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1. 发明授权

US09310414B2 Electronic apparatus, a method for deciding a failure, and a method for estimating a fatigue life 有权
标题翻译：电子设备，用于判定故障的方法，以及估计疲劳寿命的方法
公开(公告)号：US09310414B2
公开(公告)日：2016-04-12
申请号：US13616460
申请日：2012-09-14
申请人： Takahiro Omori , Kenji Hirohata , Tomoko Monda , Kazuyo Narita , Toshikatsu Akiba , Akihiro Koga , Katsumi Hisano
发明人： Takahiro Omori , Kenji Hirohata , Tomoko Monda , Kazuyo Narita , Toshikatsu Akiba , Akihiro Koga , Katsumi Hisano
IPC分类号： G01R31/00 , G01R31/02 , H01L23/00 , G01R31/327
CPC分类号： G01R31/026 , G01R31/3274 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05553 , H01L2224/45124 , H01L2224/4554 , H01L2224/48091 , H01L2224/48137 , H01L2224/49109 , H01L2224/49175 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1461 , H01L2924/181 , H01L2924/3011 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： According to one embodiment, in an electronic apparatus, a first pair of electrodes has a first electrode and a second electrode. A second pair of electrodes is disposed in parallel with the first pair, and has a third electrode and a fourth electrode. A third pair of electrodes is disposed between the first pair and the second pair in parallel with the first pair and the second pair, and has a fifth electrode and a sixth electrode. A first wire electrically connects the first electrode and the second electrode. A second wire electrically connects the third electrode and the fourth electrode. A third wire electrically connects the fifth electrode and the sixth electrode. A gel covers the first wire, the second wire, and the third wire. A first detection unit detects a break status of the first wire or the second wire.
摘要翻译：根据一个实施例，在电子设备中，第一对电极具有第一电极和第二电极。第二对电极与第一对平行设置，并具有第三电极和第四电极。第三对电极与第一对和第二对平行设置在第一对和第二对之间，并且具有第五电极和第六电极。第一线将第一电极和第二电极电连接。第二导线电连接第三电极和第四电极。第三线电连接第五电极和第六电极。凝胶覆盖第一线，第二线和第三线。第一检测单元检测第一线或第二线的断开状态。

2. 发明申请

US20130257450A1 ELECTRONIC APPARATUS, A METHOD FOR DECIDING A FAILURE, AND A METHOD FOR ESTIMATING A FATIGUE LIFE 有权
标题翻译：电子设备，用于决定故障的方法以及估计疲劳寿命的方法
公开(公告)号：US20130257450A1
公开(公告)日：2013-10-03
申请号：US13616460
申请日：2012-09-14
申请人： Takahiro OMORI , Kenji Hirohata , Tomoko Monda , Kazuyo Narita , Toshikatsu Akiba , Akihiro Koga , Katsumi Hisano
发明人： Takahiro OMORI , Kenji Hirohata , Tomoko Monda , Kazuyo Narita , Toshikatsu Akiba , Akihiro Koga , Katsumi Hisano
IPC分类号： G01R31/02
CPC分类号： G01R31/026 , G01R31/3274 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05553 , H01L2224/45124 , H01L2224/4554 , H01L2224/48091 , H01L2224/48137 , H01L2224/49109 , H01L2224/49175 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1461 , H01L2924/181 , H01L2924/3011 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： According to one embodiment, in an electronic apparatus, a first pair of electrodes has a first electrode and a second electrode. A second pair of electrodes is disposed in parallel with the first pair, and has a third electrode and a fourth electrode. A third pair of electrodes is disposed between the first pair and the second pair in parallel with the first pair and the second pair, and has a fifth electrode and a sixth electrode. A first wire electrically connects the first electrode and the second electrode. A second wire electrically connects the third electrode and the fourth electrode. A third wire electrically connects the fifth electrode and the sixth electrode. A gel covers the first wire, the second wire, and the third wire. A first detection unit detects a break status of the first wire or the second wire.
摘要翻译：根据一个实施例，在电子设备中，第一对电极具有第一电极和第二电极。第二对电极与第一对平行设置，并具有第三电极和第四电极。第三对电极与第一对和第二对平行设置在第一对和第二对之间，并且具有第五电极和第六电极。第一线将第一电极和第二电极电连接。第二导线电连接第三电极和第四电极。第三线电连接第五电极和第六电极。凝胶覆盖第一线，第二线和第三线。第一检测单元检测第一线或第二线的断开状态。

