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    • 2. 发明授权
    • Film forming unit
    • 成膜单元
    • US06695922B2
    • 2004-02-24
    • US09734571
    • 2000-12-13
    • Takahiro KitanoShinji KobayashiYukihiko EsakiMasateru Morikawa
    • Takahiro KitanoShinji KobayashiYukihiko EsakiMasateru Morikawa
    • B05C1110
    • H01L21/6715B05C11/08G03F7/16G03F7/162H01L21/67109
    • The present invention is a film forming unit for applying a coating solution to a substrate to form a coating film on the substrate, which has a heating and/or cooling member brought into direct or indirect contact with said substrate for changing a temperature of at least a peripheral portion of the substrate. By changing the temperature of a perimeter portion of the substrate by means of it, a temperature of the coating solution applied on the substrate can be changed. Consequently, surface tension of the coating solution decreases or increases, and swelling of the coating solution occurring at the substrate perimeter portion and reduction in film thickness can be prevented. As a result, a coating film with a predetermined film thickness is formed also on the perimeter portion of the substrate, thus making it possible to enhance yield.
    • 本发明是一种成膜单元,其用于将涂布溶液涂布在基材上,以在基材上形成涂膜,该涂膜具有与所述基材直接或间接接触的加热和/或冷却部件,用于至少改变温度 基板的周边部分。 通过借助它改变衬底的周边部分的温度,可以改变施加在衬底上的涂布溶液的温度。 因此,涂层溶液的表面张力降低或增加,并且可以防止在基材周边部分发生的涂布溶液的溶胀和膜厚度的降低。 结果,也在基板的周边部分上形成具有预定膜厚的涂膜,从而可以提高成品率。
    • 7. 发明授权
    • Film forming method and film forming apparatus
    • 成膜方法和成膜装置
    • US06371667B1
    • 2002-04-16
    • US09545003
    • 2000-04-06
    • Takahiro KitanoMasami AkimotoTomohide MinamiMasateru Morikawa
    • Takahiro KitanoMasami AkimotoTomohide MinamiMasateru Morikawa
    • G03D500
    • G03D5/00
    • A resist solution discharge nozzle for discharging a resist solution to a wafer is moved at a constant speed along a radial direction of the wafer while the wafer is being rotated. During this movement, the amount of the resist solution to be discharged from the resist solution discharge nozzle is gradually decreased. The resist solution discharged to the wafer is applied to the front surface of the wafer drawing a spiral track, and coating amounts of the resist solution per unit area with respect to a central portion and a peripheral portion of the wafer can be made equal. Accordingly, waste of a processing solution supplied onto a substrate can be eliminated, and a uniform processing solution film can be formed on the substrate.
    • 用于将抗蚀剂溶液放电到晶片的抗蚀剂溶液排出喷嘴在晶片旋转的同时沿着晶片的径向以恒定的速度移动。 在该运动中,从抗蚀剂溶液排出喷嘴排出的抗蚀剂溶液的量逐渐降低。 将排出到晶片的抗蚀剂溶液施加到晶片的前表面,从而绘制螺旋轨道,并且可以使相对于晶片的中心部分和周边部分的每单位面积的抗蚀剂溶液的涂布量相等。 因此,能够消除供给到基板上的处理液的浪费,能够在基板上形成均匀的处理液膜。
    • 10. 发明授权
    • Film forming unit
    • 成膜单元
    • US06514344B2
    • 2003-02-04
    • US09735459
    • 2000-12-14
    • Takahiro KitanoMasateru MorikawaYukihiko EsakiNobukazu IshizakaNorihisa KogaKazuhiro TakeshitaHirofumi OokumaMasami Akimoto
    • Takahiro KitanoMasateru MorikawaYukihiko EsakiNobukazu IshizakaNorihisa KogaKazuhiro TakeshitaHirofumi OokumaMasami Akimoto
    • B05B300
    • H01L21/6715
    • The present invention is a film forming unit for forming a film on a substrate by supplying a coating solution on the substrate from a discharge nozzle, including moving means for moving the discharge nozzle, wherein the moving means comprises a supporting member for supporting the discharge nozzle, a moving member for moving the supporting member, a guide shaft passing through bearing portion which is formed in the supporting member, and an air supply mechanism for supplying air to a space between the bearing portion and the guide shaft. The discharge nozzle discharges the coating solution while moving along the guide shaft. On the substrate the coating solution is applied along the locus of the discharge nozzle movement. Since air is supplied to the space between the bearing portion and the guide shaft, the supporting member can be made to be in the state of floating relative the guide shaft. As a result, even if the discharge nozzle moves at high speed, the discharge of the coating solution is prevented from being disturbed so that the predetermined coating of the coating solution is performed precisely.
    • 本发明是一种用于在基板上形成膜的成膜单元,该装置包括:用于移动排放喷嘴的移动装置,该排出喷嘴由排放喷嘴提供在基板上,其中移动装置包括用于支撑排出喷嘴 ,用于移动支撑构件的移动构件,穿过形成在支撑构件中的轴承部分的引导轴和用于将空气供给到轴承部分和引导轴之间的空间的空气供应机构。 排出喷嘴在沿着导向轴移动的同时排出涂布溶液。 在基材上,涂布溶液沿排出喷嘴运动的轨迹施加。 由于空气被供给到轴承部和引导轴之间的空间,所以支撑部件能够相对于引导轴处于浮动状态。 结果,即使排出喷嘴高速移动,也可以防止涂布液的排出受到干扰,从而精确地进行涂布液的预定涂布。