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1. 发明授权

US4905838A Easily-openable packaging container having notched inner surface layer 失效
标题翻译：容易开封的包装容器具有切口内表面层
公开(公告)号：US4905838A
公开(公告)日：1990-03-06
申请号：US279279
申请日：1988-12-02
申请人： Takanori Suzuki , Yukio Takata , Takeshi Shinohara
发明人： Takanori Suzuki , Yukio Takata , Takeshi Shinohara
IPC分类号： B32B7/06 , B32B27/08 , B65D17/40 , B65D77/20 , B65D85/72
CPC分类号： B65D77/2052 , B29C65/18 , B29C65/745 , B29C65/76 , B29C66/112 , B29C66/131 , B29C66/24221 , B29C66/53461 , B29C66/542 , B29C66/71 , B29C66/723 , B29C66/7392 , B29C66/81427 , B29C66/81431 , B29C66/8322 , B32B7/06 , B29C2793/0054 , B29C66/72321 , B29C66/72341 , B29C66/73771 , B29C66/73773 , B29C66/73775 , B29C66/73921 , B29C66/8161 , B29C66/8181 , B65D2577/2033 , B65D2577/205 , B65D2577/2066 , B65D2577/2083
摘要： A multilayer container having a flange portion and an easily-openable packaging container packaged by using said multilayer container, wherein the interlaminar strength of said multilayer container is smaller than the peeling strength between said flange portion and the lid member, and a ring notch is provided to an inner surface layer of the flange portion inside a heat sealed portion.The packaging container has both a good sealing property and an easy openability and has an excellent resistance to boiling and retort treatment, and 9 peeled surface having a good appearance.A method for producing said multilayer container and a method for producing said packaging container, and an apparatus to be used for producing said multilayer container, and a method for filling and packaging, and an apparatus for filling and packaging are disclosed.

2. 发明授权

US5178293A Easily-openable packaging container 失效
标题翻译：容易打开的包装容器
公开(公告)号：US5178293A
公开(公告)日：1993-01-12
申请号：US732903
申请日：1991-08-07
申请人： Takanori Suzuki , Yukio Takata , Takeshi Shinohara
发明人： Takanori Suzuki , Yukio Takata , Takeshi Shinohara
IPC分类号： B32B7/06 , B65D17/40 , B65D77/20
CPC分类号： B32B7/06 , B65D2577/2033 , B65D2577/205 , B65D2577/2066 , B65D2577/2083
摘要： A multilayer container having a flange portion and an easily-openable packaging container packaged by using the multilayer container, wherein the interlaminar strength of the multilayer container is smaller than the peeling strength between the flange portion and the lid member, and a ring notch is provided to an inner surface layer of the flange portion inside a heat seal portion.The packaging container has both a good sealing property and an easy openability and has an excellent resistance to boiling and a retort treatment, and peeled surface has a good appearance.A method for producing the multilayer container and a method for producing the packaging container, and an apparatus to be used for producing the multilayer container, and a method for filling and packaging, and an apparatus for filling and packaging are disclosed.
摘要翻译：一种多层容器，其具有通过使用多层容器包装的凸缘部和容易打开的包装容器，其中多层容器的层间强度小于凸缘部和盖构件之间的剥离强度，并且设置有环形凹口到热封部分内的凸缘部分的内表面层。包装容器具有良好的密封性和易开启性，并且具有优异的耐沸腾性和蒸煮处理性，并且剥离表面具有良好的外观。公开了一种多层容器的制造方法及包装容器的制造方法以及多层容器的制造装置，填充包装方法以及填充包装装置。