3. 发明授权

US08965712B2 Life predicting method for solder joint, life predicting apparatus for solder joint and electronic device 有权
标题翻译：焊点寿命预测方法，焊点寿命预测装置及电子器件
公开(公告)号：US08965712B2
公开(公告)日：2015-02-24
申请号：US13051881
申请日：2011-03-18
申请人： Takahiro Omori , Kenji Hirohata , Tomoko Monda , Katsuaki Hiraoka , Minoru Mukai
发明人： Takahiro Omori , Kenji Hirohata , Tomoko Monda , Katsuaki Hiraoka , Minoru Mukai
IPC分类号： G01B3/44 , B23K31/12 , B23K1/00 , H01L23/00 , G06F11/30 , G01R31/04 , H05K1/02 , H05K3/34
CPC分类号： B23K31/125 , B23K1/00 , G01N2203/0073 , G01N2203/0212 , G01R31/048 , H01L24/13 , H01L24/14 , H01L24/17 , H01L2224/131 , H01L2224/14515 , H01L2224/14517 , H01L2224/16225 , H01L2224/17517 , H01L2924/10253 , H01L2924/1432 , H01L2924/1434 , H01L2924/3011 , H05K1/0271 , H05K3/3436 , H01L2924/014 , H01L2924/00
摘要： A life predicting method for a solder joint includes a step of referring to a temperature history of a measurement object having a solder joint, a step of examining at least one physical quantity selected from the group consisting of amplitude, a cycle number, a mean temperature, and a periodic length of a temperature variation with a cycle count method from the temperature history, a step of calculating a strain range by utilizing a previously prepared response surface from the physical quantity examined with the cycle count method, and a step of calculating a strain range increasing rate from a strain range with reference to a previously obtained damage index and a strain variation history of the strain range.
摘要翻译：用于焊点的寿命预测方法包括参考具有焊接接头的测量对象的温度历史的步骤，检查从由振幅，周期数，平均温度等组成的组中选择的至少一个物理量的步骤以及来自温度历史的循环计数法的温度变化的周期长度，通过利用由循环计数法检查的物理量利用预先准备好的响应面来计算应变范围的步骤，以及计算从应变范围的应变范围增加率参考先前获得的损伤指数和应变范围的应变变化历史。

