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1. 外观设计

USD440564S1 Magnetic disc storage unit for electronic computer 失效
标题翻译：电子计算机磁盘存储单元
公开(公告)号：USD440564S1
公开(公告)日：2001-04-17
申请号：US29118073
申请日：2000-02-03
申请人： Takashi Ohwada , Toshiyuki Utsuki , Takashi Yamamoto , Kenta Kumagai , Masato Hirano , Takamasa Ishikawa , Kenichi Tateyama
设计人： Takashi Ohwada , Toshiyuki Utsuki , Takashi Yamamoto , Kenta Kumagai , Masato Hirano , Takamasa Ishikawa , Kenichi Tateyama

2. 发明授权

US07150387B2 Process and apparatus for flow soldering 失效
标题翻译：流动焊接的工艺和设备
公开(公告)号：US07150387B2
公开(公告)日：2006-12-19
申请号：US10668355
申请日：2003-09-24
申请人： Atsushi Yamaguchi , Masato Hirano , Yoshinori Sakai
发明人： Atsushi Yamaguchi , Masato Hirano , Yoshinori Sakai
IPC分类号： B23K1/00
CPC分类号： B23K1/08 , B23K1/0016 , B23K2101/36 , H05K3/3447 , H05K3/3468 , H05K2203/1121
摘要： An apparatus for mounting an electric component onto a board by means of a lead-free solder material. The apparatus of the present invention has a solder material supplying chamber in which a melt of the solder material is supplied to the board by a solder material supplying unit such that the solder material adheres to a predetermined portion of the board. The apparatus further includes a cooling chamber in which the board is cooled by a cooling unit such that the solder material adhering to the board is rapidly cooled to solidify. A conditioning chamber can also be positioned between the solder material supplying chamber and the cooling chamber. The conditioning chamber conditions the board such that the solder material adhering to the board is ensured to be a completely molten condition at least before the rapid cooling of the solder material.
摘要翻译：一种通过无铅焊料将电气部件安装在基板上的装置。本发明的装置具有焊料供给室，其中焊料材料的熔体通过焊料供给单元供应到板，使得焊料材料粘附到板的预定部分。该设备还包括冷却室，其中板被冷却单元冷却，使得粘附到板上的焊料材料被快速冷却以固化。调节室也可以位于焊料供应室和冷却室之间。调节室对板进行调节，使得至少在焊料材料的快速冷却之前，确保粘附到板的焊料是完全熔融的状态。

3. 发明授权

US06230393B1 Method and device for mounting electronic component 失效
标题翻译：电子部件安装方法和装置
公开(公告)号：US06230393B1
公开(公告)日：2001-05-15
申请号：US09109352
申请日：1998-07-02
申请人： Masato Hirano , Yoshinori Sakai , Tateo Nakashima
发明人： Masato Hirano , Yoshinori Sakai , Tateo Nakashima
IPC分类号： B23P1900
CPC分类号： H05K13/04 , H05K13/041 , H05K13/0413 , H05K13/0815 , Y10T29/49004 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49137 , Y10T29/49762 , Y10T29/49764 , Y10T29/53 , Y10T29/53039 , Y10T29/53087 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191
摘要： In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle 11 and that of the picked-up component 12 is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette 3 from which the component 12 has been fed is in abnormal condition, as well as the mounting action of the component 12 is stopped.
摘要翻译：在其中通过吸嘴将元件拾取并安装在电路板上的部件安装装置中，测量吸嘴11的中心位置与拾取部件12的中心位置之间的位移量，并且当大于预先确定的值时，产生指示部件12已经被供给的部件盒3处于异常状态的警告以及部件12的安装动作停止。

