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1. 发明授权

US06514344B2 Film forming unit 失效
标题翻译：成膜单元
公开(公告)号：US06514344B2
公开(公告)日：2003-02-04
申请号：US09735459
申请日：2000-12-14
申请人： Takahiro Kitano , Masateru Morikawa , Yukihiko Esaki , Nobukazu Ishizaka , Norihisa Koga , Kazuhiro Takeshita , Hirofumi Ookuma , Masami Akimoto
发明人： Takahiro Kitano , Masateru Morikawa , Yukihiko Esaki , Nobukazu Ishizaka , Norihisa Koga , Kazuhiro Takeshita , Hirofumi Ookuma , Masami Akimoto
IPC分类号： B05B300
CPC分类号： H01L21/6715
摘要： The present invention is a film forming unit for forming a film on a substrate by supplying a coating solution on the substrate from a discharge nozzle, including moving means for moving the discharge nozzle, wherein the moving means comprises a supporting member for supporting the discharge nozzle, a moving member for moving the supporting member, a guide shaft passing through bearing portion which is formed in the supporting member, and an air supply mechanism for supplying air to a space between the bearing portion and the guide shaft. The discharge nozzle discharges the coating solution while moving along the guide shaft. On the substrate the coating solution is applied along the locus of the discharge nozzle movement. Since air is supplied to the space between the bearing portion and the guide shaft, the supporting member can be made to be in the state of floating relative the guide shaft. As a result, even if the discharge nozzle moves at high speed, the discharge of the coating solution is prevented from being disturbed so that the predetermined coating of the coating solution is performed precisely.
摘要翻译：本发明是一种用于在基板上形成膜的成膜单元，该装置包括：用于移动排放喷嘴的移动装置，该排出喷嘴由排放喷嘴提供在基板上，其中移动装置包括用于支撑排出喷嘴，用于移动支撑构件的移动构件，穿过形成在支撑构件中的轴承部分的引导轴和用于将空气供给到轴承部分和引导轴之间的空间的空气供应机构。排出喷嘴在沿着导向轴移动的同时排出涂布溶液。在基材上，涂布溶液沿排出喷嘴运动的轨迹施加。由于空气被供给到轴承部和引导轴之间的空间，所以支撑部件能够相对于引导轴处于浮动状态。结果，即使排出喷嘴高速移动，也可以防止涂布液的排出受到干扰，从而精确地进行涂布液的预定涂布。

2. 发明授权

US06936107B2 Coating film forming apparatus and coating unit 失效
标题翻译：涂膜成膜装置和涂装单元
公开(公告)号：US06936107B2
公开(公告)日：2005-08-30
申请号：US10728768
申请日：2003-12-08
申请人： Takahiro Kitano , Masateru Morikawa , Yukihiko Esaki , Nobukazu Ishizaka , Norihisa Koga , Kazuhiro Takeshita , Hirofumi Ookuma , Masami Akimoto
发明人： Takahiro Kitano , Masateru Morikawa , Yukihiko Esaki , Nobukazu Ishizaka , Norihisa Koga , Kazuhiro Takeshita , Hirofumi Ookuma , Masami Akimoto
IPC分类号： H01L21/027 , G03F7/16 , H01L21/00 , B05C11/10
CPC分类号： H01L21/6715 , G03F7/162 , Y10S134/902
摘要： A coating film forming apparatus for forming a film by applying a coating solution to a substrate, which is provided with a cassette section, coating unit, developing unit, pre-treatment/post-treatment units and a main arm for transferring the substrate between the respective units. In the coating unit, provided is a coating section in which a resist is applied on the substrate in a manner of single stroke by intermittently moving the substrate in a Y-direction and by moving a nozzle in an X-direction, and provided is a reduced-pressure drying section for drying under reduced pressure the substrate after being applied, and further provided is equipment for removing the coating film adhered to a periphery of the substrate. Additionally, when the reduced-pressure drying section is arranged outside the coating unit, the main arm is covered with a cover so that the inside thereof is under a solvent atmosphere.
摘要翻译：一种涂膜形成装置，用于通过将涂布溶液涂布到基底上来形成膜，该基材设置有盒部，涂布单元，显影单元，预处理/后处理单元和用于在基板之间转移基板的主臂各单位。在涂布单元中，设置了通过在Y方向间歇地移动基板并且沿X方向移动喷嘴，以单行程的方式将抗蚀剂施加在基板上的涂布部分，并且设置为减压干燥部分，用于在施加后在减压下干燥基板，并且还提供了用于去除附着到基板周边的涂膜的设备。此外，当将减压干燥部配置在涂布单元的外侧时，主臂被盖覆盖，使其内部处于溶剂气氛下。

