专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20110311257A1 IMAGE FORMING APPARATUS, CONTROL METHOD, AND RECORDING MEDIUM 有权
标题翻译：图像形成装置，控制方法和记录介质
公开(公告)号：US20110311257A1
公开(公告)日：2011-12-22
申请号：US13164095
申请日：2011-06-20
申请人： Taizo Nozawa , Yukio Futamata , Noboru Furuyama , Satoshi Itaya , Hiroshi Katakura , Setsuo Takada
发明人： Taizo Nozawa , Yukio Futamata , Noboru Furuyama , Satoshi Itaya , Hiroshi Katakura , Setsuo Takada
IPC分类号： G03G15/20
CPC分类号： G03G15/2078 , G03G15/2039
摘要： An embodiment provides an image forming apparatus including: a job acquiring unit that acquires an image forming job that gives instructions for performing forming of an image; an image forming process control unit that controls performance of the image forming job that the job acquiring unit acquires; a temperature information acquiring unit that acquires information showing temperature of the heating rotary body; a determining unit that determines whether the temperature of the heating rotary body which is acquired by the temperature information acquiring unit is equal to or higher than a predetermined stand-by temperature set as a temperature in a stand-by state that stands by to perform the image forming process, when the image forming process is completed, based on the image forming job by the image forming process control unit; and a fixing device control unit, which controls the fixing device, performs a first stand-by control process that increases the temperature of the heating rotary body to the stand-by temperature by heating the heating rotary body with the heating member while rotating the heating rotary body with the heating rotary body and the pressing body in contact, when the determining unit determines that the temperature of the heating rotary body is lower than the stand-by temperature. Further, the fixing device control unit stops the rotation of the heating rotary body and performs a second stand-by control process that makes the fixing device stand by, without heating the heating rotary body with the heating member, when the determining unit determines that the temperature of the heating rotary body is the stand-by temperature or higher.
摘要翻译：实施例提供了一种图像形成装置，包括：作业获取单元，其获取给出用于执行图像形成的指令的图像形成作业; 图像形成处理控制单元，其控制作业获取单元获取的图像形成作业的性能; 温度信息获取单元，其获取表示所述加热旋转体的温度的信息; 确定单元，其确定由所述温度信息获取单元获取的所述加热旋转体的温度是否等于或高于设置为待机状态下的待执行状态的预定待机温度图像形成处理，当图像形成处理完成时，基于图像形成处理控制单元的图像形成作业; 以及控制定影装置的定影装置控制单元，进行第一待机控制处理，其通过在加热部件的同时加热加热旋转体而使加热旋转体的温度升高到待机温度当确定单元确定加热旋转体的温度低于待机温度时，加热旋转体的旋转体和压制体接触。此外，定影装置控制单元停止加热旋转体的旋转，并且当确定单元确定了加热旋转体的旋转时，执行使定影装置待机的第二待机控制处理，而不加热加热旋转体，加热旋转体的温度为待机温度或更高。

2. 发明授权

US08873987B2 Image forming apparatus, control method, and recording medium 有权
标题翻译：图像形成装置，控制方法和记录介质
公开(公告)号：US08873987B2
公开(公告)日：2014-10-28
申请号：US13164095
申请日：2011-06-20
申请人： Taizo Nozawa , Yukio Futamata , Noboru Furuyama , Satoshi Itaya , Hiroshi Katakura , Setsuo Takada
发明人： Taizo Nozawa , Yukio Futamata , Noboru Furuyama , Satoshi Itaya , Hiroshi Katakura , Setsuo Takada
IPC分类号： G03G15/20
CPC分类号： G03G15/2078 , G03G15/2039
摘要： An embodiment provides an image forming apparatus including: a job acquiring unit that acquires an image forming job that gives instructions for performing forming of an image; an image forming process control unit that controls performance of the image forming job that the job acquiring unit acquires; a temperature information acquiring unit that acquires information showing temperature of the heating rotary body; a determining unit that determines whether the temperature of the heating rotary body which is acquired by the temperature information acquiring unit is equal to or higher than a predetermined stand-by temperature set as a temperature in a stand-by state that stands by to perform the image forming process, when the image forming process is completed, based on the image forming job by the image forming process control unit; and a fixing device control unit.
摘要翻译：实施例提供了一种图像形成装置，包括：作业获取单元，其获取给出用于执行图像形成的指令的图像形成作业; 图像形成处理控制单元，其控制作业获取单元获取的图像形成作业的性能; 温度信息获取单元，其获取表示所述加热旋转体的温度的信息; 确定单元，其确定由所述温度信息获取单元获取的所述加热旋转体的温度是否等于或高于设置为待机状态下的待执行状态的预定待机温度图像形成处理，当图像形成处理完成时，基于图像形成处理控制单元的图像形成作业; 和固定装置控制单元。