4. 发明授权

US5743007A Method of mounting electronics component 失效
标题翻译：安装电子部件的方法
公开(公告)号：US5743007A
公开(公告)日：1998-04-28
申请号：US587461
申请日：1996-01-17
申请人： Hiroaki Onishi , Haruto Nagata , Masato Hirano , Kenichiro Suetsugu
发明人： Hiroaki Onishi , Haruto Nagata , Masato Hirano , Kenichiro Suetsugu
IPC分类号： H05K1/11 , H05K3/34
CPC分类号： H05K3/3484 , H05K1/111 , H05K3/3421 , H05K2201/0272 , H05K2201/097 , H05K2201/10689 , H05K2203/0545 , H05K3/3452 , H05K3/3463 , Y02P70/611 , Y02P70/613 , Y10T29/49121 , Y10T29/49144
摘要： A method for mounting on integrated circuit having many leads with narrow pitches on the printed circuit board. In a method, a resist layer is formed between lands on the board, and solder paste is applied with a stencil to the lands so that the positions of the solder paste on the lands are staggered. Then, leads of the integrated circuit are positioned on the lands. Then, reflow soldering of the leads to the lands is performed with the solder paste in a nitrogen environment. In a different embodiment, each land includes a first portion and a second portion having a width narrower than the first portion, and the second portions are arranged staggeredly among the lands. Then, solder paste is applied to the first portions having the wider width. Then, reflow soldering of the leads to the lands is performed with the solder paste in a nitrogen environment. If solder including bismuth is used, reflow soldering can be performed in ambient environment.
摘要翻译：一种用于安装在印刷电路板上具有窄间距的许多引线的集成电路上的方法。在一种方法中，在板上的焊盘之间形成抗蚀剂层，并且将焊膏施加到焊盘上的模板，使得焊盘在焊盘上的位置错开。然后，集成电路的引线位于焊盘上。然后，焊锡膏在氮气环境下进行焊盘的回焊焊接。在不同的实施例中，每个平台包括具有比第一部分窄的宽度的第一部分和第二部分，并且第二部分交错布置在平台之间。然后，将焊膏施加到宽度较宽的第一部分。然后，焊锡膏在氮气环境下进行焊盘的回焊焊接。如果使用包含铋的焊料，则可以在周围环境中进行回流焊接。

5. 发明授权

US4985348A Process for photographic development processing 失效
标题翻译：摄影发展处理过程
公开(公告)号：US4985348A
公开(公告)日：1991-01-15
申请号：US306139
申请日：1989-02-06
申请人： Mitsunori Hirano , Masato Hirano , Morio Yagihara , Hisashi Okada
发明人： Mitsunori Hirano , Masato Hirano , Morio Yagihara , Hisashi Okada
IPC分类号： G03C5/26 , C07D285/12 , C07D285/135 , G03C5/305
CPC分类号： C07D285/135 , G03C5/305
摘要： A process for development-processing a black-and-white silver halide light-sensitive material is disclosed, which comprises using a developer containing at least one compound represented by formulae (I) and (II): ##STR1## wherein R.sub.1 and R.sub.2 each represents hydrogen atom, an alkyl group or an aryl group;M represents hydrogen atom, an alkali metal atom, an alkaline earth metal atom, a quaternary ammonium salt, a quaternary phosphonium salt, an amidino group or a group capable of being converted to hydrogen or an alkali metal atom under alkaline conditions;n represents an integer of 1 or more; andZ.sup..crclbar. represents an anion.

