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1. 发明授权

US07152314B2 Method of manufacturing circuit board 有权
标题翻译：电路板制造方法
公开(公告)号：US07152314B2
公开(公告)日：2006-12-26
申请号：US10765209
申请日：2004-01-28
申请人： Takashi Shuto , Takefumi Kashiwa , Kenji Takano , Kenji Iida , Kenichiro Abe
发明人： Takashi Shuto , Takefumi Kashiwa , Kenji Takano , Kenji Iida , Kenichiro Abe
IPC分类号： H05K3/36
CPC分类号： H05K3/4682 , H05K3/0058 , H05K2203/0152 , H05K2203/0156 , H05K2203/085 , H05K2203/1536 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913
摘要： The method of manufacturing a circuit board is capable of preventing deformation of a core substrate, ensuring size thereof and highly concentrating cable patterns so as to realize compact and high-performance semiconductor devices. The method of manufacturing a circuit board of the present invention comprises the steps of: forming a multilayered body, in which cable patterns on different layers insulated by an insulating layer are electrically connected, on a core substrate by a buildup process; and separating the multilayered body from the core substrate. A metal layer is vacuum-adhered on the core substrate. The multilayered body is formed on the metal layer by the buildup process and separated from the core substrate together with the metal layer by breaking the vacuum state between the core substrate and the metal layer
摘要翻译：制造电路板的方法能够防止芯基板的变形，确保其尺寸和高集中电缆图案，以实现紧凑且高性能的半导体器件。本发明的制造电路板的方法包括以下步骤：通过堆积工艺，在芯基板上形成将由绝缘层绝缘的不同层上的电缆图案电连接的多层体; 以及将所述多层体与所述芯基板分离。将金属层真空附着在芯基板上。多层体通过堆积工艺形成在金属层上，并通过破坏芯基板和金属层之间的真空状态与金属层一起与核心基板分离

2. 发明申请

US20080142256A1 Wiring board manufacturing method 有权
公开(公告)号：US20080142256A1
公开(公告)日：2008-06-19
申请号：US12068992
申请日：2008-02-14
申请人： Takashi Shuto , Kenji Takano , Kenji Iida , Kenichiro Abe , Keiji Arai , Kiyotaka Seyama
发明人： Takashi Shuto , Kenji Takano , Kenji Iida , Kenichiro Abe , Keiji Arai , Kiyotaka Seyama
IPC分类号： H05K3/02 , H05K1/11
CPC分类号： H01L21/6835 , H01L21/4857 , H01L21/486 , H01L23/142 , H01L23/49822 , H01L23/49827 , H01L2224/16 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/19041 , H01L2924/19106 , H05K1/0231 , H05K1/0271 , H05K1/113 , H05K1/183 , H05K3/20 , H05K3/4069 , H05K3/4602 , H05K3/4614 , H05K3/4644 , H05K3/4652 , H05K3/4682 , H05K3/4697 , H05K2201/0347 , H05K2201/0355 , H05K2201/0391 , H05K2201/068 , H05K2201/0959 , H05K2201/096 , H05K2201/09781 , H05K2201/10378 , H05K2201/10545 , H05K2201/10674 , H05K2203/0156 , H05K2203/016 , H05K2203/061 , H05K2203/085 , H05K2203/1536 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49169 , H01L2224/0401
摘要： The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.

3. 发明申请

US20060112544A1 Wiring board manufacturing method 有权
标题翻译：接线板制造方法
公开(公告)号：US20060112544A1
公开(公告)日：2006-06-01
申请号：US11266480
申请日：2005-11-04
申请人： Takashi Shuto , Kenji Takano , Kenji IIda , Kenichiro Abe , Keiji Arai , Kiyotaka Seyama
发明人： Takashi Shuto , Kenji Takano , Kenji IIda , Kenichiro Abe , Keiji Arai , Kiyotaka Seyama
IPC分类号： H05K3/20 , H01R43/00
CPC分类号： H01L21/6835 , H01L21/4857 , H01L21/486 , H01L23/142 , H01L23/49822 , H01L23/49827 , H01L2224/16 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/19041 , H01L2924/19106 , H05K1/0231 , H05K1/0271 , H05K1/113 , H05K1/183 , H05K3/20 , H05K3/4069 , H05K3/4602 , H05K3/4614 , H05K3/4644 , H05K3/4652 , H05K3/4682 , H05K3/4697 , H05K2201/0347 , H05K2201/0355 , H05K2201/0391 , H05K2201/068 , H05K2201/0959 , H05K2201/096 , H05K2201/09781 , H05K2201/10378 , H05K2201/10545 , H05K2201/10674 , H05K2203/0156 , H05K2203/016 , H05K2203/061 , H05K2203/085 , H05K2203/1536 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49169 , H01L2224/0401
摘要： The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.
摘要翻译：本发明涉及一种制造布线板的方法，包括：堆叠层，其中布线图案用绝缘层堆叠; 以及与所述堆积层分开形成的芯基板，所述方法包括以下步骤：在板状支撑体上可分离地形成所述堆积层; 将芯基板电连接到支撑体上的堆积层的布线图案; 并且从堆积层移除支撑体以形成其中堆积层连接到芯基板的布线板。通过可分离地形成积层和芯基板，可以制造有效显示其特性的布线板。