3. 发明授权

US08476490B2 Method for production of moth orchid having modified flower color 有权
标题翻译：具有改良花色的蛾兰花的生产方法
公开(公告)号：US08476490B2
公开(公告)日：2013-07-02
申请号：US12596739
申请日：2008-04-25
申请人： Satoshi Araki , Takanori Suzuki , Kouichi Katayama
发明人： Satoshi Araki , Takanori Suzuki , Kouichi Katayama
IPC分类号： A01H5/00 , C12N15/82
CPC分类号： C12N15/8243 , A01H5/10 , C12N9/0004 , C12N9/0071
摘要： To provide a method for changing the flower color of a moth orchid, particularly a method for producing a moth orchid having a red or reddish flower color from a white moth orchid.A method for producing a moth orchid having a modified flower color, which comprises transfecting a moth orchid with a gene encoding a flavanone 3-hydroxylase, a gene encoding a flavonoid 3′-hydroxylase, a gene encoding a dihydroflavonol 4-reductase and a gene encoding an anthocyanidin synthase and expressing the genes.
摘要翻译：提供一种改变蛾兰花的颜色的方法，特别是用于生产具有来自白蛾兰花的红色或红色花色的蛾兰的方法。一种生产具有改良花色的蛾兰的方法，其包括用编码黄酮酮3-羟化酶的基因转染蛾兰，编码黄酮3'-羟化酶的基因，编码二氢黄酮醇-4-还原酶的基因和基因编码花青素合酶并表达基因。

4. 发明授权

US08429812B2 Method of manufacturing a wire 有权
标题翻译：制造电线的方法
公开(公告)号：US08429812B2
公开(公告)日：2013-04-30
申请号：US12699237
申请日：2010-02-03
申请人： Satoru Yoshinaga , Toshiyuki Yamada , Takanori Suzuki
发明人： Satoru Yoshinaga , Toshiyuki Yamada , Takanori Suzuki
IPC分类号： H01R43/00
CPC分类号： H01B13/0006 , H01B13/0292 , Y10T29/49071 , Y10T29/49117 , Y10T29/49194 , Y10T29/49195 , Y10T29/49197 , Y10T29/49199
摘要： A manufacturing method of an ultrafine wire including a conductor formed from a plurality of wire, the method comprising: twisting three wires into a twisted wires; and forming the conductor by compressing the twisted wires through a compressing hole of a compressing die after the twisting. A ratio of a cross section of the conductor after compressing to an area of the compressing hole is 80% to 83%.
摘要翻译：一种包括由多条导线形成的导体的超细线的制造方法，所述方法包括：将三根线绞合成双绞线; 并且通过在扭转之后通过压缩模具的压缩孔压缩绞合线来形成导体。压缩后的导体的截面与压缩孔的面积的比率为80％〜83％。

5. 发明授权

US08309433B2 Method of manufacturing optical sensor 有权
标题翻译：光学传感器的制造方法
公开(公告)号：US08309433B2
公开(公告)日：2012-11-13
申请号：US13211161
申请日：2011-08-16
申请人： Yasuhiro Matsuki , Takanori Suzuki , Koji Tsuduki , Shin Hasegawa , Tadashi Kosaka , Akiya Nakayama
发明人： Yasuhiro Matsuki , Takanori Suzuki , Koji Tsuduki , Shin Hasegawa , Tadashi Kosaka , Akiya Nakayama
IPC分类号： H01L21/30
CPC分类号： H01L27/14618 , H01L27/14685 , H01L2924/0002 , H01L2924/00
摘要： A method of manufacturing an optical sensor includes the steps of providing a semiconductor wafer having a plurality of pixel areas; forming a grid-like rib enclosing each pixel area on the semiconductor wafer, the grid-like rib having a predetermined width and being formed from a fixing member; providing a light-transmissive substrate having a gap portion on a main surface thereof, the gap portion having at least one of a groove having a width smaller than the grid-like rib and a plurality of through-holes; fixing the semiconductor wafer and the light-transmissive substrate such that the grid-like rib and the gap portion face each other; and cutting the fixed semiconductor wafer and light-transmissive substrate into pieces such that each piece includes one pixel area.
摘要翻译：一种制造光学传感器的方法包括以下步骤：提供具有多个像素区域的半导体晶片; 形成包围所述半导体晶片上的每个像素区域的格栅状肋，所述格子状肋具有预定的宽度并由固定构件形成; 提供在其主表面上具有间隙部分的透光基板，所述间隙部分具有宽度小于所述格子状肋条的槽和多个通孔中的至少一个; 固定所述半导体晶片和所述透光性基板，使得所述格子状肋和所述间隙部彼此面对; 并且将固定的半导体晶片和透光基板切割成片，使得每个片包括一个像素区域。