3. 发明授权

US06676757B2 Coating film forming apparatus and coating unit 有权
标题翻译：涂膜成膜装置和涂装单元
公开(公告)号：US06676757B2
公开(公告)日：2004-01-13
申请号：US09734877
申请日：2000-12-13
申请人： Takahiro Kitano , Masateru Morikawa , Yukihiko Esaki , Nobukazu Ishizaka , Norihisa Koga , Kazuhiro Takeshita , Hirofumi Ookuma , Masami Akimoto
发明人： Takahiro Kitano , Masateru Morikawa , Yukihiko Esaki , Nobukazu Ishizaka , Norihisa Koga , Kazuhiro Takeshita , Hirofumi Ookuma , Masami Akimoto
IPC分类号： B05C1110
CPC分类号： H01L21/6715 , G03F7/162 , Y10S134/902
摘要： A coating film forming apparatus for forming a film by applying a coating solution to a substrate, which is provided with a cassette section, coating unit, developing unit, pre-treatment/post-treatment units and a main arm for transferring the substrate between the respective units. In the coating unit, provided is a coating section in which a resist is applied on the substrate in a manner of single stroke by intermittently moving the substrate in a Y-direction and by moving a nozzle in an X-direction, and provided is a reduced-pressure drying section for drying under reduced pressure the substrate after being applied, and further provided is equipment for removing the coating film adhered to a periphery of the substrate. Additionally, when the reduced-pressure drying section is arranged outside the coating unit, the main arm is covered with a cover so that the inside thereof is under a solvent atmosphere.
摘要翻译：一种涂膜形成装置，用于通过将涂布溶液涂布到基底上来形成膜，该基材设置有盒部，涂布单元，显影单元，预处理/后处理单元和用于在基板之间转移基板的主臂各单位。在涂布单元中，设置了通过在Y方向间歇地移动基板并且沿X方向移动喷嘴，以单行程的方式将抗蚀剂施加在基板上的涂布部分，并且设置为减压干燥部分，用于在施加后在减压下干燥基板，并且还提供了用于去除附着到基板周边的涂膜的设备。此外，当将减压干燥部配置在涂布单元的外侧时，主臂被盖覆盖，使其内部处于溶剂气氛下。

4. 发明授权

US07087118B2 Coating film forming apparatus and coating unit 失效
标题翻译：涂膜成膜装置和涂装单元
公开(公告)号：US07087118B2
公开(公告)日：2006-08-08
申请号：US11080756
申请日：2005-03-16
申请人： Takahiro Kitano , Masateru Morikawa , Yukihiko Esaki , Nobukazu Ishizaka , Norihisa Koga , Kazuhiro Takeshita , Hirofumi Ookuma , Masami Akimoto
发明人： Takahiro Kitano , Masateru Morikawa , Yukihiko Esaki , Nobukazu Ishizaka , Norihisa Koga , Kazuhiro Takeshita , Hirofumi Ookuma , Masami Akimoto
IPC分类号： B05C11/10 , B05B12/12
CPC分类号： H01L21/6715 , G03F7/162 , Y10S134/902
摘要： A coating film forming apparatus for forming a film by applying a coating solution to a substrate, which is provided with a cassette section, coating unit, developing unit, pre-treatment/post-treatment units and a main arm for transferring the substrate between the respective units. In the coating unit, provided is a coating section in which a resist is applied on the substrate in a manner of single stroke by intermittently moving the substrate in a Y-direction and by moving a nozzle in an X-direction, and provided is a reduced-pressure drying section for drying under reduced pressure the substrate after being applied, and further provided is equipment for removing the coating film adhered to a periphery of the substrate. Additionally, when the reduced-pressure drying section is arranged outside the coating unit, the main arm is covered with a cover so that the inside thereof is under a solvent atmosphere.
摘要翻译：一种涂膜形成装置，用于通过将涂布溶液涂布到基底上来形成膜，该基材设置有盒部，涂布单元，显影单元，预处理/后处理单元和用于在基板之间转移基板的主臂各单位。在涂布单元中，设置了通过在Y方向间歇地移动基板并且沿X方向移动喷嘴，以单行程的方式将抗蚀剂施加在基板上的涂布部分，并且设置为减压干燥部分，用于在施加后在减压下干燥基板，并且还提供了用于去除附着到基板周边的涂膜的设备。此外，当将减压干燥部配置在涂布单元的外侧时，主臂被盖覆盖，使其内部处于溶剂气氛下。

