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    • 1. 发明授权
    • Sputtering system
    • 溅射系统
    • US6077406A
    • 2000-06-20
    • US292623
    • 1999-04-16
    • Takashi KawakuboKenya SanoRyoichi OharaKatsutaro Ichihara
    • Takashi KawakuboKenya SanoRyoichi OharaKatsutaro Ichihara
    • C23C14/22C23C14/34C23C14/35H01J37/34H01L21/203H01L39/24C23C14/00
    • C23C14/225C23C14/3407C23C14/35H01J37/3405
    • A sputtering system comprises: a substrate holder for holding a substrate; and a cathode having a magnet therein and holding a target, the cathode being off-axis aligned with respect to the substrate. The cathode may comprise a plurality of cathodes, each of which has a flat backing plate, and two targets supported on both sides of the backing plate, the target being off-axis aligned with respect to the thin-film deposited surface of the substrate. The target may be supported on the side surface of a cylindrical or prismatic cathode body having a magnet therein, and the target being off-axis aligned with respect to the thin-film deposited surface of the substrate. Thus, if at least a part of the plurality of cathodes face the thin-film deposited surface of the substrate to be off-axis aligned, it is possible to enhance the inplane uniformity of film thickness, composition and crystallinity of a thin-film deposited on a substrate having a large diameter while inhibiting the substrate from being damaged by the irradiation with high energy particles, and to accelerate the thin film deposition rate.
    • 溅射系统包括:用于保持基板的基板保持器; 以及其中具有磁体并保持靶的阴极,阴极相对于衬底偏轴对准。 阴极可以包括多个阴极,每个阴极具有平的背板,并且支撑在背板的两侧上的两个靶,靶相对于衬底的薄膜沉积表面离轴对准。 靶可以被支撑在其中具有磁体的圆柱形或棱柱形阴极体的侧表面上,并且靶相对于衬底的薄膜沉积表面离轴对准。 因此,如果多个阴极的至少一部分面对基板的薄膜沉积表面以使其离轴对准,则可以增强薄膜沉积的薄膜厚度,组成和结晶度的面内均匀性 在具有大直径的基板上,同时抑制基板被高能粒子的照射损坏,并且加速薄膜沉积速率。