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1. 发明授权

US5169830A Superconducting material 失效
标题翻译：超导材料
公开(公告)号：US5169830A
公开(公告)日：1992-12-08
申请号：US567958
申请日：1990-08-15
申请人： Takahiro Wada , Shinichi Koriyama , Takeshi Sakurai , Nobuo Suzuki , Takayuki Miyatake , Hisao Yamauchi , Naoki Koshizuka , Shoji Tanaka
发明人： Takahiro Wada , Shinichi Koriyama , Takeshi Sakurai , Nobuo Suzuki , Takayuki Miyatake , Hisao Yamauchi , Naoki Koshizuka , Shoji Tanaka
IPC分类号： H01L39/12
CPC分类号： H01L39/126 , Y10S505/778
摘要： A superconductive material is disclosed which has the following composition:(R.sub.1-x Ca.sub.x)(Ba.sub.1-y La.sub.y).sub.2 Cu.sub.4 O.sub.8wherein R is at least one element selected from Y, Nd, Sm, Eu, Gd, Dy, Ho, Er, Tm, Yb and Lu, x is a number in the range of 0-0.3 and y is a number in the range of 0.001-0.3 with the proviso that y is not greater than 0.2 when x is not 0.

2. 发明授权

US5563117A Copper oxide superconductor, a process for its production, and a copper used therein 失效
标题翻译：氧化铜超导体，其生产方法和其中使用的铜
公开(公告)号：US5563117A
公开(公告)日：1996-10-08
申请号：US357100
申请日：1994-12-15
申请人： Shinichi Koriyama , Takaaki Ikemachi , Hisao Yamauchi
发明人： Shinichi Koriyama , Takaaki Ikemachi , Hisao Yamauchi
IPC分类号： H01L39/12 , H01L39/24 , H01B12/00 , C04B35/505 , C04B35/624
CPC分类号： H01L39/2451 , H01L39/126 , Y10S505/727 , Y10S505/729 , Y10S505/78
摘要： In the production of a 124-type or 123-type superconductor by a sol-gel method using alkoxides of respective metals, the use of a compound wherein a secbutoxy group and a hydroxy group are coordinated with a copper atom gives a superconductor composed of flat particles having a broad C plane. The dimensional ratio defined by l/d is at least 6.7 in the case of the 124-type or is at least 8.4 in the case of the 123-type. It shows a superconducting property at a liquid nitrogen temperature. This superconductor shows a higher critical current density than one obtained by a sintering method.
摘要翻译：在通过使用各种金属的醇盐的溶胶 - 凝胶法制备124型或123型超导体时，使用其中二丁氧基和羟基与铜原子配位的化合物，得到由平面构成的超导体具有宽C平面的颗粒。在124型的情况下，由l / d定义的尺寸比例至少为6.7，在123型的情况下为至少8.4。它在液氮温度下显示超导特性。该超导体显示比通过烧结方法获得的密度高的临界电流密度。

3. 发明授权

US5578553A 1-2-4 copper oxide superconductor, a process for its production, and a copper used therein 失效
标题翻译： 1-2-4铜氧化物超导体，其生产方法和其中使用的铜
公开(公告)号：US5578553A
公开(公告)日：1996-11-26
申请号：US345229
申请日：1994-11-28
申请人： Shinichi Koriyama , Takaaki Ikemachi , Hisao Yamauchi
发明人： Shinichi Koriyama , Takaaki Ikemachi , Hisao Yamauchi
IPC分类号： H01L39/12 , H01L39/24 , C04B35/505
CPC分类号： H01L39/2451 , H01L39/126 , Y10S505/727 , Y10S505/729 , Y10S505/78
摘要： In the production of a 124-type or 123-type superconductor by a sol-gel method using alkoxides of respective metals, the use of a compound wherein a sec-butoxy group and a hydroxy group are coordinated with a copper atom gives a superconductor composed of flat particles having a broad C plane. The dimensional ratio defined by l/d is at least 6.7 in the case of the 124-type or is at least 8.4 in the case of the 123-type. It shows a superconducting property at a liquid nitrogen temperature. This superconductor shows a higher critical current density than one obtained by a sintering method.
摘要翻译：在通过使用各种金属的醇盐的溶胶 - 凝胶法制备124型或123型超导体中，使用其中仲丁氧基和羟基与铜原子配位的化合物，得到了构成的超导体的具有宽C平面的平坦颗粒。在124型的情况下，由l / d定义的尺寸比例至少为6.7，在123型的情况下为至少8.4。它在液氮温度下显示超导特性。该超导体显示比通过烧结方法获得的密度高的临界电流密度。