3. 发明申请

US20110084385A1 Semiconductor device and information processing system including the same 有权
标题翻译：半导体装置和信息处理系统也包括在内
公开(公告)号：US20110084385A1
公开(公告)日：2011-04-14
申请号：US12923789
申请日：2010-10-07
申请人： Satoshi Itaya , Kayoko Shibata , Shoji Azuma , Akira Ide
发明人： Satoshi Itaya , Kayoko Shibata , Shoji Azuma , Akira Ide
IPC分类号： H01L23/485
CPC分类号： H01L21/76898 , H01L21/563 , H01L23/3128 , H01L23/481 , H01L23/49811 , H01L24/03 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/16 , H01L25/0657 , H01L2224/0401 , H01L2224/0603 , H01L2224/13022 , H01L2224/1308 , H01L2224/13082 , H01L2224/13099 , H01L2224/1403 , H01L2224/16145 , H01L2224/73203 , H01L2225/06513 , H01L2225/06541 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01037 , H01L2924/01051 , H01L2924/01055 , H01L2924/01074 , H01L2924/01076 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/30105 , H01L2924/3011 , H01L2924/00014
摘要： A semiconductor device includes a plurality of core chips and an interface chip that controls the core chips. Each of the core chips and the interface chip includes plural through silicon vias that penetrate a semiconductor substrate and plural pads respectively connected to the through silicon vias. The through silicon vias include a through silicon via of a power source system to which a power source potential or a ground potential is supplied, and a through silicon via of a signal system to which various signals are supplied. Among the pads, at least an size of a pad connected to the through silicon via of the power source system is larger than a size of a pad connected to the through silicon via of the signal system. Therefore, a larger parasitic capacitance can be secured.
摘要翻译：半导体器件包括多个核心芯片和控制芯片芯片的接口芯片。芯片芯片和接口芯片中的每一个都包括穿透半导体衬底的多个穿过硅通孔和分别连接到通孔硅通孔的多个焊盘。贯通硅通孔包括供电电源电位或接地电位的电源系统的贯穿硅通孔，以及供给各种信号的信号系统的通孔硅通孔。在焊盘中，连接到电源系统的贯穿硅通孔的焊盘的至少一个尺寸大于连接到信号系统的通过硅通孔的焊盘的尺寸。因此，可以确保更大的寄生电容。

