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1. 发明授权

US08965712B2 Life predicting method for solder joint, life predicting apparatus for solder joint and electronic device 有权
标题翻译：焊点寿命预测方法，焊点寿命预测装置及电子器件
公开(公告)号：US08965712B2
公开(公告)日：2015-02-24
申请号：US13051881
申请日：2011-03-18
申请人： Takahiro Omori , Kenji Hirohata , Tomoko Monda , Katsuaki Hiraoka , Minoru Mukai
发明人： Takahiro Omori , Kenji Hirohata , Tomoko Monda , Katsuaki Hiraoka , Minoru Mukai
IPC分类号： G01B3/44 , B23K31/12 , B23K1/00 , H01L23/00 , G06F11/30 , G01R31/04 , H05K1/02 , H05K3/34
CPC分类号： B23K31/125 , B23K1/00 , G01N2203/0073 , G01N2203/0212 , G01R31/048 , H01L24/13 , H01L24/14 , H01L24/17 , H01L2224/131 , H01L2224/14515 , H01L2224/14517 , H01L2224/16225 , H01L2224/17517 , H01L2924/10253 , H01L2924/1432 , H01L2924/1434 , H01L2924/3011 , H05K1/0271 , H05K3/3436 , H01L2924/014 , H01L2924/00
摘要： A life predicting method for a solder joint includes a step of referring to a temperature history of a measurement object having a solder joint, a step of examining at least one physical quantity selected from the group consisting of amplitude, a cycle number, a mean temperature, and a periodic length of a temperature variation with a cycle count method from the temperature history, a step of calculating a strain range by utilizing a previously prepared response surface from the physical quantity examined with the cycle count method, and a step of calculating a strain range increasing rate from a strain range with reference to a previously obtained damage index and a strain variation history of the strain range.
摘要翻译：用于焊点的寿命预测方法包括参考具有焊接接头的测量对象的温度历史的步骤，检查从由振幅，周期数，平均温度等组成的组中选择的至少一个物理量的步骤以及来自温度历史的循环计数法的温度变化的周期长度，通过利用由循环计数法检查的物理量利用预先准备好的响应面来计算应变范围的步骤，以及计算从应变范围的应变范围增加率参考先前获得的损伤指数和应变范围的应变变化历史。

2. 发明申请

US20120072129A1 LIFE PREDICTING METHOD FOR SOLDER JOINT, LIFE PREDICTING APPARATUS FOR SOLDER JOINT AND ELECTRONIC DEVICE 有权
标题翻译：焊接接头寿命预测方法，焊接接头和电子设备寿命预测装置
公开(公告)号：US20120072129A1
公开(公告)日：2012-03-22
申请号：US13051881
申请日：2011-03-18
申请人： Takahiro OMORI , Kenji Hirohata , Tomoko Monda , Katsuaki Hiraoka , Minoru Mukai
发明人： Takahiro OMORI , Kenji Hirohata , Tomoko Monda , Katsuaki Hiraoka , Minoru Mukai
IPC分类号： G06F19/00
CPC分类号： B23K31/125 , B23K1/00 , G01N2203/0073 , G01N2203/0212 , G01R31/048 , H01L24/13 , H01L24/14 , H01L24/17 , H01L2224/131 , H01L2224/14515 , H01L2224/14517 , H01L2224/16225 , H01L2224/17517 , H01L2924/10253 , H01L2924/1432 , H01L2924/1434 , H01L2924/3011 , H05K1/0271 , H05K3/3436 , H01L2924/014 , H01L2924/00
摘要： A life predicting method for a solder joint includes a step of referring to a temperature history of a measurement object having a solder joint, a step of examining at least one physical quantity selected from the group consisting of amplitude, a cycle number, a mean temperature, and a periodic length of a temperature variation with a cycle count method from the temperature history, a step of calculating a strain range by utilizing a previously prepared response surface from the physical quantity examined with the cycle count method, and a step of calculating a strain range increasing rate from a strain range with reference to a previously obtained damage index and a strain variation history of the strain range.
摘要翻译：用于焊点的寿命预测方法包括参考具有焊接接头的测量对象的温度历史的步骤，检查从由振幅，周期数，平均温度等组成的组中选择的至少一个物理量的步骤以及来自温度历史的循环计数法的温度变化的周期长度，通过利用由循环计数法检查的物理量利用预先准备好的响应面来计算应变范围的步骤，以及计算从应变范围的应变范围增加率参考先前获得的损伤指数和应变范围的应变变化历史。

