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1. 发明授权

US07482900B2 Micro relay 失效
标题翻译：微型继电器
公开(公告)号：US07482900B2
公开(公告)日：2009-01-27
申请号：US10556349
申请日：2005-01-25
申请人： Takeshi Hashimoto , Noriteru Furumoto , Naoki Okumura , Hideki Enomoto , Takeshi Sadamori , Shinichi Kishimoto , Tsutomu Shimomura , Kouji Sakai , Masami Hori
发明人： Takeshi Hashimoto , Noriteru Furumoto , Naoki Okumura , Hideki Enomoto , Takeshi Sadamori , Shinichi Kishimoto , Tsutomu Shimomura , Kouji Sakai , Masami Hori
IPC分类号： H01H67/02
CPC分类号： H01H50/005 , H01H2050/007
摘要： The micro relay of the present invention comprises a base substrate 3, an armature block 5, and a cover 7. The base substrate 3 has a storage recess 41 for accommodating an electromagnetic device 1. The storage recess is composed of a hole 41a penetrating the base substrate 3 and a thin storage recess lid fixed on the one surface of the base substrate to close the hole. The electromagnetic device 1 is isolated from a contact mechanism by the storage recess lid 41b to increase the reliability of the contacts. The electromagnetic device 1 includes a yoke 10, a coil 11 wound around the yoke to generate a flux in response to an exciting current, and a permanent magnet 12 secured to the yoke to generate a flux flowing through an armature 51 and the yoke 10. Because the permanent magnet 12 is secured to the yoke 10, this micro relay can reduce the thickness.
摘要翻译：本发明的微型继电器包括基底基板3，电枢块5和盖7.基底基板3具有用于容纳电磁装置1的储存凹部41.储存凹部由贯穿基底基板3和固定在基底基板的一个表面上的薄的储存凹部盖以封闭孔。电磁装置1通过存储凹部盖41b与接触机构隔离，以提高触点的可靠性。电磁装置1包括磁轭10，卷绕在磁轭上以产生响应于励磁电流的磁通的线圈11和固定到磁轭的永磁体12，以产生流过电枢51和磁轭10的磁通。因为永磁体12被固定到磁轭10上，所以这个微型继电器可以减小厚度。

2. 发明申请

US20060250201A1 Micro relay 失效
标题翻译：微型继电器
公开(公告)号：US20060250201A1
公开(公告)日：2006-11-09
申请号：US10556349
申请日：2005-01-25
申请人： Takeshi Hashimoto , Noriteru Furumoto , Naoki Okumura , Hideki Enomoto , Takeshi Sadamori , Shinichi Kishimoto , Tsutomu Shimomura , Kouji Sakai , Masami Hori
发明人： Takeshi Hashimoto , Noriteru Furumoto , Naoki Okumura , Hideki Enomoto , Takeshi Sadamori , Shinichi Kishimoto , Tsutomu Shimomura , Kouji Sakai , Masami Hori
IPC分类号： H01H51/22
CPC分类号： H01H50/005 , H01H2050/007
摘要： The micro relay of the present invention comprises a base substrate 3, an armature block 5, and a cover 7. The base substrate 3 has a storage recess 41 for accommodating an electromagnetic device 1. The storage recess is composed of a hole 41a penetrating the base substrate 3 and a thin storage recess lid fixed on the one surface of the base substrate to close the hole. The electromagnetic device 1 is isolated from a contact mechanism by the storage recess lid 41b to increase the reliability of the contacts. The electromagnetic device 1 includes a yoke 10, a coil 11 wound around the yoke to generate a flux in response to an exciting current, and a permanent magnet 12 secured to the yoke to generate a flux flowing through an armature 51 and the yoke 10. Because the permanent magnet 12 is secured to the yoke 10, this micro relay can reduce the thickness.
摘要翻译：本发明的微型继电器包括基底基板3，电枢块5和盖7.基底基底3具有用于容纳电磁装置1的储存凹部41.储存凹部由孔41穿透基底基板3和固定在基底基板的一个表面上的薄的储存凹部盖以封闭孔。电磁装置1通过存储凹部盖41b与接触机构隔离，以提高触点的可靠性。电磁装置1包括磁轭10，卷绕在磁轭上以产生响应于励磁电流的磁通的线圈11和固定到磁轭的永磁体12，以产生流过电枢51和磁轭10的磁通。因为永磁体12被固定到磁轭10上，所以这个微型继电器可以减小厚度。

