第二端基质。

10. 发明申请

US20120245470A1 ULTRASONIC PROBE AND METHOD FOR MANUFACTURING ULTRASONIC PROBE 失效
标题翻译：超声探头和制造超声探头的方法
公开(公告)号：US20120245470A1
公开(公告)日：2012-09-27
申请号：US13424873
申请日：2012-03-20
申请人： Michiko Ooishi , Satoru Asagiri , Takashi Togasaki , Takeshi Miyagi
发明人： Michiko Ooishi , Satoru Asagiri , Takashi Togasaki , Takeshi Miyagi
IPC分类号： A61B8/00 , H05K13/00
CPC分类号： A61B8/4444 , A61B8/4483
摘要： An ultrasonic probe includes, a transducer, a substrate includes electrodes formed on a front surface and a back surface and electronic components, first flexible wire substrates connected in such a manner that a first end is connected to the transducer and a second end is connected to a electrode at a side of the front surface of the substrate, second flexible wire substrates connected in such a manner that a first end is connected to the transducer and a second end is connected to a electrode at a side of the back surface of the substrate, and a dummy materials including the same rigidity and thickness as those of the first flexible wire substrate is arranged at a space, adjacent to a electrode at the side of the front surface of the substrate, corresponding to the second end of the second flexible wire substrate.
摘要翻译：超声波探头包括换能器，基板包括形成在前表面和后表面上的电极和电子部件，第一柔性线基板以使得第一端连接到换能器的方式连接，第二端连接到在所述基板的前表面的一侧的电极，以使得第一端连接到所述换能器的方式连接的第二柔性线基板，并且第二端连接到所述基板的背面侧的电极并且与第一柔性线基板的刚性和厚度相同的虚拟材料布置在与基板的前表面侧的电极相邻的空间处，对应于第二柔性线的第二端基质。

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