3. 发明授权

US08884634B2 Semiconductor module 有权
标题翻译：半导体模块
公开(公告)号：US08884634B2
公开(公告)日：2014-11-11
申请号：US13429762
申请日：2012-03-26
申请人： Kenji Hirohata , Minoru Mukai , Tomoko Monda
发明人： Kenji Hirohata , Minoru Mukai , Tomoko Monda
IPC分类号： G01R27/26
CPC分类号： G01R27/16 , H01L23/64 , H01L2924/0002 , H01L2924/00
摘要： According to one embodiment, a semiconductor module comprises a substrate, a first wiring, an electrode pad, a junction, an oscillator, and a detector. The first wiring is disposed on the substrate, and has a characteristic impedance Z0. The electrode pad is connected to the first wiring. The junction is disposed on the electrode pad, and has an impedance Z1. The oscillator is disposed in contact with the first wiring, and oscillates a pulse wave of a voltage toward the junction via the first wiring. The detector is disposed in contact with the first wiring, and detects an output wave of the pulse wave from the junction. The characteristic impedance Z0 and the impedance Z1 satisfy a following relationship (1),  Z ⁢ ⁢ 0 - Z ⁢ ⁢ 1 Z ⁢ ⁢ 0  ≤ 0.05 . ( 1 )
摘要翻译：根据一个实施例，半导体模块包括衬底，第一布线，电极焊盘，结，振荡器和检测器。第一布线设置在基板上，并具有特性阻抗Z0。电极焊盘连接到第一布线。接点设置在电极焊盘上，并具有阻抗Z1。振荡器设置成与第一布线接触，并且经由第一布线使得电压脉冲波朝向结。检测器设置成与第一布线接触，并检测来自结的脉冲波的输出波。特征阻抗Z0和阻抗Z1满足以下关系式（1），Z⁢0 -Z⁢1 Z⁢0≤0.05。（1）

4. 发明授权

US08482998B2 Storage device and method for controlling storage device 有权
标题翻译：用于控制存储设备的存储设备和方法
公开(公告)号：US08482998B2
公开(公告)日：2013-07-09
申请号：US13446034
申请日：2012-04-13
申请人： Minoru Mukai , Kenji Hirohata , Tomoko Monda
发明人： Minoru Mukai , Kenji Hirohata , Tomoko Monda
IPC分类号： G11C7/00
CPC分类号： H05K3/341 , H05K3/3436 , H05K2201/10151 , H05K2201/10159 , H05K2203/163 , Y02P70/613
摘要： A storage device includes: a printed circuit board; a semiconductor memory package mounted on the printed circuit board via solder joints, the semiconductor memory package incorporating semiconductor memories; a sensor configured to measure a physical quantity relating to a state of the storage device; a database including a damage estimation model base to be used for estimating damage of the solder joints from the physical quantity measured by the sensor; a damage estimating module configured to calculate a damage estimation value of the solder joints from the physical quantity using the damage estimation model base; and a controller configured to control writing, reading, and erasure of electronic data to or from the semiconductor memories based on the damage estimation values calculated by the damage estimating module.
摘要翻译：存储装置包括：印刷电路板; 半导体存储器封装，其通过焊点安装在所述印刷电路板上，所述半导体存储器封装结合有半导体存储器; 被配置为测量与所述存储装置的状态有关的物理量的传感器; 数据库，包括用于从传感器测量的物理量估计焊点的损坏的损伤估计模型库; 损伤估计模块，被配置为使用所述损伤估计模型基础从所述物理量计算所述焊点的损伤估计值; 以及控制器，其被配置为基于由所述损伤估计模块计算出的损伤估计值来控制对所述半导体存储器的电子数据的写入，读取和擦除。

5. 发明申请

US20120248440A1 SEMICONDUCTOR MODULE 有权
标题翻译：半导体模块
公开(公告)号：US20120248440A1
公开(公告)日：2012-10-04
申请号：US13429762
申请日：2012-03-26
申请人： Kenji HIROHATA , Minoru Mukai , Tomoko Monda
发明人： Kenji HIROHATA , Minoru Mukai , Tomoko Monda
IPC分类号： H01L23/64
CPC分类号： G01R27/16 , H01L23/64 , H01L2924/0002 , H01L2924/00
摘要： According to one embodiment, a semiconductor module comprises a substrate, a first wiring, an electrode pad, a junction, an oscillator, and a detector. The first wiring is disposed on the substrate, and has a characteristic impedance Z0. The electrode pad is connected to the first wiring. The junction is disposed on the electrode pad, and has an impedance Z1. The oscillator is disposed in contact with the first wiring, and oscillates a pulse wave of a voltage toward the junction via the first wiring. The detector is disposed in contact with the first wiring, and detects an output wave of the pulse wave from the junction. The characteristic impedance Z0 and the impedance Z1 satisfy a following relationship (1),  Z   0 - Z   1 Z   0  ≤ 0.05 . ( 1 )
摘要翻译：根据一个实施例，半导体模块包括衬底，第一布线，电极焊盘，结，振荡器和检测器。第一布线设置在基板上，并具有特性阻抗Z0。电极焊盘连接到第一布线。接点设置在电极焊盘上，并具有阻抗Z1。振荡器设置成与第一布线接触，并且经由第一布线使得电压脉冲波朝向结。检测器设置成与第一布线接触，并检测来自结的脉冲波的输出波。特征阻抗Z0和阻抗Z1满足以下关系式（1），0。。（1）