6. 发明申请

US20080210604A1 ARTICLE HAVING A CIRCUIT SOLDERED WITH PARTS AND METHOD FOR RECYCLING WASTES OF THE SAME 审中-公开
标题翻译：具有与零件一起焊接的电路的物品及其回收废物的方法
公开(公告)号：US20080210604A1
公开(公告)日：2008-09-04
申请号：US12109877
申请日：2008-04-25
申请人： Kenichiro Suetsugu , Shunji Hibino , Masato Hirano , Atsushi Yamaguchi , Mikiya Nakata
发明人： Kenichiro Suetsugu , Shunji Hibino , Masato Hirano , Atsushi Yamaguchi , Mikiya Nakata
IPC分类号： B07C5/34 , H05K1/00 , H05K5/00
CPC分类号： C22B25/06 , C22B13/00 , H01H2009/0077 , H05K1/0266 , H05K1/18 , H05K3/3463 , H05K13/0465 , H05K2201/09936 , H05K2203/178 , Y02P10/214 , Y02P10/228 , Y02P70/611 , Y02P70/613 , Y10T29/49117 , Y10T29/49819 , Y10T29/49821 , Y10T29/49822
摘要： The disclosure provides an article having a circuit mounted with parts characterized by comprising an electronic part soldered with a lead free solder and having an identification marking indicating no inclusion of lead and an electrical appliance including the same. The present invention also provides a recycling method of wastes of the same. The present invention can offer an article having a circuit mounted with parts and an electrical appliance including the same both of which facilitate identification whether lead which is poisonous to human body is contained or not.
摘要翻译：本公开提供了一种具有电路的物品，其具有部件，其特征在于包括用无铅焊料焊接的电子部件，并且具有指示不包括引线的识别标记和包括其的电器。本发明还提供了一种废物的回收方法。本发明可以提供具有安装有部件的电路和包括该电路的电器的物品，两者都有助于识别是否含有对人体有毒的铅。

7. 发明授权

US4931378A Method of processing silver halide photographic materials where the rollers are intermittently rotated during stand-by 失效
标题翻译：处理卤化银照相材料的方法，其中辊在待机期间间歇地旋转
公开(公告)号：US4931378A
公开(公告)日：1990-06-05
申请号：US279897
申请日：1988-12-05
申请人： Masato Hirano , Eiichi Tadokoro
发明人： Masato Hirano , Eiichi Tadokoro
IPC分类号： G03C5/26 , G03C1/06 , G03C5/29 , G03D3/00 , G03D3/08
CPC分类号： G03C5/29 , G03C1/061
摘要： Disclosed is a method for processing a silver halide photographic material having at least one silver halide emulsion layer on a support and containing at least one hydrazine derivative in said silver halide emulsion layer or in another hydrophilic colloid layer with a roller-conveying type automatic developing machine using a dihydroxybenzene developer containing a sulfite preservative in an amount of 0.15 mol/liter or more at pH of 10.5 to 12.3, which method is characterized in that at least the roller which is in contact with both the developer and air, among the rollers of the said developing machine, is continuously rotated at a determined speed during conveyance or processing of the material during a processing phase, and intermittently rotated during a stand-by phase. By the method, the photographic material may be processed stably and rapidly for a long period of time to give an image having a high contrast and a high blackened density. The method requires only a small amount of replenisher to compensate for the processing solution fatigued after repeated use.

8. 发明授权

US07667299B2 Circuit board and method for mounting chip component 失效
标题翻译：电路板和安装芯片组件的方法
公开(公告)号：US07667299B2
公开(公告)日：2010-02-23
申请号：US10587280
申请日：2005-01-25
申请人： Masato Mori , Masato Hirano , Hiroaki Onishi , Kiyoshi Nakanishi , Akihiko Odani
发明人： Masato Mori , Masato Hirano , Hiroaki Onishi , Kiyoshi Nakanishi , Akihiko Odani
IPC分类号： H01L29/06
CPC分类号： H05K1/023 , H01L2224/16225 , H01L2924/19105 , H05K1/181 , H05K3/3442 , H05K2201/10515 , H05K2201/1053 , H05K2201/10636 , Y02P70/611
摘要： A circuit board includes a substrate including electrode patterns formed thereon, first chip components mounted on the substrate and a second chip component mounted on a side of electrodes of the first chip components opposite from the substrate. The second chip component is bonded at one electrode to an electrode of the first chip component and is also bonded at the other electrode to an electrode of the first chip component. By stacking chip components in plural stages, it is possible to mount chip components with a high density on the substrate, thereby enabling reduction of the size of the circuit board.
摘要翻译：电路板包括其上形成有电极图案的基板，安装在基板上的第一芯片部件和安装在与基板相对的第一芯片部件的电极侧的第二芯片部件。第二芯片部件在一个电极处接合到第一芯片部件的电极，并且还在另一个电极处接合到第一芯片部件的电极。通过以多级堆叠芯片部件，可以在基板上安装高密度的芯片部件，从而能够减小电路板的尺寸。

