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    • 4. 发明申请
    • Chromium-free metal surface treatment agent
    • 无铬金属表面处理剂
    • US20050037227A1
    • 2005-02-17
    • US10917397
    • 2004-08-13
    • Yasuhiko EndoTomio Sakai
    • Yasuhiko EndoTomio Sakai
    • B05D7/14B32B15/00C08K3/22C08K3/36C09D5/08C09D183/00C09D183/02C09D183/04C23C22/00C23C22/48C23C22/53C23C22/60C23C22/68
    • C23C22/53C08K3/22C08K3/36C09D5/084C09D183/04C23C22/60C23C2222/20Y10T428/12556Y10T428/12569Y10T428/12618Y10T428/12799Y10T428/265Y10T428/31529Y10T428/31663
    • Provided is a chromium-free metal surface treatment agent excellent in rust inhibitive performance which can be used in a surface treatment of metal products, in particular, galvanized metal products. The metal surface treatment agent consists essentially of a siliceous binder solution comprising water and/or alcohol as a solvent, and the concentration of the silica component is 8 to 25% by weight. In particular, a metal surface treatment agent containing an alcoholic solution of alkoxysilane oligomer having a weight averaged molecular weight of 1000 to 10000, which is obtained by hydrolyzed condensation polymerization of alkoxysilane, can suppress the occurrence of white rusting for a long time. It is preferred that 3 to 25 parts by weight of a dispersed nano-sized titanium dioxide powder having an average primary particle size of not more than 70 nm, per 100 parts by weight of the silica component be suspended in the siliceous binder solution. The rust inhibitive performance of the metal surface treatment agent can be further improved by using an alcohol-soluble polyvinyl butyral resin and by adding a silane coupling agent having a vinyl or epoxy group as a functional group, in combination with a dispersed nano-sized powder of titanium dioxide.
    • 提供了可用于金属制品,特别是镀锌金属制品的表面处理中的防锈性能优异的无铬金属表面处理剂。 金属表面处理剂基本上由包含水和/或醇作为溶剂的硅质粘合剂溶液组成,二氧化硅组分的浓度为8至25重量%。 特别是,通过烷氧基硅烷的水解缩聚得到的含有重均分子量为1000〜10000的烷氧基硅烷低聚物的醇溶液的金属表面处理剂能够长时间抑制白锈的发生。 优选将3〜25重量份的平均一次粒径为70nm以下的分散的纳米尺寸的二氧化钛粉末相对于二氧化硅成分100重量份悬浮在硅质粘合剂溶液中。 通过使用醇溶性聚乙烯醇缩丁醛树脂,通过添加具有乙烯基或环氧基作为官能团的硅烷偶联剂,与分散的纳米尺寸粉末组合,可以进一步提高金属表面处理剂的防锈性能 的二氧化钛。
    • 6. 发明授权
    • Beam forming device
    • 梁形成装置
    • US4780860A
    • 1988-10-25
    • US826413
    • 1986-02-05
    • Toyoki SasakuraYasuhiko Endo
    • Toyoki SasakuraYasuhiko Endo
    • G10K11/34H04R17/08H04B17/00H04R17/00
    • G10K11/348H04R17/08Y10S367/905
    • The present invention relates to a beam forming device for forming a uniform radiation beam and/or a reception beam. In radiation, the transducer is vibrated in such a way that the pressure of a sound wave produced from each point of the vibrating surface of the transducer is determined based on a weight function, thereby forming a radiation beam. In reception, electric signals are derived based on the sound energy received in a manner that the amplitude level of an electric signal produced based on the sound energy received by each point of the vibrating surface of the transducer is determined based on a weight function, and the derived signals are combined with one another to form a reception beam.