6. 发明授权

US08189412B2 Storage device and method for controlling storage device 有权
标题翻译：用于控制存储设备的存储设备和方法
公开(公告)号：US08189412B2
公开(公告)日：2012-05-29
申请号：US12509555
申请日：2009-07-27
申请人： Minoru Mukai , Kenji Hirohata , Tomoko Monda
发明人： Minoru Mukai , Kenji Hirohata , Tomoko Monda
IPC分类号： G11C29/00
CPC分类号： H05K3/341 , H05K3/3436 , H05K2201/10151 , H05K2201/10159 , H05K2203/163 , Y02P70/613
摘要： A storage device includes: a printed circuit board; a semiconductor memory package mounted on the printed circuit board via solder joints, the semiconductor memory package incorporating semiconductor memories; a sensor configured to measure a physical quantity relating to a state of the storage device; a database including a damage estimation model base to be used for estimating damage of the solder joints from the physical quantity measured by the sensor; a damage estimating module configured to calculate a damage estimation value of the solder joints from the physical quantity using the damage estimation model base; and a controller configured to control writing, reading, and erasure of electronic data to or from the semiconductor memories based on the damage estimation values calculated by the damage estimating module.
摘要翻译：存储装置包括：印刷电路板; 半导体存储器封装，其通过焊点安装在所述印刷电路板上，所述半导体存储器封装结合有半导体存储器; 被配置为测量与所述存储装置的状态有关的物理量的传感器; 数据库，包括用于从传感器测量的物理量估计焊点的损坏的损伤估计模型库; 损伤估计模块，被配置为使用所述损伤估计模型基础从所述物理量计算所述焊点的损伤估计值; 以及控制器，其被配置为基于由所述损伤估计模块计算出的损伤估计值来控制对所述半导体存储器的电子数据的写入，读取和擦除。

7. 发明申请

US20100082913A1 STORAGE DEVICE AND METHOD FOR CONTROLLING STORAGE DEVICE 有权
标题翻译：存储装置和用于控制存储装置的方法
公开(公告)号：US20100082913A1
公开(公告)日：2010-04-01
申请号：US12509555
申请日：2009-07-27
申请人： Minoru Mukai , Kenji Hirohata , Tomoko Monda
发明人： Minoru Mukai , Kenji Hirohata , Tomoko Monda
IPC分类号： G06F12/00 , G06F19/00
CPC分类号： H05K3/341 , H05K3/3436 , H05K2201/10151 , H05K2201/10159 , H05K2203/163 , Y02P70/613
摘要： A storage device includes: a printed circuit board; a semiconductor memory package mounted on the printed circuit board via solder joints, the semiconductor memory package incorporating semiconductor memories; a sensor configured to measure a physical quantity relating to a state of the storage device; a database including a damage estimation model base to be used for estimating damage of the solder joints from the physical quantity measured by the sensor; a damage estimating module configured to calculate a damage estimation value of the solder joints from the physical quantity using the damage estimation model base; and a controller configured to control writing, reading, and erasure of electronic data to or from the semiconductor memories based on the damage estimation values calculated by the damage estimating module.
摘要翻译：存储装置包括：印刷电路板; 半导体存储器封装，其通过焊点安装在所述印刷电路板上，所述半导体存储器封装结合有半导体存储器; 被配置为测量与所述存储装置的状态有关的物理量的传感器; 数据库，包括用于从传感器测量的物理量估计焊点的损坏的损伤估计模型库; 损伤估计模块，被配置为使用所述损伤估计模型基础从所述物理量计算所述焊点的损伤估计值; 以及控制器，其被配置为基于由所述损伤估计模块计算出的损伤估计值来控制对所述半导体存储器的电子数据的写入，读取和擦除。