4. 发明申请

US20120072129A1 LIFE PREDICTING METHOD FOR SOLDER JOINT, LIFE PREDICTING APPARATUS FOR SOLDER JOINT AND ELECTRONIC DEVICE 有权
标题翻译：焊接接头寿命预测方法，焊接接头和电子设备寿命预测装置
公开(公告)号：US20120072129A1
公开(公告)日：2012-03-22
申请号：US13051881
申请日：2011-03-18
申请人： Takahiro OMORI , Kenji Hirohata , Tomoko Monda , Katsuaki Hiraoka , Minoru Mukai
发明人： Takahiro OMORI , Kenji Hirohata , Tomoko Monda , Katsuaki Hiraoka , Minoru Mukai
IPC分类号： G06F19/00
CPC分类号： B23K31/125 , B23K1/00 , G01N2203/0073 , G01N2203/0212 , G01R31/048 , H01L24/13 , H01L24/14 , H01L24/17 , H01L2224/131 , H01L2224/14515 , H01L2224/14517 , H01L2224/16225 , H01L2224/17517 , H01L2924/10253 , H01L2924/1432 , H01L2924/1434 , H01L2924/3011 , H05K1/0271 , H05K3/3436 , H01L2924/014 , H01L2924/00
摘要： A life predicting method for a solder joint includes a step of referring to a temperature history of a measurement object having a solder joint, a step of examining at least one physical quantity selected from the group consisting of amplitude, a cycle number, a mean temperature, and a periodic length of a temperature variation with a cycle count method from the temperature history, a step of calculating a strain range by utilizing a previously prepared response surface from the physical quantity examined with the cycle count method, and a step of calculating a strain range increasing rate from a strain range with reference to a previously obtained damage index and a strain variation history of the strain range.
摘要翻译：用于焊点的寿命预测方法包括参考具有焊接接头的测量对象的温度历史的步骤，检查从由振幅，周期数，平均温度等组成的组中选择的至少一个物理量的步骤以及来自温度历史的循环计数法的温度变化的周期长度，通过利用由循环计数法检查的物理量利用预先准备好的响应面来计算应变范围的步骤，以及计算从应变范围的应变范围增加率参考先前获得的损伤指数和应变范围的应变变化历史。

5. 发明授权

US07852628B2 Cooling device and electronic apparatus having the cooling device 有权
标题翻译：具有冷却装置的冷却装置和电子设备
公开(公告)号：US07852628B2
公开(公告)日：2010-12-14
申请号：US12402702
申请日：2009-03-12
申请人： Kenji Hirohata , Katsumi Hisano , Kenji Ooki , Hideo Kitamura , Tomonao Takamatsu , Takahiro Omori
发明人： Kenji Hirohata , Katsumi Hisano , Kenji Ooki , Hideo Kitamura , Tomonao Takamatsu , Takahiro Omori
IPC分类号： H05K7/20
CPC分类号： G06F1/203 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： A cooling device including: a fan configured to rotate and produce airflow; a fan case accommodating the fan, the fan case having an outlet for discharging the airflow produced by the fan; a heat exchanger having an inlet disposed to oppose the outlet of the fan case, the inlet being configured to take in the airflow discharged from the outlet; a wire disposed between the heat exchanger and the fan case to stretch along an end face of the inlet of the heat exchanger, the wire having a first end being fixed to a fulcrum and a second end; and a wire driving mechanism configured to swing the wire about the fulcrum to scrape the end face of the inlet of the heat exchanger by the wire.
摘要翻译：一种冷却装置，包括：风扇，其构造成旋转并产生气流; 容纳风扇的风扇壳体，风扇壳体具有用于排出由风扇产生的气流的出口; 具有与所述风扇壳体的出口相对设置的入口的热交换器，所述入口被配置为吸入从所述出口排出的气流; 布置在所述热交换器和所述风扇壳体之间的线沿着所述热交换器的入口的端面拉伸，所述线具有固定到支点和第二端的第一端; 以及线驱动机构，其被配置为使所述线绕所述支点摆动以通过所述线刮擦所述热交换器的入口的端面。