3. 发明授权

US07102473B2 Micro-relay 失效
标题翻译：微型继电器
公开(公告)号：US07102473B2
公开(公告)日：2006-09-05
申请号：US10492642
申请日：2003-07-31
申请人： Kouji Sakai , Hideki Enomoto , Naoki Okumura , Tsutomu Shimomura , Masami Hori
发明人： Kouji Sakai , Hideki Enomoto , Naoki Okumura , Tsutomu Shimomura , Masami Hori
IPC分类号： H01H62/07
CPC分类号： H01H50/005 , H01H50/023 , H01H50/026 , H01H2050/007
摘要： This micro relay comprises a body 1, a cover 4, an armature block 3. The body 1, which is made of silicon or glass, has an electromagnetic mechanism 2. The cover 4 is also made of silicon or glass. The armature block 3 is made of silicon. The armature block 3 is composed of an armature base 30 and a frame 31. The frame 31 surrounds an entire circumference of the armature base 30 and supports the armature base 30 pivotally. The armature base 30 is cooperative with a magnetic material 32 on a surface of the armature base 30 to define an armature 300. A fixed contacts 14A, 14B, 15A, 15B and movable contacts 33A, 33B are selectively closed and opened by a pivot motion of the armature 300. And, the frame 31 is directly bonded over its entire circumference to a periphery 19 of the body 1 and to a periphery 41 of the cover 4 to define a sealed space surrounded by the frame 31 and closed between the body 1 and the cover 4 for accommodating the armature 300 and the fixed contacts and the movable contacts.
摘要翻译：该微型继电器包括主体1，盖4，电枢块3。由硅或玻璃制成的主体1具有电磁机构2。盖4也由硅或玻璃制成。电枢块3由硅制成。电枢块3由电枢基座30和框架31构成。框架31围绕电枢基座30的整个圆周并且枢转地支撑电枢基座30。电枢基座30与电枢基座30的表面上的磁性材料32配合，以限定电枢300。固定触头14A，14B，15A，15B和可动触点33A，33B通过电枢300的枢转运动选择性地闭合和打开。并且，框架31在其整个圆周上直接接合到主体1的周边19和盖4的周边41，以限定由框架31包围并在主体1和盖4之间封闭的密封空间，用于容纳电枢300和固定触点和可动触头。

4. 发明申请

US20050156696A1 Micro-relay 失效
标题翻译：微型继电器
公开(公告)号：US20050156696A1
公开(公告)日：2005-07-21
申请号：US10492642
申请日：2003-07-31
申请人： Kouji Sakai , Hideki Enomoto , naoki Okumura , Tsutomu Shimomura , Masami Hori
发明人： Kouji Sakai , Hideki Enomoto , naoki Okumura , Tsutomu Shimomura , Masami Hori
IPC分类号： H01H50/00 , H01H50/02 , H01H51/22
CPC分类号： H01H50/005 , H01H50/023 , H01H50/026 , H01H2050/007
摘要： This micro relay comprises a body 1, a cover 4, an armature block 3. The body 1, which is made of silicon or glass, has an electromagnetic mechanism 2. The cover 4 is also made of silicon or glass. The armature block 3 is made of silicon. The armature block 3 is composed of an armature base 30 and a frame 31. The frame 31 surrounds an entire circumference of the armature base 30 and supports the armature base 30 pivotally. The armature base 30 is cooperative with a magnetic material 32 on a surface of the armature base 30 to define an armature 300. A fixed contacts 14A, 14B, 15A, 15B and movable contacts 33A, 33B are selectively closed and opened by a pivot motion of the armature 300. And, the frame 31 is directly bonded over its entire circumference to a periphery 19 of the body 1 and to a periphery 41 of the cover 4 to define a sealed space surrounded by the frame 31 and closed between the body 1 and the cover 4 for accommodating the armature 300 and the fixed contacts and the movable contacts.
摘要翻译：该微型继电器包括主体1，盖4，电枢块3。由硅或玻璃制成的主体1具有电磁机构2。盖4也由硅或玻璃制成。电枢块3由硅制成。电枢块3由电枢基座30和框架31构成。框架31围绕电枢基座30的整个圆周并且枢转地支撑电枢基座30。电枢基座30与电枢基座30的表面上的磁性材料32配合，以限定电枢300。固定触头14A，14B，15A，15B和可动触点33A，33B通过电枢300的枢转运动选择性地闭合和打开。并且，框架31在其整个圆周上直接接合到主体1的周边19和盖4的周边41，以限定由框架31包围并在主体1和盖4之间封闭的密封空间，用于容纳电枢300和固定触点和可动触头。