6. 发明申请

US20120044415A1 IMAGE PICKUP MODULE AND CAMERA 有权
标题翻译：图像拾取模块和摄像机
公开(公告)号：US20120044415A1
公开(公告)日：2012-02-23
申请号：US13212935
申请日：2011-08-18
申请人： Koji Tsuduki , Shin Hasegawa , Tadashi Kosaka , Yasuhiro Matsuki , Takanori Suzuki , Akiya Nakayama
发明人： Koji Tsuduki , Shin Hasegawa , Tadashi Kosaka , Yasuhiro Matsuki , Takanori Suzuki , Akiya Nakayama
IPC分类号： H04N5/225 , H01L27/146
CPC分类号： H01L27/14618 , H01L27/14636 , H01L2224/13 , H04N5/2253
摘要： An image pickup module includes a cover member, an image pickup device chip including photodiodes, a fixing member which is arranged around the image pickup device chip and which connects the cover member and the image pickup device chip together, a rewiring substrate arranged on the side opposite to the cover member of the image pickup device chip, connection members for connecting the image pickup device chip with the rewiring substrate, and a space surrounded by the cover member, the image pickup device chip, and the fixing member. The image pickup device chip includes a semiconductor substrate. The semiconductor substrate includes through-hole electrodes penetrating the substrate. When an area corresponding to the fixing member in the orthogonal projection of the image pickup module with respect to the cover module is defined as a fixed area, the through-hole electrodes and the connection members are arranged in the fixed area.
摘要翻译：图像拾取模块包括盖构件，包括光电二极管的图像拾取装置芯片，布置在图像拾取装置芯片周围并将盖构件和图像拾取装置芯片连接在一起的固定构件，布置在侧面的重新布线基板与图像拾取装置芯片的盖构件相对的连接构件，用于将图像拾取装置芯片与重新布线基板连接的连接构件以及由盖构件，图像拾取装置芯片和固定构件包围的空间。图像拾取器件芯片包括半导体衬底。半导体衬底包括穿透衬底的通孔电极。当将图像拾取模块相对于盖模块的正交投影中的固定构件对应的区域定义为固定区域时，通孔电极和连接构件布置在固定区域中。

7. 发明申请

US20110205414A1 SOLID-STATE IMAGE PICKUP DEVICE AND IMAGE PICKUP DEVICE 有权
标题翻译：固态图像拾取器件和图像拾取器件
公开(公告)号：US20110205414A1
公开(公告)日：2011-08-25
申请号：US13033376
申请日：2011-02-23
申请人： Katsuhisa Mochiduki , Takanori Suzuki , Fujio Ito
发明人： Katsuhisa Mochiduki , Takanori Suzuki , Fujio Ito
IPC分类号： H04N5/335 , H01L31/0203
CPC分类号： H01L27/14618 , H01L2924/0002 , H04N5/335 , H01L2924/00
摘要： A solid-state image pickup device including: a resin package which includes a recessed section; a solid-state image pickup element disposed in the recessed section; and a cover fixed to the recessed section via a fixing member so as to cover the solid-state image pickup element, wherein: the resin package includes a substrate integrated therewith; the substrate includes a first protruding section, a second protruding section and a branched section, the first and second protruding sections protruding from a first side of the resin package, and the branched section being disposed inside the resin package and disposed between the first and second protruding sections; and an outer peripheral section of the fixing member is disposed inside an end of the branched section when seen from the direction in which light is incident.
摘要翻译：一种固态摄像装置，包括：树脂封装，其包括凹部; 设置在所述凹部中的固态图像拾取元件; 以及通过固定构件固定到所述凹部的盖，以覆盖所述固态图像拾取元件，其中：所述树脂封装包括与其一体化的基板; 所述基板包括第一突出部分，第二突出部分和分支部分，所述第一和第二突出部分从所述树脂封装的第一侧突出，并且所述分支部分设置在所述树脂封装内部并且设置在所述第一和第二突出部分之间突出部分并且当从光入射的方向观察时，所述固定构件的外周部设置在所述分支部的端部的内侧。