4. 发明授权

US5504226A Copper oxide superconductor, a process for its production, and a copper complex used therein 失效
标题翻译：氧化铜超导体，其生产方法和其中使用的铜络合物
公开(公告)号：US5504226A
公开(公告)日：1996-04-02
申请号：US344741
申请日：1994-11-23
申请人： Shinichi Koriyama , Takaaki Ikemachi , Hisao Yamauchi
发明人： Shinichi Koriyama , Takaaki Ikemachi , Hisao Yamauchi
IPC分类号： H01L39/12 , H01L39/24 , C07F1/08 , C04B35/00
CPC分类号： H01L39/2451 , H01L39/126 , Y10S505/727 , Y10S505/729 , Y10S505/78
摘要： In the production of a 124-type or 123-type superconductor by a sol-gel method using alkoxides of respective metals, the use of a compound wherein a sec-butoxy group and a hydroxy group are coordinated with a copper atom gives a superconductor composed of flat particles having a broad C plane. The dimensional ratio defined by l/d is at least 6.7 in the case of the 124-type or is at least 8.4 in the case of the 123-type. It shows a superconducting property at a liquid nitrogen temperature. This superconductor shows a higher critical current density than one obtained by a sintering method.
摘要翻译：在通过使用各种金属的醇盐的溶胶 - 凝胶法制备124型或123型超导体中，使用其中仲丁氧基和羟基与铜原子配位的化合物，得到了构成的超导体的具有宽C平面的平坦颗粒。在124型的情况下，由l / d定义的尺寸比例至少为6.7，在123型的情况下为至少8.4。它在液氮温度下显示超导特性。该超导体显示比通过烧结方法获得的密度高的临界电流密度。

5. 发明授权

US06188368B1 Slot antenna 有权
标题翻译：插槽天线
公开(公告)号：US06188368B1
公开(公告)日：2001-02-13
申请号：US09258830
申请日：1999-02-26
申请人： Shinichi Koriyama , Kenji Kitazawa , Hidehiro Minamiue
发明人： Shinichi Koriyama , Kenji Kitazawa , Hidehiro Minamiue
IPC分类号： H01Q1300
CPC分类号： H01Q13/10 , H01L2223/6677 , H01L2224/48227 , H01L2224/73265 , H01L2924/15313 , H01Q13/18
摘要： A slot antenna comprising a dielectric substrate, a high-frequency signal transmission line formed on one surface of said dielectric substrate and having an open end, and a ground layer formed on the other surface of said dielectric substrate, said ground layer having a slot at a position opposed to the open end of said transmission line, wherein a dielectric plate for impedance matching is laminated on the surface of said ground layer on the side where said slot is formed so as to cover said slot. The slot antenna not only features a high antenna efficiency but also can be easily and cheaply produced by a layer-laminating method which is a generally employed technology for producing multi-layer wiring substrates. Besides, the slot antenna has a very simple structure which is small in size and is light in weight, and can be very well adapted to the systems that require these characteristics.
摘要翻译：一种缝隙天线，包括电介质基片，形成在所述电介质基片的一个表面上并具有开口端的高频信号传输线，以及形成在所述电介质基底的另一个表面上的接地层，所述接地层在与所述传输线的开口端相对的位置，其中用于阻抗匹配的电介质板层叠在所述接地层的形成所述槽的一侧的表面上以覆盖所述槽。缝隙天线不仅具有高的天线效率，而且可以通过层叠方法容易且廉价地制造，层叠方法是通常用于制造多层布线基板的技术。此外，缝隙天线具有体积小且重量轻的非常简单的结构，并且可以非常适合于需要这些特性的系统。

