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1. 发明申请

US20140316552A1 METHOD FOR DETERMINING A MACHINING MEANS IN HYBRID ULTRAPRECISION MACHINING DEVICE, AND HYBRID ULTRAPRECISION MACHINING DEVICE 有权
标题翻译：用于确定混合超声波加工装置中加工装置的方法和混合超声波加工装置
公开(公告)号：US20140316552A1
公开(公告)日：2014-10-23
申请号：US14343428
申请日：2012-12-14
申请人： Takashi Shindo , Yoshiyuki Uchinono , Kimitake Okugawa , Noboru Urata , Syoji Kuroki , Akira Fukuoka , Atsushi Sakaguchi
发明人： Takashi Shindo , Yoshiyuki Uchinono , Kimitake Okugawa , Noboru Urata , Syoji Kuroki , Akira Fukuoka , Atsushi Sakaguchi
IPC分类号： G05B19/18
CPC分类号： G05B19/18 , B23K26/0624 , B23K26/0823 , B23K26/0853 , B23K26/0876 , B23P23/04 , B23Q39/024 , G05B19/401 , G05B2219/49376 , G05B2219/50088
摘要： There is provided a method for determining a machining means in a hybrid ultraprecision machining device for manufacturing a micro-machined product from a workpiece, the machining device comprising: an electromagnetic-wave-machining means for roughly machining the workpiece; a precision-machining means for precisely machining the roughly machined workpiece; and a shape-measurement means for measuring a shape of the workpiece upon use of the electromagnetic-wave machining means and the precision-machining means, wherein a choice is made between the electromagnetic-wave-machining means and the precision-machining means in the determination of the machining means, on the basis of: information on a stereoscopic model of the micro-machined product; information on a removal volume to be removed from a volume of the workpiece in the manufacturing of the micro-machined product; and data on a removal process time of the electromagnetic-wave-machining means and data on a removal process time of the precision-machining means.
摘要翻译：提供了一种用于确定用于从工件制造微加工产品的混合超精密加工装置中的加工装置的方法，该加工装置包括：用于粗加工工件的电磁波加工装置; 精密加工装置，用于精加工粗加工的工件; 以及形状测量装置，用于在使用电磁波加工装置和精密加工装置时测量工件的形状，其中在电磁波加工装置和精密加工装置之间进行选择基于：关于微加工产品的立体模型的信息的加工手段的确定; 关于在微加工产品的制造中要从工件的体积移除的去除体积的信息; 以及关于电磁波加工装置的去除处理时间的数据和关于精密加工装置的去除处理时间的数据。

2. 发明申请

US20100032189A1 LED PACKAGE AND ATTACHMENT STRUCTURE OF MOLDED CIRCUIT COMPONENT 审中-公开
标题翻译： LED封装和模制电路组件的附件结构
公开(公告)号：US20100032189A1
公开(公告)日：2010-02-11
申请号：US12527069
申请日：2008-02-08
申请人： Masahide Muto , Yoshiyuki Uchinono , Hiroyuki Yoshida , Takashi Shindo , Masahiro Sato , Yutaka Nishira , Norimasa Kaji
发明人： Masahide Muto , Yoshiyuki Uchinono , Hiroyuki Yoshida , Takashi Shindo , Masahiro Sato , Yutaka Nishira , Norimasa Kaji
IPC分类号： H05K7/20 , H01L33/00 , H05K1/16
CPC分类号： H05K3/301 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H05K3/326 , H05K3/3442 , H05K2201/0311 , H05K2201/10106 , H05K2201/1031 , H05K2201/10636 , H05K2201/10962 , Y02P70/611 , Y02P70/613 , H01L2924/00014
摘要： An LED package includes: a molded interconnect device that has an LED chip mounted thereon, and is mounted on a mounting board electrically connected to the LED chip; and a plurality of elastic bodies mounted on the mounting board while interposing solder therebetween. The plurality of elastic bodies hold a position of the molded interconnect device with respect to the mounting board by elastic forces given to an inner surface side of the molded interconnect device from a plurality of outer side surfaces thereof opposite to each other.
摘要翻译： LED封装包括：模制互连装置，其上安装有LED芯片，并且安装在电连接到LED芯片的安装板上; 以及安装在安装基板上的多个弹性体，同时插入焊料。多个弹性体通过相对于多个彼此相对的多个外侧面的模制互连装置的内表面侧的弹性力而相对于安装板保持模制互连装置的位置。