8. 发明授权

US09451709B2 Damage index predicting system and method for predicting damage-related index 有权
标题翻译：损伤指标预测系统和预测损伤相关指标的方法
公开(公告)号：US09451709B2
公开(公告)日：2016-09-20
申请号：US12505758
申请日：2009-07-20
申请人： Tomoko Monda , Minoru Mukai , Kenji Hirohata
发明人： Tomoko Monda , Minoru Mukai , Kenji Hirohata
IPC分类号： G01R31/02 , H05K3/34 , H05K1/02
CPC分类号： H05K3/3436 , H05K1/0268 , H05K2201/10204 , H05K2201/10522 , H05K2201/10545 , H05K2203/163 , Y02P70/613
摘要： A damage index predicting system is for predicting a damage-related index of solder joints of an electronic device having the solder joints that electrically connect an electronic component to a mounting circuit board and one or more detection solder joints that are designed so as to have a shorter life than the solder joints. The system includes: a database configured to store a fracture relationship between the detection solder joints and the solder joints; a fracture detector configured to detect fracture of the detection solder joints; and a processor configured to calculate a prediction value of the damage-related index of the solder joints based on information relating to the fracture of the detection solder joints obtained by the fracture detector and the fracture relationship stored in the database.
摘要翻译：损伤指数预测系统用于预测具有将电子部件电连接到安装电路板的焊点与一个或多个检测焊点的电子器件的焊点的损伤相关指数，该检测焊点被设计成具有寿命比焊点短。该系统包括：数据库，配置为存储检测焊点和焊点之间的断裂关系; 断裂检测器，被配置为检测所述检测焊点的断裂; 以及处理器，其被配置为基于与通过裂缝检测器获得的检测焊点的断裂有关的信息和存储在数据库中的断裂关系来计算焊点的损伤相关指数的预测值。

9. 发明申请

US20120198293A1 STORAGE DEVICE AND METHOD FOR CONTROLLING STORAGE DEVICE 有权
标题翻译：存储装置和用于控制存储装置的方法
公开(公告)号：US20120198293A1
公开(公告)日：2012-08-02
申请号：US13446034
申请日：2012-04-13
申请人： Minoru Mukai , Kenji Hirohata , Tomoko Monda
发明人： Minoru Mukai , Kenji Hirohata , Tomoko Monda
IPC分类号： G11C29/08 , G06F11/26
CPC分类号： H05K3/341 , H05K3/3436 , H05K2201/10151 , H05K2201/10159 , H05K2203/163 , Y02P70/613
摘要： A storage device includes: a printed circuit board; a semiconductor memory package mounted on the printed circuit board via solder joints, the semiconductor memory package incorporating semiconductor memories; a sensor configured to measure a physical quantity relating to a state of the storage device; a database including a damage estimation model base to be used for estimating damage of the solder joints from the physical quantity measured by the sensor; a damage estimating module configured to calculate a damage estimation value of the solder joints from the physical quantity using the damage estimation model base; and a controller configured to control writing, reading, and erasure of electronic data to or from the semiconductor memories based on the damage estimation values calculated by the damage estimating module.
摘要翻译：存储装置包括：印刷电路板; 半导体存储器封装，其通过焊点安装在所述印刷电路板上，所述半导体存储器封装结合有半导体存储器; 被配置为测量与所述存储装置的状态有关的物理量的传感器; 数据库，包括用于从传感器测量的物理量估计焊点的损坏的损伤估计模型库; 损伤估计模块，被配置为使用所述损伤估计模型基础从所述物理量计算所述焊点的损伤估计值; 以及控制器，其被配置为基于由所述损伤估计模块计算出的损伤估计值来控制对所述半导体存储器的电子数据的写入，读取和擦除。

10. 发明申请

US20100070204A1 DAMAGE INDEX PREDICTING SYSTEM AND METHOD FOR PREDICTING DAMAGE-RELATED INDEX 有权
标题翻译：损伤指标预测系统和预测损害相关指标的方法
公开(公告)号：US20100070204A1
公开(公告)日：2010-03-18
申请号：US12505758
申请日：2009-07-20
申请人： Tomoko Monda , Minoru Mukai , Kenji Hirohata
发明人： Tomoko Monda , Minoru Mukai , Kenji Hirohata
IPC分类号： G06F19/00
CPC分类号： H05K3/3436 , H05K1/0268 , H05K2201/10204 , H05K2201/10522 , H05K2201/10545 , H05K2203/163 , Y02P70/613
摘要： A damage index predicting system is for predicting a damage-related index of solder joints of an electronic device having the solder joints that electrically connect an electronic component to a mounting circuit board and one or more detection solder joints that are designed so as to have a shorter life than the solder joints. The system includes: a database configured to store a fracture relationship between the detection solder joints and the solder joints; a fracture detector configured to detect fracture of the detection solder joints; and a processor configured to calculate a prediction value of the damage-related index of the solder joints based on information relating to the fracture of the detection solder joints obtained by the fracture detector and the fracture relationship stored in the database.
摘要翻译：损伤指数预测系统用于预测具有将电子部件电连接到安装电路板的焊点与一个或多个检测焊点的电子器件的焊点的损伤相关指数，该检测焊点被设计成具有寿命比焊点短。该系统包括：数据库，配置为存储检测焊点和焊点之间的断裂关系; 断裂检测器，被配置为检测所述检测焊点的断裂; 以及处理器，其被配置为基于与通过裂缝检测器获得的检测焊点的断裂有关的信息和存储在数据库中的断裂关系来计算焊点的损伤相关指数的预测值。

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