4. 发明授权

US07935891B2 Wiring board manufacturing method 有权
标题翻译：接线板制造方法
公开(公告)号：US07935891B2
公开(公告)日：2011-05-03
申请号：US12068992
申请日：2008-02-14
申请人： Takashi Shuto , Kenji Takano , Kenji Iida , Kenichiro Abe , Keiji Arai , Kiyotaka Seyama
发明人： Takashi Shuto , Kenji Takano , Kenji Iida , Kenichiro Abe , Keiji Arai , Kiyotaka Seyama
IPC分类号： H05K1/03
CPC分类号： H01L21/6835 , H01L21/4857 , H01L21/486 , H01L23/142 , H01L23/49822 , H01L23/49827 , H01L2224/16 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/19041 , H01L2924/19106 , H05K1/0231 , H05K1/0271 , H05K1/113 , H05K1/183 , H05K3/20 , H05K3/4069 , H05K3/4602 , H05K3/4614 , H05K3/4644 , H05K3/4652 , H05K3/4682 , H05K3/4697 , H05K2201/0347 , H05K2201/0355 , H05K2201/0391 , H05K2201/068 , H05K2201/0959 , H05K2201/096 , H05K2201/09781 , H05K2201/10378 , H05K2201/10545 , H05K2201/10674 , H05K2203/0156 , H05K2203/016 , H05K2203/061 , H05K2203/085 , H05K2203/1536 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49169 , H01L2224/0401
摘要： The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.
摘要翻译：本发明涉及一种制造布线板的方法，包括：堆叠层，其中布线图案用绝缘层堆叠; 以及与所述堆积层分开形成的芯基板，所述方法包括以下步骤：在板状支撑体上可分离地形成所述堆积层; 将芯基板电连接到支撑体上的堆积层的布线图案; 并且从堆积层移除支撑体，以形成其中堆积层连接到芯基板的布线板。通过可分离地形成积层和芯基板，可以制造有效显示其特性的布线板。

5. 发明授权

US07377030B2 Wiring board manufacturing method 有权
标题翻译：接线板制造方法
公开(公告)号：US07377030B2
公开(公告)日：2008-05-27
申请号：US11266480
申请日：2005-11-04
申请人： Takashi Shuto , Kenji Takano , Kenji Ilda , Kenichiro Abe , Keiji Arai , Kiyotaka Seyama
发明人： Takashi Shuto , Kenji Takano , Kenji Ilda , Kenichiro Abe , Keiji Arai , Kiyotaka Seyama
IPC分类号： H05K3/36
CPC分类号： H01L21/6835 , H01L21/4857 , H01L21/486 , H01L23/142 , H01L23/49822 , H01L23/49827 , H01L2224/16 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/19041 , H01L2924/19106 , H05K1/0231 , H05K1/0271 , H05K1/113 , H05K1/183 , H05K3/20 , H05K3/4069 , H05K3/4602 , H05K3/4614 , H05K3/4644 , H05K3/4652 , H05K3/4682 , H05K3/4697 , H05K2201/0347 , H05K2201/0355 , H05K2201/0391 , H05K2201/068 , H05K2201/0959 , H05K2201/096 , H05K2201/09781 , H05K2201/10378 , H05K2201/10545 , H05K2201/10674 , H05K2203/0156 , H05K2203/016 , H05K2203/061 , H05K2203/085 , H05K2203/1536 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49169 , H01L2224/0401
摘要： The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.
摘要翻译：本发明涉及一种制造布线板的方法，包括：堆叠层，其中布线图案用绝缘层堆叠; 以及与所述堆积层分开形成的芯基板，所述方法包括以下步骤：在板状支撑体上可分离地形成所述堆积层; 将芯基板电连接到支撑体上的堆积层的布线图案; 并且从堆积层移除支撑体以形成其中堆积层连接到芯基板的布线板。通过可分离地形成积层和芯基板，可以制造有效显示其特性的布线板。