5. 发明授权

US6070469A Pressure sensor 失效
标题翻译：压力传感器
公开(公告)号：US6070469A
公开(公告)日：2000-06-06
申请号：US149114
申请日：1998-09-09
申请人： Naohiro Taniguchi , Shuichi Katayama , Masami Hori
发明人： Naohiro Taniguchi , Shuichi Katayama , Masami Hori
IPC分类号： G01L9/00 , G01L19/06 , G01L9/04 , G01L7/08 , G01L9/06
CPC分类号： G01L19/0084 , G01L19/0038 , G01L19/0609
摘要： A pressure sensor includes a body, a pressure inlet tube housed in the body and having a pressure inlet opening defined therein for introducing oil pressure, and a pressure sensor unit affixed to a proximal end surface of the pressure inlet tube covering the pressure inlet opening to convert the oil pressure to an electrical signal. An oil flow decelerating structure is disposed to a distal end side of the pressure inlet tube for reducing the flow rate of oil.
摘要翻译：压力传感器包括主体，容纳在主体中的压力入口管，并且具有限定在其中的压力入口用于引入油压;以及压力传感器单元，固定到压力入口管的近端表面，覆盖压力入口开口至将油压转换为电信号。油压减速结构设置在压力入口管的远端侧，用于降低油的流量。

6. 发明授权

US06906412B2 Flexible sensor package responsive to thermally induced distortion 失效
标题翻译：柔性传感器封装响应热诱导失真
公开(公告)号：US06906412B2
公开(公告)日：2005-06-14
申请号：US10485403
申请日：2003-05-29
申请人： Eiichi Furukubo , Masami Hori , Kazuya Nohara
发明人： Eiichi Furukubo , Masami Hori , Kazuya Nohara
IPC分类号： G01P1/02 , G01P15/08 , G01P15/125 , H01L29/84 , H05K3/34 , H01L23/12
CPC分类号： B81B7/0048 , B81B2201/0235 , B81C2203/032 , G01P1/023 , G01P15/0802 , G01P15/125 , H01L24/32 , H01L2224/05554 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/83385 , H01L2924/16195 , H01L2924/3511 , H05K3/3442 , H01L2924/00014
摘要： A sensor package P is a surface-mounted sensor package which is adapted to be mounted on a printed board 200. The sensor package P includes a case 1 for accommodating a semiconductor acceleration sensor chip 100 having output pads 101. The case has a bottom wall 10, which is divided into a center area 10a for supporting the sensor chip 100 and a peripheral area 10b. Output electrodes 15 to be connected to the output pads 101 are formed on external surfaces of the peripheral area. These output electrodes 15 are soldered to the printed board 200 for electrical connection between the sensor chip and an electric circuit of the printed board as well as for holding the sensor package physically on the printed board. The feature of the present invention resides in that grooves 12 are formed in an interior surface of the bottom wall 10 between the center area 10a and the peripheral area 10b.
摘要翻译：传感器封装P是适于安装在印刷电路板200上的表面安装的传感器封装。传感器封装P包括用于容纳具有输出焊盘101的半导体加速度传感器芯片100的壳体1。壳体具有底壁10，其被分成用于支撑传感器芯片100的中心区域10a和周边区域10b。要连接到输出焊盘101的输出电极15形成在周边区域的外表面上。这些输出电极15被焊接到印刷电路板200上，用于传感器芯片和印刷电路板的电路之间的电连接，以及将传感器封装物理地保持在印刷电路板上。本发明的特征在于，凹槽12形成在中心区域10a和周边区域10b之间的底壁10的内表面中。