6. 发明申请

US20090244843A1 COOLING DEVICE AND ELECTRONIC APPARATUS HAVING THE COOLING DEVICE 有权
标题翻译：具有冷却装置的冷却装置和电子装置
公开(公告)号：US20090244843A1
公开(公告)日：2009-10-01
申请号：US12402702
申请日：2009-03-12
申请人： Kenji Hirohata , Katsumi Hisano , Kenji Ooki , Hideo Kitamura , Tomonao Takamatsu , Takahiro Omori
发明人： Kenji Hirohata , Katsumi Hisano , Kenji Ooki , Hideo Kitamura , Tomonao Takamatsu , Takahiro Omori
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： G06F1/203 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： A cooling device including: a fan configured to rotate and produce airflow; a fan case accommodating the fan, the fan case having an outlet for discharging the airflow produced by the fan; a heat exchanger having an inlet disposed to oppose the outlet of the fan case, the inlet being configured to take in the airflow discharged from the outlet; a wire disposed between the heat exchanger and the fan case to stretch along an end face of the inlet of the heat exchanger, the wire having a first end being fixed to a fulcrum and a second end; and a wire driving mechanism configured to swing the wire about the fulcrum to scrape the end face of the inlet of the heat exchanger by the wire.
摘要翻译：一种冷却装置，包括：风扇，其构造成旋转并产生气流; 容纳风扇的风扇壳体，风扇壳体具有用于排出由风扇产生的气流的出口; 具有与所述风扇壳体的出口相对设置的入口的热交换器，所述入口被配置为吸入从所述出口排出的气流; 布置在所述热交换器和所述风扇壳体之间的线沿着所述热交换器的入口的端面拉伸，所述线具有固定到支点和第二端的第一端; 以及线驱动机构，其被配置为使所述线绕所述支点摆动以通过所述线刮擦所述热交换器的入口的端面。

7. 发明授权

US09500693B2 Electronic apparatus, measuring method, and monitoring apparatus 有权
标题翻译：电子仪器，测量方法和监测仪器
公开(公告)号：US09500693B2
公开(公告)日：2016-11-22
申请号：US13676605
申请日：2012-11-14
申请人： Tomoko Monda , Kenji Hirohata
发明人： Tomoko Monda , Kenji Hirohata
IPC分类号： G01R31/00 , G01R31/04
CPC分类号： G01R31/048 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/73265 , H01L2224/83385 , H01L2924/00014 , H01L2924/00
摘要： According to an embodiment, an electronic apparatus includes a first member serving as a circuit board member; a second member serving as a circuit board member or a semiconductor device; a first electrode formed on the first member; a second electrode formed on a region, of the first member, around a region where the first electrode is formed; and a third electrode formed on the second member. The electronic apparatus also includes a electrical joint configured to bond the first electrode, the second electrode, and the third electrode; and a measuring module configured to measure an electrical characteristic value of a connection path including at least one of the first electrode and the second electrode.
摘要翻译：根据实施例，电子设备包括用作电路板部件的第一部件; 用作电路板部件或半导体器件的第二部件; 形成在第一构件上的第一电极; 形成在所述第一构件的区域上的第二电极，围绕形成所述第一电极的区域; 以及形成在所述第二构件上的第三电极。电子设备还包括电接头，其被配置为结合第一电极，第二电极和第三电极; 以及测量模块，被配置为测量包括所述第一电极和所述第二电极中的至少一个的连接路径的电特性值。

8. 发明授权

US08884634B2 Semiconductor module 有权
标题翻译：半导体模块
公开(公告)号：US08884634B2
公开(公告)日：2014-11-11
申请号：US13429762
申请日：2012-03-26
申请人： Kenji Hirohata , Minoru Mukai , Tomoko Monda
发明人： Kenji Hirohata , Minoru Mukai , Tomoko Monda
IPC分类号： G01R27/26
CPC分类号： G01R27/16 , H01L23/64 , H01L2924/0002 , H01L2924/00
摘要： According to one embodiment, a semiconductor module comprises a substrate, a first wiring, an electrode pad, a junction, an oscillator, and a detector. The first wiring is disposed on the substrate, and has a characteristic impedance Z0. The electrode pad is connected to the first wiring. The junction is disposed on the electrode pad, and has an impedance Z1. The oscillator is disposed in contact with the first wiring, and oscillates a pulse wave of a voltage toward the junction via the first wiring. The detector is disposed in contact with the first wiring, and detects an output wave of the pulse wave from the junction. The characteristic impedance Z0 and the impedance Z1 satisfy a following relationship (1),  Z ⁢ ⁢ 0 - Z ⁢ ⁢ 1 Z ⁢ ⁢ 0  ≤ 0.05 . ( 1 )
摘要翻译：根据一个实施例，半导体模块包括衬底，第一布线，电极焊盘，结，振荡器和检测器。第一布线设置在基板上，并具有特性阻抗Z0。电极焊盘连接到第一布线。接点设置在电极焊盘上，并具有阻抗Z1。振荡器设置成与第一布线接触，并且经由第一布线使得电压脉冲波朝向结。检测器设置成与第一布线接触，并检测来自结的脉冲波的输出波。特征阻抗Z0和阻抗Z1满足以下关系式（1），Z⁢0 -Z⁢1 Z⁢0≤0.05。（1）