    • 本发明涉及用于形成均匀的辐射束和/或接收光束的光束形成装置。 在辐射中,换能器以这样的方式振动,即基于重量函数确定从换能器的振动表面的每个点产生的声波的压力,由此形成辐射束。 在接收中,基于以基于权重函数确定基于由换能器的振动表面的每个点接收的声能产生的电信号的振幅电平的方式,基于接收的声能导出电信号,以及 导出的信号彼此组合以形成接收波束。
    • 9. 发明授权
    • Substrate holder, plating apparatus, and plating method
    • 基板支架,电镀装置和电镀方法
    • US08133376B2
    • 2012-03-13
    • US12871083
    • 2010-08-30
    • Junichiro YoshiokaSeiji KatsuokaMasahiko SekimotoYasuhiko EndoYugang Guo
    • Junichiro YoshiokaSeiji KatsuokaMasahiko SekimotoYasuhiko EndoYugang Guo
    • C25D7/12
    • H01L21/67126C25D7/123C25D17/001C25D17/06H01L21/68721H01L21/68764H01L21/68785
    • A plating method and a plating apparatus, which has a plurality of plating units, for plating a substrate. Each of the plating units includes a plating tank for containing a plating solution therein, a water cleaning tank, disposed adjacent to said plating tank for cleaning the substrate with water, a substrate holder for holding the substrate in a vertical orientation, a vertical displacing mechanism for vertically dipping the substrate holder and a substrate held thereby in the plating solution in the plating tank, and a lateral displacing mechanism or a back-and-forth displacing mechanism for moving the substrate holder while holding the substrate in a vertical orientation between the plating tank and the water cleaning tank. The plating unit also includes a loading/unloading station for loading and unloading the substrate, and a transfer device for transferring the substrate between the plating unit and the loading/unloading station.
    • 一种电镀方法和电镀装置,其具有用于电镀基板的多个电镀单元。 每个电镀单元包括用于在其中容纳电镀液的电镀槽,与所述电镀槽相邻设置的用于清洁衬底的水的清洗槽,用于将衬底保持在垂直取向的衬底保持器,垂直位移机构 用于将衬底保持器和由此保持在电镀液中的电镀溶液中的衬底垂直浸入电镀槽中,以及横向移位机构或前后移位机构,用于使衬底保持器移动,同时将衬底沿着垂直取向保持在电镀 水箱和清水箱。 电镀单元还包括用于装载和卸载基板的装载/卸载站,以及用于在电镀单元和装载/卸载站之间传送基板的传送装置。
    • 10. 发明申请
    • SUBSTRATE HOLDER, PLATING APPARATUS, AND PLATING METHOD
    • 基板支架,镀层装置和镀层方法
    • US20100320090A1
    • 2010-12-23
    • US12871083
    • 2010-08-30
    • Junichiro YOSHIOKASeiji KatsuokaMasahiko SekimotoYasuhiko EndoYugang Guo
    • Junichiro YOSHIOKASeiji KatsuokaMasahiko SekimotoYasuhiko EndoYugang Guo
    • C25D7/12
    • H01L21/67126C25D7/123C25D17/001C25D17/06H01L21/68721H01L21/68764H01L21/68785
    • A plating method and a plating apparatus, which has a plurality of plating units, for plating a substrate. Each of the plating units includes a plating tank for containing a plating solution therein, a water cleaning tank, disposed adjacent to said plating tank for cleaning the substrate with water, a substrate holder for holding the substrate in a vertical orientation, a vertical displacing mechanism for vertically dipping the substrate holder and a substrate held thereby in the plating solution in the plating tank, and a lateral displacing mechanism or a back-and-forth displacing mechanism for moving the substrate holder while holding the substrate in a vertical orientation between the plating tank and the water cleaning tank. The plating unit also includes a loading/unloading station for loading and unloading the substrate, and a transfer device for transferring the substrate between the plating unit and the loading/unloading station.
    • 一种电镀方法和电镀装置,其具有用于电镀基板的多个电镀单元。 每个电镀单元包括用于在其中容纳电镀液的电镀槽,与所述电镀槽相邻设置的用于清洁衬底的水的清洗槽,用于将衬底保持在垂直取向的衬底保持器,垂直位移机构 用于将衬底保持器和由此保持在电镀液中的电镀溶液中的衬底垂直浸入电镀槽中,以及横向移位机构或前后移位机构,用于使衬底保持器移动,同时将衬底沿着垂直取向保持在电镀 水箱和清水箱。 电镀单元还包括用于装载和卸载基板的装载/卸载站,以及用于在电镀单元和装载/卸载站之间传送基板的传送装置。