3. 发明授权

US08999222B2 Method for manufacturing three-dimensionally shaped object, three-dimensionally shaped object obtained thereby, and method for manufacturing molded article 有权
标题翻译：用于制造三维成形物体的方法，由此获得的三维形状物体，以及用于制造模制品的方法
公开(公告)号：US08999222B2
公开(公告)日：2015-04-07
申请号：US13702214
申请日：2011-06-09
申请人： Satoshi Abe , Yoshiyuki Uchinono , Isao Fuwa , Norio Yoshida , Kazuho Morimoto
发明人： Satoshi Abe , Yoshiyuki Uchinono , Isao Fuwa , Norio Yoshida , Kazuho Morimoto
IPC分类号： B22C9/00 , B29C33/38 , B29C67/00 , B29C45/00 , B22F3/105 , B22F3/11 , B22F7/06 , B29C45/17
CPC分类号： B29C33/3842 , B22F3/1055 , B22F3/1121 , B22F7/06 , B22F2999/00 , B23P15/00 , B29C33/3814 , B29C45/174 , B29C64/153 , B33Y10/00 , B33Y80/00 , Y02P10/295 , B22F2207/17
摘要： There is provided a method for manufacturing a three-dimensional shaped object, the method comprising the repeated steps of: (i) forming a solidified layer by irradiating a predetermined portion of a powder layer with a light beam, thereby allowing a sintering of the powder in the predetermined portion or a melting and subsequent solidification thereof; and (ii) forming another solidified layer by newly forming a powder layer on the resulting solidified layer, followed by the irradiation of a predetermined portion of the powder layer with the light beam, wherein a part of a surface portion of the three-dimensional shaped object is formed as a low-density solidified portion whose solidified density ranges from 50% to 90% so that an application of pressure can be performed by a gas flowing through the low-density solidified portion.
摘要翻译：提供了一种制造三维成形物体的方法，该方法包括以下重复步骤：（i）通过用光束照射粉末层的预定部分来形成固化层，从而允许粉末的烧结在预定部分或其熔融和随后的固化中; 和（ii）通过在所得固化层上新形成粉末层，然后用光束照射粉末层的预定部分，形成另一固化层，其中三维成形的表面部分的一部分物体形成为凝固密度为50％至90％的低密度固化部分，从而可以通过流过低密度固化部分的气体进行压力的施加。

4. 发明申请

US20130069282A1 METHOD FOR MANUFACTURING THREE-DIMENSIONALLY SHAPED OBJECT, THREE-DIMENSIONALLY SHAPED OBJECT OBTAINED THEREBY, AND METHOD FOR MANUFACTURING MOLDED ARTICLE 有权
标题翻译：制造三维形状对象的方法，获得的三维形状对象以及制造模型的方法
公开(公告)号：US20130069282A1
公开(公告)日：2013-03-21
申请号：US13702214
申请日：2011-06-09
申请人： Satoshi Abe , Yoshiyuki Uchinono , Isao Fuwa , Norio Yoshida , Kazuho Morimoto
发明人： Satoshi Abe , Yoshiyuki Uchinono , Isao Fuwa , Norio Yoshida , Kazuho Morimoto
IPC分类号： B29C33/38 , B29C45/00
CPC分类号： B29C33/3842 , B22F3/1055 , B22F3/1121 , B22F7/06 , B22F2999/00 , B23P15/00 , B29C33/3814 , B29C45/174 , B29C64/153 , B33Y10/00 , B33Y80/00 , Y02P10/295 , B22F2207/17
摘要： There is provided a method for manufacturing a three-dimensional shaped object, the method comprising the repeated steps of: (i) forming a solidified layer by irradiating a predetermined portion of a powder layer with a light beam, thereby allowing a sintering of the powder in the predetermined portion or a melting and subsequent solidification thereof; and (ii) forming another solidified layer by newly forming a powder layer on the resulting solidified layer, followed by the irradiation of a predetermined portion of the powder layer with the light beam, wherein a part of a surface portion of the three-dimensional shaped object is formed as a low-density solidified portion whose solidified density ranges from 50% to 90% so that an application of pressure can be performed by a gas flowing through the low-density solidified portion.
摘要翻译：提供了一种制造三维成形物体的方法，该方法包括以下重复步骤：（i）通过用光束照射粉末层的预定部分来形成固化层，从而允许粉末的烧结在预定部分或其熔融和随后的固化中; 和（ii）通过在所得固化层上新形成粉末层，然后用光束照射粉末层的预定部分，形成另一固化层，其中三维成形的表面部分的一部分物体形成为凝固密度为50％至90％的低密度固化部分，从而可以通过流过低密度固化部分的气体进行压力施加。