6. 发明授权

US07840715B2 Apparatus connection interface, apparatus control system and method of controlling apparatus control system 有权
标题翻译：设备连接接口，设备控制系统及控制设备控制系统的方法
公开(公告)号：US07840715B2
公开(公告)日：2010-11-23
申请号：US11291408
申请日：2005-12-01
申请人： Kenji Takano
发明人： Kenji Takano
IPC分类号： G06F3/00
CPC分类号： H04N5/765 , H04L12/2803 , H04L12/282 , H04L12/2838 , H04L12/423 , H04L2012/2849 , H04N5/77
摘要： An apparatus connection interface remarkably reduces the processing load of the controller. The apparatus connection interface includes a pair of connectors including a first connector and a second connector having respective signal transmission terminals for connecting a plurality of apparatus to be controlled in series to form an annular signal transmission line so as to circulate and transmit a condition confirming signal for confirming the condition of the apparatus to be controlled and, at the same time, circulate and transmit a condition notifying signal for notifying the condition of the individual apparatus to be controlled by way of the formed signal transmission line.
摘要翻译：设备连接接口显着降低了控制器的处理负担。设备连接接口包括一对连接器，包括第一连接器和第二连接器，其具有各自的信号传输端子，用于连接要串联控制的多个设备，以形成环形信号传输线，以便循环并发送条件确认信号用于确认要被控制的装置的状态，并且同时循环并发送状态通知信号，以便通过形成的信号传输线来通知要被控制的各个设备的状态。

7. 发明申请

US20090041991A1 Method for Manufacturing Inks, and Inks, Printed Matter and Shaped Products Based on Method Thereof 审中-公开
标题翻译：基于方法制造油墨和油墨印刷品和成型产品的方法
公开(公告)号：US20090041991A1
公开(公告)日：2009-02-12
申请号：US12280045
申请日：2006-05-22
申请人： Kenji Takano , Takuya Torihata , Jun Kimura
发明人： Kenji Takano , Takuya Torihata , Jun Kimura
IPC分类号： B32B3/10 , C08F2/48 , C08F20/18
CPC分类号： B41M7/0081 , B29C45/14688 , B29C51/26 , B29C2795/002 , C09D11/101 , Y10T428/24802
摘要： Provided is a method for manufacturing inkjet system ultraviolet curable inks which are improved in formability, adhesiveness and tackiness by selecting a combination of a monofunctional radical polymerization monomer as a major component with other polyfunctional radical polymerization oligomers and/or monofunctional radical polymerization monomers.Also, obtained is a method for manufacturing inkjet system ultraviolet curable inks in which phenoxyethylacrylate is a basic composition used as a photo polymerization reactive composition and other monofunctional radical polymerization monomers and/or polyfunctional radical polymerization oligomers are mixed within a predetermined relative quantity, if necessary, thereby realizing results in which at least two of the above-described characteristics are favorable and the remaining one is far from poor, inks according to the method, decorating printed matter and decorating sheet shaped articles using the inks, and insert molding shaped products using the decorating printed matter and the decorating sheet shaped articles.
摘要翻译：提供一种通过选择单官能自由基聚合单体作为主要成分与其它多官能团自由基聚合低聚物和/或单官能自由基聚合单体的组合来提高成型性，粘合性和粘合性的喷墨系统紫外线固化油墨的方法。此外，获得的喷墨系统紫外线固化油墨的制造方法，其中苯氧基乙基丙烯酸酯是用作光聚合反应性组合物的基本组合物，并且如果需要，其它单官能自由基聚合单体和/或多官能自由基聚合低聚物以预定相对量混合从而实现上述特征中的至少两个是有利的，剩下的一个远不差，根据该方法的油墨，装饰印刷品和使用该油墨的装饰片状制品，以及使用装饰印刷品和装饰片状物品。

8. 发明申请

US20090039997A1 Metal Terminal, Coil Component, and Method for Holding and Fixing Conductive Wire 审中-公开
标题翻译：金属端子，线圈部件和保持和固定导电线的方法
公开(公告)号：US20090039997A1
公开(公告)日：2009-02-12
申请号：US12282639
申请日：2007-02-22
申请人： Hideoki Nakashima , Koji Niino , Kenji Takano , Norio Yokoyama
发明人： Hideoki Nakashima , Koji Niino , Kenji Takano , Norio Yokoyama
IPC分类号： H01F27/29 , H01R4/10 , H01R4/18
CPC分类号： H01F5/04 , H01F41/076 , H01F41/10 , H01R4/14 , H01R4/18
摘要： The present invention provides a metal terminal that can hold and fix a conductive wire thereto without excessive deformation. In the metal terminal of this invention, a predetermined relationship is set between a length in the lengthwise direction and a width in the widthwise direction of a conductive wire winding portion and a diameter of the conductive wire wound around the conductive wire winding portion to reduce force applied to the conductive wire when holding and fixing the conductive wire.
摘要翻译：本发明提供一种金属端子，其能够将导电线保持固定而不会过度变形。在本发明的金属端子中，在导线绕组部分的长度方向的长度和宽度方向的宽度以及缠绕在导线绕组部分上的导线的直径之间设定预定的关系以减小力当保持和固定导线时，施加到导线上。