5. 发明授权

US06605153B2 Coating film forming apparatus 失效
标题翻译：涂膜成膜装置
公开(公告)号：US06605153B2
公开(公告)日：2003-08-12
申请号：US09735657
申请日：2000-12-14
申请人： Takahiro Kitano , Masateru Morikawa , Yukihiko Esaki , Nobukazu Ishizaka , Norihisa Koga , Kazuhiro Takeshita , Hirofumi Ookuma , Masami Akimoto
发明人： Takahiro Kitano , Masateru Morikawa , Yukihiko Esaki , Nobukazu Ishizaka , Norihisa Koga , Kazuhiro Takeshita , Hirofumi Ookuma , Masami Akimoto
IPC分类号： B05C1110
CPC分类号： H01L21/6715 , B05B12/20 , B05B13/041 , B05C5/0212 , B05C5/0216 , B05C5/0291 , B05C11/1039
摘要： An apparatus includes a holding portion for holding a substrate, a nozzle, provided to face the substrate held by the holding portion, for discharging a solution to the substrate, a driver for moving the nozzle along a surface of the substrate relatively with respect to the substrate while the solution is being discharged to the surface of the substrate from the nozzle, a mask unit covering a portion other than a film formation area of the substrate and including a mask member for catching the solution from the nozzle, and a cleaner provided in the mask unit. The coating solution can be supplied to the surface of the substrate in a way similar to a picture drawn with a single stroke of a brush. A cleaning unit for cleaning the mask member does not need to be provided separately, leading to the facilitation of cleaning and a reduction in space.
摘要翻译：一种装置，包括用于保持基板的保持部分，设置成面对由保持部分保持的基板的喷嘴，用于将溶液排出到基板;驱动器，用于相对于所述基板沿着基板的表面移动喷嘴基板，同时溶液从喷嘴排出到基板的表面;掩模单元，覆盖除了基板的成膜区域以外的部分，并且包括用于从喷嘴捕获溶液的掩模构件，以及设置在该基板中的清洁器面具单元。涂布溶液可以以类似于用笔刷的单次笔画绘制的图像的方式供应到基底的表面。用于清洁面罩构件的清洁单元不需要单独提供，从而促进清洁和减少空间。

6. 发明申请

US20050155550A1 Coating film forming apparatus and coating unit 失效
公开(公告)号：US20050155550A1
公开(公告)日：2005-07-21
申请号：US11080756
申请日：2005-03-16
申请人： Takahiro Kitano , Masateru Morikawa , Yukihiko Esaki , Nobukazu Ishizaka , Norihisa Koga , Kazuhiro Takeshita , Hirofumi Ookuma , Masami Akimoto
发明人： Takahiro Kitano , Masateru Morikawa , Yukihiko Esaki , Nobukazu Ishizaka , Norihisa Koga , Kazuhiro Takeshita , Hirofumi Ookuma , Masami Akimoto
IPC分类号： H01L21/027 , G03F7/16 , H01L21/00 , B05D3/12 , B05C11/00
CPC分类号： H01L21/6715 , G03F7/162 , Y10S134/902
摘要： A coating film forming apparatus for forming a film by applying a coating solution to a substrate, which is provided with a cassette section, coating unit, developing unit, pre-treatment/post-treatment units and a main arm for transferring the substrate between the respective units. In the coating unit, provided is a coating section in which a resist is applied on the substrate in a manner of single stroke by intermittently moving the substrate in a Y-direction and by moving a nozzle in an X-direction, and provided is a reduced-pressure drying section for drying under reduced pressure the substrate after being applied, and further provided is equipment for removing the coating film adhered to a periphery of the substrate. Additionally, when the reduced-pressure drying section is arranged outside the coating unit, the main arm is covered with a cover so that the inside thereof is under a solvent atmosphere.