6. 发明授权

US06870438B1 Multi-layered wiring board for slot coupling a transmission line to a waveguide 有权
标题翻译：用于将传输线连接到波导的槽的多层布线板
公开(公告)号：US06870438B1
公开(公告)日：2005-03-22
申请号：US09709098
申请日：2000-11-10
申请人： Naoyuki Shino , Shinichi Koriyama , Kenji Kitazawa , Hidehiro Minamiue
发明人： Naoyuki Shino , Shinichi Koriyama , Kenji Kitazawa , Hidehiro Minamiue
IPC分类号： H01P5/107 , H05K1/02
CPC分类号： H01L23/66 , H01L24/48 , H01L2223/6633 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01021 , H01L2924/01079 , H01L2924/09701 , H01L2924/15153 , H01L2924/1517 , H01L2924/16152 , H01L2924/16195 , H01L2924/19039 , H01P5/107 , H05K1/0237 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A wiring board includes a dielectric substrate, a signal transmission line formed on one surface of the dielectric substrate, a grounded layer formed on the other surface of the dielectric substrate, and a connection portion for connecting portion for connecting the signal transmission line to a waveguide, the connection portion being formed on the grounded layer. The grounded layer has a slot at a position opposed to an end of the signal transmission line. The connection portion includes a first dielectric portion disposed to cover the slot of the ground layer, a second dielectric portion laminated on the first dielectric portion, and a patch conductor provided at a position opposed to said slot on an interface between the first dielectric portion and the second dielectric portion. The wiring board enables the signals to be efficiently transmitted from the signal transmission line to the waveguide with a small loss and a small reflection.
摘要翻译：布线基板包括电介质基板，形成在电介质基板的一个表面上的信号传输线，形成在电介质基板的另一个表面上的接地层，以及用于将信号传输线连接到波导的连接部分的连接部分连接部分形成在接地层上。接地层在与信号传输线的端部相对的位置处具有槽。连接部分包括设置成覆盖接地层的槽的第一电介质部分，层压在第一电介质部分上的第二电介质部分，以及配置在第一电介质部分和第二电介质部分之间的界面上与所述槽相对的位置第二电介质部分。布线板使得信号能够以较小的损耗和小的反射从信号传输线有效地传输到波导。

7. 发明授权

US5952709A High-frequency semiconductor device and mounted structure thereof 失效
标题翻译：高频半导体器件及其安装结构
公开(公告)号：US5952709A
公开(公告)日：1999-09-14
申请号：US884223
申请日：1997-06-27
申请人： Kenji Kitazawa , Shinichi Koriyama , Mikio Fujii
发明人： Kenji Kitazawa , Shinichi Koriyama , Mikio Fujii
IPC分类号： H01L23/367 , H01L23/66 , H05K1/02 , H05K3/34 , H01L23/528
CPC分类号： H01L23/66 , H01L23/3677 , H05K1/0243 , H01L2224/16 , H01L2224/16225 , H01L2924/0102 , H01L2924/01025 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/16195 , H01L2924/3011 , H05K2201/10234 , H05K2201/10727 , H05K2201/10969 , H05K3/341 , H05K3/3442
摘要： A high-frequency semiconductor device contains a semiconductor element in a cavity formed by a dielectric board and a cap. A first high-frequency transmission line connected to the semiconductor element is formed on the surface of said dielectric board in said cavity and a second high-frequency transmission line is formed on the bottom surface of said dielectric board, so that said first high-frequency transmission line and said second high-frequency transmission line are electromagnetically coupled together. In this semiconductor devise in which the first transmission line and the second transmission line are electromagnetically coupled together, the transmission lines need not be passed over the side wall of the cap, and neigther reflection loss or radiation loss takes place on the side wall. Besides, transmission loss of high-frequency signals is caused by neigther through-holes or via-holes, and is effectively suppressed.
摘要翻译：高频半导体器件在由电介质板和盖形成的空腔中包含半导体元件。连接到半导体元件的第一高频传输线形成在所述空腔中的所述电介质板的表面上，并且在所述电介质板的底表面上形成第二高频传输线，使得所述第一高频传输线和所述第二高频传输线电磁耦合在一起。在第一传输线和第二传输线电磁耦合在一起的半导体装置中，传输线不需要通过盖的侧壁，并且在侧壁上发生相互反射损失或辐射损失。此外，高频信号的传输损耗由相邻的通孔或通孔引起，并被有效地抑制。