9. 发明授权

US07471260B2 Semiconductor memory module having built-in antenna 失效
标题翻译：具有内置天线的半导体存储模块
公开(公告)号：US07471260B2
公开(公告)日：2008-12-30
申请号：US11793301
申请日：2006-02-02
申请人： Shozo Ochi , Norihito Tsukahara , Kazuhiro Ikurumi , Hidenobu Nishikawa , Masato Hirano
发明人： Shozo Ochi , Norihito Tsukahara , Kazuhiro Ikurumi , Hidenobu Nishikawa , Masato Hirano
IPC分类号： H01Q1/36
CPC分类号： H01Q1/2275 , H01L23/49855 , H01L25/0652 , H01L25/162 , H01L2223/6677 , H01L2224/16225 , H01L2224/16227 , H01L2924/19105 , H01Q1/38 , H01Q7/00
摘要： A semiconductor memory module formed of a mounted module (12) having a semiconductor memory device (16) and a control semiconductor device (18), a circuit board (14) which contains connection terminal (20) coupled with the control semiconductor device (18) and disposed so that it is exposed from the surface of outer case (42), and an antenna connection terminal electrode (22) disposed in the inside of outer case (42); and an antenna module (24) having a sheet board (26) which includes an antenna (28) disposed on one of the surfaces in the neighborhood of the edge along the sides, a layer (30) of magnetic substance disposed on the other surface, and an antenna terminal electrode (38) disposed on the one or the other surface. The antenna module (24) is overlaid on the mounted module (12), and the antenna connection terminal electrode (22) is connected with the antenna terminal electrode (38).
摘要翻译：一种由具有半导体存储器件（16）和控制半导体器件（18）的安装模块（12）形成的半导体存储器模块，包含与控制半导体器件（18）耦合的连接端子（20）的电路板（14））并且被设置成从外壳（42）的表面露出，以及设置在外壳（42）内部的天线连接端子电极（22）。以及具有片材板（26）的天线模块（24），所述片材板（26）包括设置在沿着所述边缘的所述边缘附近的一个表面上的天线（28），设置在另一个表面上的磁性物质层，以及设置在一个或另一个表面上的天线端子电极（38）。天线模块（24）重叠在安装的模块（12）上，天线连接端子电极（22）与天线端子电极（38）连接。

10. 发明授权

US06708402B2 Method and device for mounting electronic component 失效
标题翻译：电子部件安装方法和装置
公开(公告)号：US06708402B2
公开(公告)日：2004-03-23
申请号：US09809488
申请日：2001-03-15
申请人： Masato Hirano , Yoshinori Sakai , Tateo Nakashima
发明人： Masato Hirano , Yoshinori Sakai , Tateo Nakashima
IPC分类号： H05K330
CPC分类号： H05K13/04 , H05K13/041 , H05K13/0413 , H05K13/0815 , Y10T29/49004 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49137 , Y10T29/49762 , Y10T29/49764 , Y10T29/53 , Y10T29/53039 , Y10T29/53087 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191
摘要： In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle 11 and that of the picked-up component 12 is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette 3 from which the component 12 has been fed is in abnormal condition, as well as the mounting action of the component 12 is stopped.
摘要翻译：在其中通过吸嘴将元件拾取并安装在电路板上的部件安装装置中，测量吸嘴11的中心位置与拾取部件12的中心位置之间的位移量，并且当大于预先确定的值时，产生指示部件12已经被供给的部件盒3处于异常状态的警告以及部件12的安装动作停止。

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