5. 发明申请

US20050103761A1 Connector-use contact and production method for component to be soldered 有权
标题翻译：用于要焊接的部件的连接器 - 使用接触和生产方法
公开(公告)号：US20050103761A1
公开(公告)日：2005-05-19
申请号：US10505453
申请日：2003-10-10
申请人： Yasunori Miki , Hiroshi Yanagida , Shouichi Nagata , Shin Sato , Yoshiyuki Uchinono , Kenji Jonen , Masaharu Ishikawa , Hiroshi Iwano , Syunichi Nakayama
发明人： Yasunori Miki , Hiroshi Yanagida , Shouichi Nagata , Shin Sato , Yoshiyuki Uchinono , Kenji Jonen , Masaharu Ishikawa , Hiroshi Iwano , Syunichi Nakayama
IPC分类号： H01R4/02 , H01R12/55 , H01R13/03 , B23K26/36
CPC分类号： H01R13/03 , H01R4/028
摘要： In a contact for a connector, a metal material id processed to be bent in a predetermined shape in a manner so that a terminal portion is formed in the vicinity of an end and a contacting portion is formed in the vicinity of the other end. A nickel plating layer as a foundation plating layer and a gold plating layer are formed on substantially entire surface of the contact including the terminal portion and the contacting portion. Laser beams are irradiated at a portion between the terminal portion and the contacting portion, and especially in the vicinity of the terminal portion so that the nickel plating layer as the foundation plating layer is unsheathed by removing the gold plating layer or gold in the gold plating layer and nickel in the foundation layer are alloyed. Nickel and the alloy of nickel and gold respectively have low wetting property with respect to solder, so that diffusion of melted solder stops at the portion.
摘要翻译：在用于连接器的接触件中，在另一端附近形成加工成预定形状的金属材料id，使得在端部附近形成端子部分和接触部分。在包括端子部分和接触部分的触点的基本整个表面上形成作为基底镀层的镀镍层和镀金层。激光束在端子部分和接触部分之间的部分，特别是在端子部分附近被照射，使得作为基底镀层的镀镍层通过去除金镀层或镀金中的金而未被脱模基层中的层和镍合金化。镍和镍的合金分别相对于焊料具有低的润湿性，使得熔化的焊料的扩散停止在该部分处。

6. 发明申请

US20140147328A1 METHOD FOR PRODUCING THREE-DIMENSIONAL SHAPED OBJECT 有权
标题翻译：生产三维形状对象的方法
公开(公告)号：US20140147328A1
公开(公告)日：2014-05-29
申请号：US14119224
申请日：2012-05-22
申请人： Satoshi Abe , Isamu Matsumoto , Masataka Takenami , Isao Fuwa , Yoshikazu Higashi , Yoshiyuki Uchinono , Norio Yoshida
发明人： Satoshi Abe , Isamu Matsumoto , Masataka Takenami , Isao Fuwa , Yoshikazu Higashi , Yoshiyuki Uchinono , Norio Yoshida
IPC分类号： B22F3/24 , B22F3/105
CPC分类号： B22F3/24 , B22F3/1055 , B22F2003/247 , B29C64/153 , B29C67/0077 , B29L2031/085 , B33Y10/00 , Y02P10/295 , Y02P70/523
摘要： A method for manufacturing a three-dimensional shaped object, comprising: (i) forming a powder layer on a base plate by a sliding movement of a squeegee blade, followed by forming a solidified layer by irradiating a predetermined portion of the powder layer with a light beam, thereby allowing sintering of the powder of the predetermined portion or melting and subsequent solidification thereof; and (ii) forming another solidified layer by newly forming a powder layer on the resulting solidified layer, and then irradiating another predetermined portion of the new powder layer with the light beam, steps (i) and (ii) being repeatedly performed, wherein machining is performed at least once on an outer surface of a shaped object precursor obtained during manufacturing, and after machining, at least one solidified layer is formed, and followed by upper face machining to remove a raised solidified portion generated at a peripheral edge of the solidified layer.
摘要翻译：一种三维成形体的制造方法，包括：（i）通过刮板的滑动运动在基板上形成粉末层，然后通过用粉末层的规定部分照射形成固化层光束，从而允许烧结预定部分的粉末或熔化并随后固化; 和（ii）通过在所得固化层上新形成粉末层形成另一固化层，然后用光束照射新粉末层的另一预定部分，重复执行步骤（i）和（ii），其中机械加工在制造过程中获得的成形体前体的外表面上至少进行一次，在机械加工后形成至少一个固化层，然后进行上表面加工，除去在固化后的周边部分产生的升高的凝固部分层。