8. 发明授权

US08599899B2 Agitation device, melting apparatus and melting method 有权
标题翻译：搅拌装置，熔化装置和熔化方法
公开(公告)号：US08599899B2
公开(公告)日：2013-12-03
申请号：US13126309
申请日：2009-10-27
申请人： Shinichi Koriyama , Takashi Hirai
发明人： Shinichi Koriyama , Takashi Hirai
IPC分类号： F27D27/00 , F27D3/00 , G21C7/00
CPC分类号： B22D1/00 , B22D46/00 , C22B9/003 , C22B21/0084 , C22B21/0092 , F27B3/10 , F27B3/205 , F27D27/00 , Y02P10/218 , Y02P10/253
摘要： An agitation device, a melting apparatus, and a melting method for improving melting efficiency of molten metal without contaminating the same. The agitation device is provided with a traveling magnetic field generating unit which is disposed outside a charging tank for storing molten metal and generates, inside the charging tank, a magnetic field that travels downward along the rear sidewall of the charging tank. A flow of the molten metal that rotates longitudinally about an axis approximately parallel to the surface of the molten metal is produced in the molten metal. By charging aluminum cutting chips into the molten metal in which the flow is produced, the aluminum cutting chips move with a downward flow of the molten metal, and are immersed in the molten metal. As a result, melting of the aluminum cutting chips can be accelerated.
摘要翻译：搅拌装置，熔融装置和熔融方法，用于提高熔融金属的熔化效率而不污染熔融金属。搅拌装置设置有行进磁场产生单元，其设置在用于储存熔融金属的充电槽的外部，并且在充电箱内部产生沿着充电箱的后侧向下行进的磁场。在熔融金属中产生熔融金属沿着大致平行于熔融金属表面的轴线纵向旋转的流动。通过将铝切割屑装入到产生流动的熔融金属中，铝切割芯片随着熔融金属的向下流动而移动，并且浸入熔融金属中。结果，可以加速铝切割屑的熔化。

9. 发明申请

US20120274526A1 Line Conversion Structure and Antenna Using the Same 审中-公开
标题翻译：线转换结构和天线使用相同
公开(公告)号：US20120274526A1
公开(公告)日：2012-11-01
申请号：US13318334
申请日：2010-12-16
申请人： Shinichi Koriyama
发明人： Shinichi Koriyama
IPC分类号： H01Q13/10 , H01P5/08
CPC分类号： H01P5/1007 , H01P5/107 , H01Q13/10
摘要： In a line conversion structure, a slot line includes a slot ground conductor connected to a ground layer with a through conductor that passes through the dielectric layer, a slot signal conductor, and a slot disposed between the slot ground conductor and the slot signal conductor. A signal conductor of a microstrip line is orthogonal to the slot ground conductor and the slot, with a gap between the signal conductor and the slot ground conductor, and an end of the signal conductor is connected to the slot signal conductor, and a length L of a portion of the slot ground conductor, the portion being parallel to the signal conductor with the gap, is less than or equal to 0.25 times a wavelength of a signal transmitted through the microstrip line.
摘要翻译：在线转换结构中，槽线包括连接到具有通过介电层的通孔的接地层的缝隙接地导体，槽信号导体和设置在槽接地导体和槽信号导体之间的槽。微带线的信号导体与槽接地导体和槽之间正交，在信号导体和槽接地导体之间具有间隙，并且信号导体的一端连接到槽信号导体，长度L 槽间接地导体的一部分平行于具有间隙的信号导体的部分小于或等于通过微带线传输的信号的波长的0.25倍。

10. 发明授权

US07276987B2 High frequency line-to-waveguide converter and high frequency package 有权
标题翻译：高频线对波导转换器和高频封装
公开(公告)号：US07276987B2
公开(公告)日：2007-10-02
申请号：US10696745
申请日：2003-10-29
申请人： Shinichi Koriyama
发明人： Shinichi Koriyama
IPC分类号： H01P5/107
CPC分类号： H01L23/66 , H01L24/48 , H01L24/49 , H01L2223/6633 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49175 , H01L2224/85399 , H01L2924/00014 , H01L2924/01012 , H01L2924/0102 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/19039 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H01P5/107 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A high frequency line-waveguide converter comprises a high frequency line including a dielectric layer, a line conductor disposed on an upper surface of the dielectric layer, and a ground conductor layer disposed on the same surface so as to surround one end of the line conductor, a slot formed in the ground conductor layer so as to be substantially orthogonal to the one end of the line conductor and coupled to the line conductor, a shield conductor part disposed on a side of or in an inside of the dielectric layer so as to surround the one end of the line conductor and the slot, and a waveguide disposed at the lower side of the dielectric layer so that an opening is made opposite to the one end of the line conductor and the slot, and electrically connected to the shield conductor part.
摘要翻译：高频线路波导转换器包括高频线路，其包括电介质层，设置在电介质层的上表面上的线路导体以及设置在同一表面上的接地导体层，以便围绕线路导体的一端，形成在接地导体层中的槽，以便基本上垂直于线路导体的一端并耦合到线路导体，屏蔽导体部分设置在电介质层的一侧或内部，以便围绕线路导体和槽的一端，以及布置在电介质层的下侧的波导，使得开口与线路导体和槽的一端相对，并且电连接到屏蔽导体部分。

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