9. 发明申请

US20130124118A1 ELECTRONIC APPARATUS, MEASURING METHOD, AND MONITORING APPARATUS 有权
标题翻译：电子装置，测量方法和监测装置
公开(公告)号：US20130124118A1
公开(公告)日：2013-05-16
申请号：US13676605
申请日：2012-11-14
申请人： Tomoko Monda , Kenji Hirohata
发明人： Tomoko Monda , Kenji Hirohata
IPC分类号： G01R31/04
CPC分类号： G01R31/048 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/73265 , H01L2224/83385 , H01L2924/00014 , H01L2924/00
摘要： According to an embodiment, an electronic apparatus includes a first member serving as a circuit board member; a second member serving as a circuit board member or a semiconductor device; a first electrode formed on the first member; a second electrode formed on a region, of the first member, around a region where the first electrode is formed; and a third electrode formed on the second member. The electronic apparatus also includes a electrical joint configured to bond the first electrode, the second electrode, and the third electrode; and a measuring module configured to measure an electrical characteristic value of a connection path including at least one of the first electrode and the second electrode.
摘要翻译：根据实施例，电子设备包括用作电路板部件的第一部件; 用作电路板部件或半导体器件的第二部件; 形成在第一构件上的第一电极; 形成在所述第一构件的区域上的第二电极，围绕形成所述第一电极的区域; 以及形成在所述第二构件上的第三电极。电子设备还包括电接头，其被配置为结合第一电极，第二电极和第三电极; 以及测量模块，被配置为测量包括所述第一电极和所述第二电极中的至少一个的连接路径的电特性值。

10. 发明授权

US09451709B2 Damage index predicting system and method for predicting damage-related index 有权
标题翻译：损伤指标预测系统和预测损伤相关指标的方法
公开(公告)号：US09451709B2
公开(公告)日：2016-09-20
申请号：US12505758
申请日：2009-07-20
申请人： Tomoko Monda , Minoru Mukai , Kenji Hirohata
发明人： Tomoko Monda , Minoru Mukai , Kenji Hirohata
IPC分类号： G01R31/02 , H05K3/34 , H05K1/02
CPC分类号： H05K3/3436 , H05K1/0268 , H05K2201/10204 , H05K2201/10522 , H05K2201/10545 , H05K2203/163 , Y02P70/613
摘要： A damage index predicting system is for predicting a damage-related index of solder joints of an electronic device having the solder joints that electrically connect an electronic component to a mounting circuit board and one or more detection solder joints that are designed so as to have a shorter life than the solder joints. The system includes: a database configured to store a fracture relationship between the detection solder joints and the solder joints; a fracture detector configured to detect fracture of the detection solder joints; and a processor configured to calculate a prediction value of the damage-related index of the solder joints based on information relating to the fracture of the detection solder joints obtained by the fracture detector and the fracture relationship stored in the database.
摘要翻译：损伤指数预测系统用于预测具有将电子部件电连接到安装电路板的焊点与一个或多个检测焊点的电子器件的焊点的损伤相关指数，该检测焊点被设计成具有寿命比焊点短。该系统包括：数据库，配置为存储检测焊点和焊点之间的断裂关系; 断裂检测器，被配置为检测所述检测焊点的断裂; 以及处理器，其被配置为基于与通过裂缝检测器获得的检测焊点的断裂有关的信息和存储在数据库中的断裂关系来计算焊点的损伤相关指数的预测值。

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