7. 发明申请

US20130075575A1 METHOD FOR MANUFACTURING THREE-DIMENSIONALLY SHAPED OBJECT AND THREE-DIMENSIONALLY SHAPED OBJECT 有权
标题翻译：制造三维形状对象和三维形状对象的方法
公开(公告)号：US20130075575A1
公开(公告)日：2013-03-28
申请号：US13702210
申请日：2011-06-09
申请人： Satoshi Abe , Yoshiyuki Uchinono , Isao Fuwa , Norio Yoshida , Kazuho Morimoto
发明人： Satoshi Abe , Yoshiyuki Uchinono , Isao Fuwa , Norio Yoshida , Kazuho Morimoto
IPC分类号： B29C33/02
CPC分类号： B29C33/02 , B22F3/1055 , B22F2003/1056 , B23P15/00 , B29C35/0272 , B29C35/0805 , B29C64/153 , B29C64/40 , B33Y10/00 , B33Y50/02 , Y02P10/295
摘要： There is provided a method for manufacturing a three-dimensional shaped object, the method comprising the repeated steps of: (i) forming a solidified layer by irradiating a predetermined portion of a powder layer with a light beam, thereby allowing a sintering of the powder in the predetermined portion or a melting and subsequent solidification thereof; and (ii) forming another solidified layer by newly forming a powder layer on the resulting solidified layer, followed by the irradiation of a predetermined portion of the powder layer with the light beam, wherein a heater element is disposed on the solidified layer during the repeated steps (i) and (ii), and thereby the heater element is situated within the three-dimensional shaped object.
摘要翻译：提供了一种制造三维成形物体的方法，该方法包括以下重复步骤：（i）通过用光束照射粉末层的预定部分来形成固化层，从而允许粉末的烧结在预定部分或其熔融和随后的固化中; 和（ii）通过在所得到的固化层上新形成粉末层，然后用光束照射粉末层的预定部分，形成另一个固化层，其中在重复的过程中将加热元件设置在固化层上步骤（i）和（ii），从而加热器元件位于三维成形物体内。

8. 发明授权

US5503793A Process of fabricating a three-dimensional object from a light curable liquid resin 失效
标题翻译：从光固化液体树脂制造三维物体的工艺
公开(公告)号：US5503793A
公开(公告)日：1996-04-02
申请号：US300570
申请日：1994-09-06
申请人： Yoshiyuki Uchinono , Yoshikazu Higashi
发明人： Yoshiyuki Uchinono , Yoshikazu Higashi
IPC分类号： B29C35/08 , B29C41/12 , B29C67/00 , B29K105/24 , B29C41/02
CPC分类号： B29C67/0062 , B29C41/12
摘要： A three-dimensional object is fabricated from a light curable liquid resin by repeating the following process to superimpose a plurality of cured resin layers. The process utilizes a vessel containing a volume of the liquid resin and a vertically movable platform. In the process, the platform is immersed in the liquid resin in the vessel to dispose an overlay surface of an immediately previously cured layer sufficiently below the liquid level of the liquid resin. The platform is then raised such that the overlay surface is slightly higher than the liquid level of the liquid resin in the vessel, while keeping the liquid resin on the overlay surface connected with the surrounding liquid resin in the vessel by the effect of surface tension acting on the liquid resin. An excess amount of the liquid resin on the overlay surface is removed to form a liquid resin layer having a desired thickness. The platform is lowered such that an upper surface of the liquid resin layer is substantially in flush with the surrounding liquid level in the vessel, while keeping the desired thickness of the liquid resin layer. A light is then radiated to the liquid resin layer so as to cure it into the cured resin layer.
摘要翻译：通过重复以下处理来叠加多个固化树脂层，由光可固化液体树脂制造三维物体。该方法利用容纳液体树脂的容器和可垂直移动的平台。在该过程中，将平台浸入容器中的液体树脂中，以将刚刚预先固化的层的覆盖表面设置在液体树脂的液面以下。然后将平台升高使得覆盖表面略高于容器中液体树脂的液面，同时通过表面张力作用将液体树脂保持在与周围液体树脂连接的覆盖表面上在液体树脂上。除去过量的覆盖表面上的液体树脂以形成具有所需厚度的液体树脂层。降低平台，使得液体树脂层的上表面与容器中的周围液面基本齐平，同时保持液体树脂层的期望厚度。然后将光照射到液态树脂层，使其固化成固化树脂层。

