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    • 3. 发明授权
    • Thermal transfer recording apparatus
    • 热转印记录装置
    • US5170178A
    • 1992-12-08
    • US857244
    • 1992-03-25
    • Takayuki Yokoyama
    • Takayuki Yokoyama
    • B41J2/475
    • B41J2/475
    • A thermal transfer recording apparatus for thermally transferring ink to an image recording paper via a laser beam. In the thermal transfer recording apparatus, at least one of the opposing surfaces of a print head and a platen is curved, and a transfer portion is provided on the print head at a position displaced a predetermined amount from a nip portion which is formed by the print head and the platen such that an image is formed on a recording paper without the recording paper contacting an ink film. With such an arrangement, voids produced in forming images on image recording paper are prevented and it becomes possible to form images on image recording paper without image irregularities.Further, by providing a removed portion on the print head relative to the transfer portion in the above thermal transfer recording apparatus so as to accomplish transfer without both sides of the ink film making contact with both the print head and the image recording paper, it becomes possible to minimize the light energy of the laser beam used to expose the ink film.
    • 一种用于经由激光束将油墨热转印到图像记录纸上的热转印记录装置。 在热转印记录装置中,打印头和台板的相对表面中的至少一个是弯曲的,并且转印部分在打印头上设置在从由 打印头和压板,使得在记录纸上形成图像,而没有记录纸与墨膜接触。 通过这样的布置,防止在图像记录纸上形成图像时产生的空隙,并且可以在图像记录纸上形成没有图像不规则的图像。 此外,通过在打印头上相对于上述热转印记录装置中的转印部分提供去除部分,以便在没有油墨膜的两侧与打印头和图像记录纸两者接触的情况下实现转印,变成 可能使用于曝光墨膜的激光束的光能最小化。
    • 8. 发明授权
    • Pressure sensor
    • 压力传感器
    • US06298730B1
    • 2001-10-09
    • US09208689
    • 1998-12-10
    • Kouzou YamagishiToshiaki OkumuraYoji SerizawaHaruhiko SekiyaTakayuki YokoyamaYasutaka IdeIkuya MiyaharaYasuo WatanabeShuzi TohyamaHayato Kobayashi
    • Kouzou YamagishiToshiaki OkumuraYoji SerizawaHaruhiko SekiyaTakayuki YokoyamaYasutaka IdeIkuya MiyaharaYasuo WatanabeShuzi TohyamaHayato Kobayashi
    • G01L900
    • G01L19/148G01L19/0084G01L19/142G01L19/147
    • A pressure sensor (1) having a first terminal (35), the first terminal (35) including a horizontal portion (61) and a vertical portion (62) at an intermediate portion thereof and being elastically deformable. A portion of the first terminal (35) being inserted and soldered to a circuit substrate (33) has a collar portion (63) being abutted around a through-hole (51) of the circuit substrate (33). The first terminal (35) is fixed at a state being pressed to the circuit substrate (33) by the collar portion (63) and being slightly compressed between a base member (32). When the circuit substrate (33) and the base member (32) are spaced apart by circumambient heat, the first terminal (35) can follow by the compressed margin. When the first terminal (35) itself is thermally expanded, the first terminal (35) can follow by an elastic deformation of the horizontal portion (61) and the vertical portion (62). Accordingly, stress caused to the soldered portion by a thermal deformation and the like can be relaxed so that the pressure sensor (1) can be applied to a wider temperature range.
    • 一种具有第一端子(35)的压力传感器(1),所述第一端子(35)在其中间部分包括水平部分(61)和垂直部分(62)并且是可弹性变形的。 第一端子(35)的插入和焊接到电路基板(33)的部分具有环绕电路基板(33)的通孔(51)的轴环部分(63)。 第一端子(35)被固定在被套环部分(63)按压到电路基板(33)并且在基部构件(32)之间被略微压缩的状态。 当电路基板(33)和基部构件(32)通过周向热隔开时,第一端子(35)可以跟随压缩边缘。 当第一端子(35)本身热膨胀时,第一端子(35)可以由水平部分(61)和垂直部分(62)的弹性变形引起。 因此,通过热变形等对焊接部产生的应力可以被松弛,使得压力传感器(1)可以应用于较宽的温度范围。