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    • 1. 发明授权
    • Semiconductor light emitting device
    • 半导体发光器件
    • US08436395B2
    • 2013-05-07
    • US13405961
    • 2012-02-27
    • Takahiro SatoShigeya KimuraTaisuke SatoToshihide ItoKoichi TachibanaShinya Nunoue
    • Takahiro SatoShigeya KimuraTaisuke SatoToshihide ItoKoichi TachibanaShinya Nunoue
    • H01L33/36
    • H01L33/24H01L33/382H01L33/42
    • According to one embodiment, a semiconductor light emitting device includes a stacked structure unit, a transparent, p-side and n-side electrodes. The unit includes n-type semiconductor layer, a light emitting portion provided on a part of the n-type semiconductor layer and p-type semiconductor layer provided on the light emitting portion. The transparent electrode is provided on the p-type semiconductor layer. The p-side electrode is provided on the transparent electrode. The n-side electrode is provided on the n-type semiconductor layer. The transparent electrode has a hole provided between the n-side and p-side electrodes. A width of the hole along an axis perpendicular to an axis from the p-side electrode toward the n-side electrode is longer than widths of the n-side and p-side electrodes. A distance between the hole and the n-side electrode is not longer than a distance between the hole and the p-side electrode.
    • 根据一个实施例,半导体发光器件包括堆叠结构单元,透明的p侧和n侧电极。 该单元包括n型半导体层,设置在n型半导体层的一部分上的发光部分和设置在发光部分上的p型半导体层。 透明电极设置在p型半导体层上。 p侧电极设置在透明电极上。 n侧电极设置在n型半导体层上。 透明电极具有设置在n侧和p侧电极之间的孔。 沿着与p侧电极朝向n侧电极的轴垂直的轴的孔的宽度比n侧电极和p侧电极的宽度长。 孔和n侧电极之间的距离不大于孔和p侧电极之间的距离。
    • 6. 发明授权
    • Light emitting device and a method for manufacturing the same
    • 发光元件及其制造方法
    • US08071995B2
    • 2011-12-06
    • US12719484
    • 2010-03-08
    • Takahiro SatoIwao MitsuishiShinya Nunoue
    • Takahiro SatoIwao MitsuishiShinya Nunoue
    • H01L33/00
    • H01L33/504H01L33/507H01L33/508H01L2224/48091H01L2224/48247H01L2924/181H01L2924/00014H01L2924/00012
    • A light emitting device, includes: a light source to emit source light; a first wavelength conversion portion to absorb the source light and to emit first light having a wavelength different from a wavelength of the source light; a light transmitting portion provided at an opposite side of the first wavelength conversion portion from the light source and configured to transmit the source light and the first light; and a second wavelength conversion portion provided at an opposite side of the light transmitting portion from the first wavelength conversion portion and configured to absorb at least one of the source light and the first light to emit second light having a wavelength different from the wavelength of the source light and also different from a wavelength of the first light. Part of the source light is configured to be taken to an outside of the light emitting device without passing through at least one of the first wavelength conversion portion and the second wavelength conversion portion.
    • 一种发光器件,包括:发光源的光源; 第一波长转换部分,用于吸收源光并发射具有不同于源光波长的波长的第一光; 光传输部分,设置在与光源相反的第一波长转换部分的相对侧并且被配置为透射源光和第一光; 以及第二波长转换部,其设置在所述透光部的与所述第一波长转换部的相反侧,并且被配置为吸收所述源光和所述第一光中的至少一个,以发射具有与所述第二波长的波长不同的波长的第二光 源光并且也不同于第一光的波长。 源光的一部分被配置为被带到发光器件的外部,而不通过第一波长转换部分和第二波长转换部分中的至少一个。
    • 8. 发明授权
    • Light emitting device
    • 发光装置
    • US08921870B2
    • 2014-12-30
    • US13037740
    • 2011-03-01
    • Takahiro SatoShinya Nunoue
    • Takahiro SatoShinya Nunoue
    • H01L29/18H01L25/075H01L33/60
    • H01L25/0753H01L33/60H01L2224/48227H01L2224/49107H01L2224/73265
    • According to one embodiment, a light emitting device includes a base substrate, first and second substrates, first and second semiconductor light emitting elements. The first and second substrates are provided on a major surface of the base substrate and include first and second reflection regions, respectively. The first and second semiconductor light emitting elements include first and second structural bodies including first and second light emitting layers, respectively. Each of the first and second semiconductor light emitting elements is inputted with a power not less than 1 Watt. An area of a face of the first semiconductor light emitting element is S1, and a gap between the first light emitting layer and the first substrate is t1. An area R1 of the first reflection region satisfies a relationship (S1+100t12)≦R1≦(S1+10000t12). A gap L between the first and the second semiconductor light emitting elements satisfies the relationships 100t1≦L≦10000t1.
    • 根据一个实施例,发光器件包括基底衬底,第一和第二衬底,第一和第二半导体发光元件。 第一和第二基板设置在基底基板的主表面上,分别包括第一和第二反射区域。 第一和第二半导体发光元件分别包括包括第一和第二发光层的第一和第二结构体。 第一和第二半导体发光元件中的每一个都输入不小于1瓦特的功率。 第一半导体发光元件的面的面积为S1,第一发光层与第一基板的间隔为t1。 第一反射区域的区域R1满足关系(S1 + 100t12)≦̸ R1≦̸(S1 + 10000t12)。 第一和第二半导体发光元件之间的间隙L满足关系式100t1≦̸ L≦̸ 10000t1。