7. 发明授权

US06872256B2 Film forming unit 有权
标题翻译：成膜单元
公开(公告)号：US06872256B2
公开(公告)日：2005-03-29
申请号：US10611991
申请日：2003-07-03
申请人： Takahiro Kitano , Masateru Morikawa , Yukihiko Esaki , Nobukazu Ishizaka , Norihisa Koga , Kazuhiro Takeshita , Hirofumi Ookuma , Masami Akimoto
发明人： Takahiro Kitano , Masateru Morikawa , Yukihiko Esaki , Nobukazu Ishizaka , Norihisa Koga , Kazuhiro Takeshita , Hirofumi Ookuma , Masami Akimoto
IPC分类号： H01L21/027 , B05C11/08 , G03F7/16 , H01L21/00 , B05C5/00 , B05B15/02
CPC分类号： H01L21/6715 , B05B15/55 , B05C11/08 , G03F7/16 , G03F7/162 , H01L21/67051
摘要： The present invention is a film forming unit for discharging a coating solution from a coating solution discharge nozzle toward a substrate to form a layer on a surface of the substrate, which has a supply flow path for supplying a cleaning fluid to a discharge flow path continuing to a discharging port of the coating solution discharge nozzle. When the cleaning fluid is positively supplied directly to the discharge flow path of the coating solution discharge nozzle, the supply pressure of the cleaning fluid as well as the capability of cleaning is added. Therefore, further effective cleaning is attained in compare with the conventional case where a coating solution discharge nozzle is simply dipped into a cleaning fluid. In consequence, even when the discharging port of the nozzle is minute, it is possible to perfectly remove the contamination. This allows the discharge pressure to remain constant so as to form a uniform coating layer on the substrate.
摘要翻译：本发明是一种成膜单元，其用于将涂布液从涂布液排出喷嘴朝向基板排出以在基板的表面上形成层，该基板的表面具有用于将清洁流体供应到排出流路连续的供给流路到涂布液排出喷嘴的排出口。当清洁液被直接供给到涂布液排出喷嘴的排出流路时，添加清洗液的供给压力和清洗能力。因此，与将涂布液排出喷嘴简单地浸入清洗液中的常规情况相比，可以进一步有效地清洗。因此，即使喷嘴的排出口微小，也可以完全除去污染物。这允许排出压力保持恒定，从而在基底上形成均匀的涂层。

8. 发明授权

US06716478B2 Coating film forming apparatus and coating film forming method 失效
标题翻译：涂膜成膜装置和涂膜成型方法
公开(公告)号：US06716478B2
公开(公告)日：2004-04-06
申请号：US10095439
申请日：2002-03-13
申请人： Takahiro Kitano , Masateru Morikawa , Yukihiko Esaki , Nobukazu Ishizaka , Norihisa Koga , Kazuhiro Takeshita , Hirofumi Ookuma , Masami Akimoto
发明人： Takahiro Kitano , Masateru Morikawa , Yukihiko Esaki , Nobukazu Ishizaka , Norihisa Koga , Kazuhiro Takeshita , Hirofumi Ookuma , Masami Akimoto
IPC分类号： B05D512
CPC分类号： H01L21/6715 , B05C5/0208 , B05C5/0216 , B05C5/0291 , H01L21/0271
摘要： A coating area of wafer W is divided into, for example, three regions. The wafer W and/or a supply nozzle are driven in a predetermined coating direction and/or a coating direction such that coating start positions of the adjacent divided regions are not next to each other and/or the coating is not continuously performed in order of a coating end position and a coating start position when the coating end position of one region of the adjacent divided regions and the coating start position of the other region are adjacent to each other, whereby forming a liquid film of a resist liquid for each divided region of the surface of wafer W. As a result, a phenomenon, in which the resist liquid is drawn to the coating start position, so as to increase the film thickness of this portion, occurs in only the corresponding region. Resultantly, uniformity of an inner surface of the film thickness can be improved.
摘要翻译：晶片W的涂布区域分为例如三个区域。晶片W和/或供给喷嘴以预定的涂布方向和/或涂布方向被驱动，使得相邻分割区域的涂层开始位置彼此不相邻和/或涂层不是按照当相邻分割区域的一个区域的涂覆结束位置和另一个区域的涂层开始位置彼此相邻时，涂覆结束位置和涂布开始位置，从而形成每个分割区域的抗蚀剂液体的液体膜晶片W的表面的结果。结果，仅在对应的区域中发生将抗蚀剂液体吸引到涂层开始位置以增加该部分的膜厚度的现象。因此，可以提高膜厚度的内表面的均匀性。

