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    • 8. 发明授权
    • Photo semiconductor device
    • 照片半导体器件
    • US4740819A
    • 1988-04-26
    • US680118
    • 1986-06-30
    • Hirobumi OuchiHiroshi MatsudaMakoto MoriokaMasahiko KawataKazuhiro KurataYasushi Koga
    • Hirobumi OuchiHiroshi MatsudaMakoto MoriokaMasahiko KawataKazuhiro KurataYasushi Koga
    • H01L31/00H01L31/107H01L29/90
    • H01L31/1075
    • Disclosed is a photo-detective semiconductor device having, on a predetermined semiconductor substrate, at least a first semiconductor layer which exhibits a first conductivity type, a second semiconductor layer which is disposed on said first semiconductor layer, which has a forbidden band gap greater than that of said first semiconductor layer and which exhibits the first conductivity type, and a p-n junction which is formed by a region disposed in said second semiconductor layer and exhibiting a second conductivity type; characterized by comprising a third semiconductor layer which is disposed on said second semiconductor layer, which exhibits the first conductivity type and which has a surface protective function. The third semiconductor layer is usually made of a group III-V compound semiconductor of a quaternary system. By way of example, in a case where the first semiconductor layer is formed of InGaAsP and where the second semiconductor layer is formed of InP, the third semiconductor layer is made of InGaAsP, InGaAs or the like. A photo-detective semiconductor device of low dark current can be provided.
    • 公开了一种光检测半导体器件,其在预定半导体衬底上具有至少第一导电类型的第一半导体层,设置在所述第一半导体层上的禁止带隙大于第二半导体层的第二半导体层, 所述第一半导体层的表面具有第一导电类型,以及pn结,其由设置在所述第二半导体层中并呈现第二导电类型的区域形成; 其特征在于包括:第三半导体层,其设置在所述第二半导体层上,其具有第一导电类型并具有表面保护功能。 第三半导体层通常由四元系的III-V族化合物半导体制成。 作为示例,在第一半导体层由InGaAsP形成且第二半导体层由InP形成的情况下,第三半导体层由InGaAsP,InGaAs等构成。 可以提供低暗电流的光检测半导体器件。