9. 发明授权

US09902113B2 Method for manufacturing three-dimensional shaped object and three-dimensional shaped object 有权
公开(公告)号：US09902113B2
公开(公告)日：2018-02-27
申请号：US14005026
申请日：2012-03-15
申请人： Isamu Matsumoto , Satoshi Abe , Masataka Takenami , Yoshiyuki Uchinono
发明人： Isamu Matsumoto , Satoshi Abe , Masataka Takenami , Yoshiyuki Uchinono
IPC分类号： B29C67/00 , B29C33/76 , B33Y10/00 , B22F3/105 , B22F5/00 , B22F7/00
CPC分类号： B29C64/147 , B22F3/1055 , B22F5/007 , B22F7/002 , B22F2998/10 , B22F2999/00 , B29C33/76 , B29C64/153 , B33Y10/00 , Y02P10/292 , Y02P10/295 , B22F2202/01 , B22F3/162
摘要： There is provided a method for manufacturing a three-dimensional shaped object, comprising the steps of: (i) forming a solidified layer by irradiating a predetermined portion of a powder layer with a light beam, thereby allowing sintering of the powder of the predetermined portion or melting and subsequent solidification thereof; and (ii) forming another solidified layer by newly forming a powder layer on the resulting solidified layer, and then irradiating another predetermined portion of the new powder layer with the light beam, the steps (i) and (ii) being repeatedly performed, wherein the three-dimensional shaped object is manufactured such that it has three different solidified portions of high-density, intermediate-density and low-density solidified portions in at least a part of the object, and wherein the intermediate-density solidified portion is formed to be located in a part of a surface of the three-dimensional shaped object.

10. 发明授权

US07495322B2 Light-emitting device 有权
标题翻译：发光装置
公开(公告)号：US07495322B2
公开(公告)日：2009-02-24
申请号：US10558360
申请日：2004-05-26
申请人： Takuma Hashimoto , Masaru Sugimoto , Ryoji Yokotani , Koji Nishioka , Yutaka Iwahori , Shinya Ishizaki , Toshiyuki Suzuki , Yoshiyuki Uchinono , Masahide Muto , Satoshi Mori , Hideyoshi Kimura
发明人： Takuma Hashimoto , Masaru Sugimoto , Ryoji Yokotani , Koji Nishioka , Yutaka Iwahori , Shinya Ishizaki , Toshiyuki Suzuki , Yoshiyuki Uchinono , Masahide Muto , Satoshi Mori , Hideyoshi Kimura
IPC分类号： H01L21/00 , H01L23/495 , F21V29/00 , H05K1/11 , H05K5/02 , H05K7/18
CPC分类号： H01L33/642 , H01L33/486 , H01L33/62 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2924/00011 , H01L2924/00014 , H01L2924/01015 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/15156 , H01L2924/15159 , H01L2924/15192 , H01L2924/15311 , H01L2924/19107 , H01L2924/00 , H01L2224/05599 , H01L2924/01005 , H01L2924/01033
摘要： A light-emitting device (200) has a submount (100) and a plate for heat transfer (300) having a metallic plate (30). The submount (100) has a mount base (10), at least one light-emitting diode chip (5) mounted thereon and electrically conducting lines (12-17) formed on the mount base (10) to be connected electrically to the light-emitting diode chip (5). A first plane (11) of the mount base (10) of the submount (100) is bonded thermally to the first plate (300). For example, the plate is a circuit board having a metallic plate (30), and the submount (100) is bonded thermally to the metallic plate (30) of the one of the at least one plate (300). In an example, a second plate for heat transfer is also bonded thermally to a second plane of the mount base (100) for providing a plurality of heat transfer paths.
摘要翻译：发光装置（200）具有底座（100）和具有金属板（30）的传热板（300）。基座（100）具有安装基座（10），安装有至少一个发光二极管芯片（5）和形成在安装基座（10）上的电导线（12-17），以电连接到光发光二极管芯片（5）。底座（100）的安装座（10）的第一平面（11）被热接合到第一板（300）。例如，板是具有金属板（30）的电路板，并且底座（100）热接合到至少一个板（300）中的一个的金属板（30）。在一个示例中，用于传热的第二板也热粘合到安装基座（100）的第二平面，以提供多个传热路径。

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