7. 发明授权

US06755081B2 Acceleration sensor 失效
标题翻译：加速度传感器
公开(公告)号：US06755081B2
公开(公告)日：2004-06-29
申请号：US10333910
申请日：2003-04-30
申请人： Eiichi Furukubo , Masami Hori , Kazuya Nohara
发明人： Eiichi Furukubo , Masami Hori , Kazuya Nohara
IPC分类号： G01P102
CPC分类号： G01P15/123 , G01P1/023 , G01P15/08
摘要： An acceleration sensor including a sensor chip for converting into an electrical signal an acceleration applied in a direction of a sensitive axis parallel to a board face of a printed circuit board, which has a first wire bonding face, a wiring base for supporting the sensor chip, which includes second and third wire bonding faces and a wiring pattern formed on the second and third wire bonding faces and a package for accommodating the wiring base having the sensor chip mounted thereon, which has a mounting face to be mounted on the board face of the printed circuit board and a fourth wire bonding face substantially parallel to the mounting face such that the wiring pattern on the third and second wire bonding faces of the wiring base can be connected to pads of the package and pads of the sensor chip, respectively.
摘要翻译：一种加速度传感器，包括传感器芯片，用于将具有第一引线接合面的印刷电路板的平行于平行于印刷电路板的基板面的敏感轴方向的加速度转换成电信号，用于支撑传感器芯片的布线基板，其包括第二和第三引线接合面和形成在第二和第三引线接合面上的布线图案和用于容纳布置基底的封装，其具有安装在其上的传感器芯片，该封装具有安装在板的表面上的安装面印刷电路板和基本上平行于安装面的第四引线接合面，使得布线基板的第三和第二引线接合面上的布线图案可以分别连接到封装的焊盘和传感器芯片的焊盘。

8. 发明授权

US4933654A Polarized electromagnetic relay 失效
公开(公告)号：US4933654A
公开(公告)日：1990-06-12
申请号：US411313
申请日：1989-09-22
申请人： Masami Hori , Yoshinobu Okada , Norimasa Kaji , Hiromi Nishimura
发明人： Masami Hori , Yoshinobu Okada , Norimasa Kaji , Hiromi Nishimura
IPC分类号： H01H49/00 , H01H50/18 , H01H50/36 , H01H51/22 , H01H51/24
CPC分类号： H01H51/2245 , H01H2011/0087 , H01H50/36
摘要： A polarized electromagnetic relay having a pair of first and second pole members which are magnetized to opposite polarity by a permanent magnet coupled thereto and which define therebetween a magnetic gap into which the other end of the armature extends. The first pole member and the armature are magnetically coupled to the base so as to cause a magnet flux of the permanent magnet to circulate through the second pole member, the armature, the base, and the first pole member for attracting the armature to the second pole member. Upon energization of the coil, a resulting coil flux circulates through the armature, the base, and the first pole member in opposing direction to the magnet flux for attracting the armature to the first pole member. A cover and base of magnetic material is included to fit over the base and be magnetically coupled thereto. The second pole member is disposed adjacent to the inner wall of the cover so as to define therebetween an air gap which is cooperative with the second pole member, the armature, base, and the cover in order to circulate an additional coil flux in the opposing direction to the magnet flux across the second pole member and the armature upon energization of the coil, weakening the magnetic flux and therefore expediting the armature movement by the coil flux to thereby improve repsonse sensitivity.

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