4. 发明授权

US07694245B2 Method for designing semiconductor package, system for aiding to design semiconductor package, and computer program product therefor 失效
标题翻译：半导体封装设计方法，半导体封装设计系统及其计算机程序产品
公开(公告)号：US07694245B2
公开(公告)日：2010-04-06
申请号：US11710965
申请日：2007-02-27
申请人： Mitsuaki Katagiri , Satoshi Nakamura , Takashi Suga , Yoji Nishio , Satoshi Isa , Satoshi Itaya
发明人： Mitsuaki Katagiri , Satoshi Nakamura , Takashi Suga , Yoji Nishio , Satoshi Isa , Satoshi Itaya
IPC分类号： G06F17/50
CPC分类号： G06F17/5068 , H01L23/50 , H01L2224/05554 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2924/15311 , H01L2924/181 , H01L2924/3011 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method for designing a semiconductor package is disclosed, wherein the semiconductor package comprises a semiconductor chip and an adjustment target. A first target variable is calculated in consideration of a first transition state where an output level of the semiconductor chip changes from a low level to a high level. A second target variable is calculated in consideration of a second transition state where an output level of the semiconductor chip changes from the high level to the low level. Inferior one of the first and the second target variables is selected as a main target variable. The main target variable and a predetermined constraint represented in frequency domain are compared to decide design guidelines for the adjustment target.
摘要翻译：公开了一种用于设计半导体封装的方法，其中半导体封装包括半导体芯片和调整对象。考虑到半导体芯片的输出电平从低电平变为高电平的第一转变状态来计算第一目标变量。考虑到半导体芯片的输出电平从高电平变为低电平的第二过渡状态来计算第二目标变量。选择第一和第二目标变量之一作为主要目标变量。比较主要目标变量和在频域中表示的预定约束，以决定调整目标的设计指南。

5. 发明申请

US20090327981A1 Semiconductor device or printed wiring board design method and design support system that implements settings by using a semiconductor device model that expresses parasitic elements that occur when packaged 审中-公开
标题翻译：半导体器件或印刷线路板设计方法和设计支持系统，通过使用表示在封装时发生的寄生元件的半导体器件模型来实现设置
公开(公告)号：US20090327981A1
公开(公告)日：2009-12-31
申请号：US12457930
申请日：2009-06-25
申请人： Satoshi Nakamura , Tsutomu Hara , Mitsuaki Katagiri , Yukitoshi Hirose , Satoshi Itaya , Ken Iwakura
发明人： Satoshi Nakamura , Tsutomu Hara , Mitsuaki Katagiri , Yukitoshi Hirose , Satoshi Itaya , Ken Iwakura
IPC分类号： G06F17/50
CPC分类号： G06F17/5036 , G06F2217/78 , H05K1/181 , H05K3/0005
摘要： Correction circuit models are acquired for correcting electrical characteristic parameters that change upon mounting on a board. The correction circuit models are added to a separate model that represents a separate semiconductor device in isolation to create a semiconductor device model that represents the semiconductor device in a board-mounted state. An equivalent circuit model that represents an adjustment-object system is connected to the semiconductor device model that was created, and based on the semiconductor device model to which the equivalent circuit model is connected, adjustment-object values relating to the adjustment-object system are calculated. These adjustment-object values are compared with limit values that were determined in advance, and based on the results of comparison, a design guide is determined for adjusting the adjustment-object system.
摘要翻译：获取校正电路模型，用于校正在电路板上安装时变化的电特性参数。校正电路模型被添加到单独的模型中，该模型表示隔离的单独的半导体器件以产生表示板安装状态的半导体器件的半导体器件模型。表示调整对象系统的等效电路模型连接到所创建的半导体器件模型，并且基于与等效电路模型相连接的半导体器件模型，与调整对象系统相关的调整对象值为计算。将这些调整对象值与预先确定的限制值进行比较，并且基于比较结果，确定调整对象系统的设计指南。