8. 发明申请

US20100264199A1 JOINING METHOD FOR METAL MEMBERS 审中-公开
标题翻译：金属成员接合方法
公开(公告)号：US20100264199A1
公开(公告)日：2010-10-21
申请号：US12799066
申请日：2010-04-16
申请人： Taisei Wakisaka , Takanori Suzuki , Tokuji Okumura
发明人： Taisei Wakisaka , Takanori Suzuki , Tokuji Okumura
IPC分类号： B23K1/20
CPC分类号： B23K1/19 , B23K35/282 , B23K2103/20
摘要： The present invention provides a joining method for metal members, including: preparing an Fe-based metal member of Fe-based material, and an Al-based metal member of Al-based material; providing a Zn-based brazing filler metal between the Fe-based metal member and the Al-based metal member; and joining the Fe-based metal member and the Al-based metal member, wherein the Zn-based brazing filler metal includes: 2.0 mass % or less of Al; and the balance of Zn and inevitable impurities, and in the joining, the Zn-based brazing filler metal is heated such that a liquid phase of the Zn-based brazing filler metal is generated, and in solidification of the Zn-based brazing filler metal in a condition of the liquid phase, Zn primary crystal or eutectic of Zn and Al is crystallized.
摘要翻译：本发明提供一种金属构件的接合方法，包括：制备Fe基材料的Fe基金属构件和Al基材料的Al基金属构件; 在Fe基金属构件和Al基金属构件之间提供Zn基钎料; 并且接合Fe基金属构件和Al基金属构件，其中所述Zn基钎料包括：2.0质量％以下的Al; 并且Zn和不可避免的杂质的平衡，并且在接合时，加热Zn基钎料，使得Zn系钎料的液相产生，并且在Zn系钎焊金属在液相状态下，Zn原子晶或Zn和Al的共晶结晶化。

9. 发明申请

US20100200272A1 ULTRAFINE WIRE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：超导线及其制造方法
公开(公告)号：US20100200272A1
公开(公告)日：2010-08-12
申请号：US12699237
申请日：2010-02-03
申请人： Satoru YOSHINAGA , Toshiyuki Yamada , Takanori Suzuki
发明人： Satoru YOSHINAGA , Toshiyuki Yamada , Takanori Suzuki
IPC分类号： H01B5/08 , H01R43/00
CPC分类号： H01B13/0006 , H01B13/0292 , Y10T29/49071 , Y10T29/49117 , Y10T29/49194 , Y10T29/49195 , Y10T29/49197 , Y10T29/49199
摘要： A manufacturing method of an ultrafine wire including a conductor formed from a plurality of wire, the method comprising: twisting three wires into a twisted wires; and forming the conductor by compressing the twisted wires through a compressing hole of a compressing die after the twisting. A ratio of a cross section of the conductor after compressing to an area of the compressing hole is 80% to 83%.
摘要翻译：一种包括由多条导线形成的导体的超细线的制造方法，所述方法包括：将三根线绞合成双绞线; 并且通过在扭转之后通过压缩模具的压缩孔压缩绞合线来形成导体。压缩后的导体的截面与压缩孔的面积的比率为80％〜83％。

10. 发明申请

US20090298237A1 SEMICONDUCTOR MODULE 有权
标题翻译：半导体模块
公开(公告)号：US20090298237A1
公开(公告)日：2009-12-03
申请号：US12490656
申请日：2009-06-24
申请人： Koji Tsuduki , Takanori Suzuki
发明人： Koji Tsuduki , Takanori Suzuki
IPC分类号： H01L21/56
CPC分类号： H01L21/56 , H01L23/3121 , H01L2224/45144 , H01L2224/49171 , H01L2924/00
摘要： A semiconductor module includes a semiconductor chip sealed with an encapsulation resin prevented from overflowing from an inside of the outer edge by a wiring pattern extended portion extending from the wiring pattern along an outer edge of a solder resist pattern at an outside of the outer edge of the solder resist pattern.
摘要翻译：半导体模块包括密封的半导体芯片，其封装树脂被防止从外边缘的内侧溢出的布线图案延伸部分沿着沿阻焊图案的外边缘延伸的布线图案延伸部分在外部边缘处阻焊图案。

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