9. 发明授权

US06616760B2 Film forming unit 失效
公开(公告)号：US06616760B2
公开(公告)日：2003-09-09
申请号：US09736397
申请日：2000-12-15
申请人： Takahiro Kitano , Masateru Morikawa , Yukihiko Esaki , Nobukazu Ishizaka , Norihisa Koga , Kazuhiro Takeshita , Hirofumi Ookuma , Masami Akimoto
发明人： Takahiro Kitano , Masateru Morikawa , Yukihiko Esaki , Nobukazu Ishizaka , Norihisa Koga , Kazuhiro Takeshita , Hirofumi Ookuma , Masami Akimoto
IPC分类号： B05B1502
CPC分类号： H01L21/6715 , B05B15/55 , B05C11/08 , G03F7/16 , G03F7/162 , H01L21/67051
摘要： The present invention is a film forming unit for discharging a coating solution from a coating solution discharge nozzle toward a substrate to form a layer on a surface of the substrate, which has a supply flow path for supplying a cleaning fluid to a discharge flow path continuing to a discharging port of the coating solution discharge nozzle. When the cleaning fluid is positively supplied directly to the discharge flow path of the coating solution discharge nozzle, the supply pressure of the cleaning fluid as well as the capability of cleaning is added. Therefore, further effective cleaning is attained in compare with the conventional case where a coating solution discharge nozzle is simply dipped into a cleaning fluid. In consequence, even when the discharging port of the nozzle is minute, it is possible to perfectly remove the contamination. This allows the discharge pressure to remain constant so as to form a uniform coating layer on the substrate.

10. 发明授权

US06383948B1 Coating film forming apparatus and coating film forming method 失效
公开(公告)号：US06383948B1
公开(公告)日：2002-05-07
申请号：US09734922
申请日：2000-12-13
申请人： Takahiro Kitano , Masateru Morikawa , Yukihiko Esaki , Nobukazu Ishizaka , Norihisa Koga , Kazuhiro Takeshita , Hirofumi Ookuma , Masami Akimoto
发明人： Takahiro Kitano , Masateru Morikawa , Yukihiko Esaki , Nobukazu Ishizaka , Norihisa Koga , Kazuhiro Takeshita , Hirofumi Ookuma , Masami Akimoto
IPC分类号： H01L2131
CPC分类号： H01L21/6715 , B05C5/0208 , B05C5/0216 , B05C5/0291 , H01L21/0271
摘要： A coating area of wafer W is divided into, for example, three regions. The wafer W and/or a supply nozzle are driven in a predetermined coating direction and/or a coating direction such that coating start positions of the adjacent divided regions are not next to each other and/or the coating is not continuously performed in order of a coating end position and a coating start position when the coating end position of one region of the adjacent divided regions and the coating start position of the other region are adjacent to each other, whereby forming a liquid film of a resist liquid for each divided region of the surface of wafer W. As a result, a phenomenon, in which the resist liquid is drawn to the coating start position, so as to increase the film thickness of this portion, occurs in only the corresponding region. Resultantly, uniformity of an inner surface of the film thickness can be improved.

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