9. 发明申请

US20080271908A1 Hermetic Sealing Cap, Method of Manufacturing Hermetic Sealing Cap and Electronic Component Storage Package 审中-公开
标题翻译：密封密封帽，密封密封盖和电子元件储存包装制造方法
公开(公告)号：US20080271908A1
公开(公告)日：2008-11-06
申请号：US10568075
申请日：2005-09-26
申请人： Masaharu Yamamoto , Kenji Takano , Junji Hira
发明人： Masaharu Yamamoto , Kenji Takano , Junji Hira
IPC分类号： H05K5/06 , B05D5/12
CPC分类号： H03H9/1014 , H01L23/06 , H01L23/10 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/16195 , H03H9/1071 , H01L2924/00 , H01L2224/0401
摘要： Cap for airtight sealing (1) that not only suppresses any deterioration of the properties of electronic parts (20) to thereby reduce material costs but also enables use of Pb-free solders, and that is capable of suppressing any airtightness deterioration. This cap for airtight sealing comprises low thermal expansion layer (2); Ni—Co alloy layer (3) superimposed on the surface of the low thermal expansion layer and composed mainly of Ni wherein a diffusion acceleration material is contained; Ni layer (4) superimposed on the surface of the Ni—Co alloy layer; and solder layer (5) superimposed on the surface of the Ni layer at regions for bonding of electronic part accommodation member (10) and composed mainly of Sn. The Ni layer has the functions of not only suppressing any diffusion of the Ni—Co alloy layer into the solder layer at about 235° C. (first temperature) but also at bonding of the solder layer with the electronic part accommodation member at about 300° to about 320° C. (second temperature), diffusing the Ni—Co alloy layer via the Ni layer into the solder layer.
摘要翻译：气密密封盖（1）不仅可以抑制电子部件（20）的性能的劣化，从而降低材料成本，而且能够使用无铅焊料，并且能够抑制任何气密性劣化。用于密封的该盖包括低热膨胀层（2）; Ni-Co合金层（3）叠加在低热膨胀层的表面上，主要由Ni构成，其中包含扩散加速材料; Ni层（4）叠加在Ni-Co合金层的表面上; 和焊料层（5），其叠加在Ni层的表面上，用于键合电子部件容纳部件（10）并且主要由Sn组成的区域。 Ni层的功能不仅在约235℃（第一温度）下抑制Ni-Co合金层在焊料层中的扩散，而且在焊料层与电子部件容纳部件的接合处约为300℃ °至约320℃（第二温度），通过Ni层将Ni-Co合金层扩散到焊料层中。

10. 发明授权

US06748184B2 Image forming apparatus and fixing device 有权
标题翻译：图像形成装置和定影装置
公开(公告)号：US06748184B2
公开(公告)日：2004-06-08
申请号：US10614059
申请日：2003-07-08
申请人： Noriyuki Umezawa , Taizo Kimoto , Kenji Takano , Hisaaki Kawano , Hiroshi Nakayama , Osamu Takagi , Satoshi Kinouchi , Kazuhiko Kikuchi , Masahiko Ogura
发明人： Noriyuki Umezawa , Taizo Kimoto , Kenji Takano , Hisaaki Kawano , Hiroshi Nakayama , Osamu Takagi , Satoshi Kinouchi , Kazuhiko Kikuchi , Masahiko Ogura
IPC分类号： G03G1520
CPC分类号： G03G15/2039 , G03G15/2003 , G03G15/5004
摘要： The present invention provides a fixing device and a digital photocopier which can shorten the time from an instruction of starting image formation to end of fixing. The fixing device is provided in a cylinder made of metal and having a small thickness, and includes a magnetic excitation coil. When the power source is turned on, all the electric power defined by subtracting an electric power amount consumed by components other than the fixing device is supplied to the magnetic excitation coil to perform heating. As the structural components of the photocopier and auxiliary devices added to the photocopier operate, the electric power defined by subtracting, from the maximum input electric power, the electric power consumed by the structural components of the photocopier and the auxiliary devices is supplied to perform heating. In this manner, the heat roller of the fixing device is heated, in a short time, to a temperature which enables fixing, so that the time required for first copying can be shortened.
摘要翻译：本发明提供了一种定影装置和数字复印机，其可以缩短从开始图像形成到结束结束的指令的时间。定影装置设置在由金属制成并具有小厚度的圆筒中，并且包括磁激励线圈。当电源接通时，通过减去除了定影装置以外的部件消耗的电力量而定义的所有电力被提供给磁性励磁线圈进行加热。由于复印机和辅助设备的结构部件添加到复印机中，所以通过从最大输入电力中减去由复印机和辅助设备的结构部件消耗的电力而定义的电力被供给以进行加热。以这种方式，定影装置的加热辊在短时间内被加热到能够进行定影的温度，从而可以缩短第一次复印所需的时间。

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