6. 发明申请

US20070204251A1 Method for designing semiconductor package, system for aiding to design semiconductor package, and computer program product therefor 失效
标题翻译：半导体封装设计方法，半导体封装设计系统及其计算机程序产品
公开(公告)号：US20070204251A1
公开(公告)日：2007-08-30
申请号：US11710965
申请日：2007-02-27
申请人： Mitsuaki Katagiri , Satoshi Nakamura , Takashi Suga , Yoji Nishio , Satoshi Isa , Satoshi Itaya
发明人： Mitsuaki Katagiri , Satoshi Nakamura , Takashi Suga , Yoji Nishio , Satoshi Isa , Satoshi Itaya
IPC分类号： G06F17/50
CPC分类号： G06F17/5068 , H01L23/50 , H01L2224/05554 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2924/15311 , H01L2924/181 , H01L2924/3011 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method for designing a semiconductor package is disclosed, wherein the semiconductor package comprises a semiconductor chip and an adjustment target. A first target variable is calculated in consideration of a first transition state where an output level of the semiconductor chip changes from a low level to a high level. A second target variable is calculated in consideration of a second transition state where an output level of the semiconductor chip changes from the high level to the low level. Inferior one of the first and the second target variables is selected as a main target variable. The main target variable and a predetermined constraint represented in frequency domain are compared to decide design guidelines for the adjustment target.
摘要翻译：公开了一种用于设计半导体封装的方法，其中半导体封装包括半导体芯片和调整对象。考虑到半导体芯片的输出电平从低电平变为高电平的第一转变状态来计算第一目标变量。考虑到半导体芯片的输出电平从高电平变为低电平的第二过渡状态来计算第二目标变量。选择第一和第二目标变量之一作为主要目标变量。比较主要目标变量和在频域中表示的预定约束，以决定调整目标的设计指南。

7. 发明授权

US07245859B2 Image forming apparatus having a rotary developing device with plural developing units 失效
标题翻译：具有具有多个显影单元的旋转显影装置的图像形成装置
公开(公告)号：US07245859B2
公开(公告)日：2007-07-17
申请号：US11154802
申请日：2005-06-17
申请人： Takahito Kabai , Satoshi Itaya , Mitsuhisa Kato
发明人： Takahito Kabai , Satoshi Itaya , Mitsuhisa Kato
IPC分类号： G03G15/01
CPC分类号： G03G15/0152 , G03G15/0121 , G03G15/0173 , G03G21/1832 , G03G2221/1884
摘要： An image-forming apparatus includes a rotary developing device including a casing having absolute value of the surface potential of not larger than 300 V.
摘要翻译：图像形成装置包括旋转显影装置，其包括表面电位绝对值不大于300V的外壳。

8. 发明申请

US20060285884A1 Image forming apparatus and method for forming image 失效
标题翻译：用于形成图像的图像形成装置和方法
公开(公告)号：US20060285884A1
公开(公告)日：2006-12-21
申请号：US11154802
申请日：2005-06-17
申请人： Takahito Kabai , Satoshi Itaya , Mitsuhisa Kato
发明人： Takahito Kabai , Satoshi Itaya , Mitsuhisa Kato
IPC分类号： G03G15/01
CPC分类号： G03G15/0152 , G03G15/0121 , G03G15/0173 , G03G21/1832 , G03G2221/1884
摘要： Disclosed is an image-forming apparatus comprising a rotary developing device including a casing having absolute value of the surface potential of not larger than 300 V.
摘要翻译：公开了一种图像形成装置，包括具有表面电位绝对值不大于300V的壳体的旋转显影装置。

9. 发明授权

US08350389B2 Semiconductor device and information processing system including the same 有权
标题翻译：半导体装置和信息处理系统也包括在内
公开(公告)号：US08350389B2
公开(公告)日：2013-01-08
申请号：US12923789
申请日：2010-10-07
申请人： Satoshi Itaya , Kayoko Shibata , Shoji Azuma , Akira Ide
发明人： Satoshi Itaya , Kayoko Shibata , Shoji Azuma , Akira Ide
IPC分类号： H01L23/52 , H01L23/48 , H01L29/40
CPC分类号： H01L21/76898 , H01L21/563 , H01L23/3128 , H01L23/481 , H01L23/49811 , H01L24/03 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/16 , H01L25/0657 , H01L2224/0401 , H01L2224/0603 , H01L2224/13022 , H01L2224/1308 , H01L2224/13082 , H01L2224/13099 , H01L2224/1403 , H01L2224/16145 , H01L2224/73203 , H01L2225/06513 , H01L2225/06541 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01037 , H01L2924/01051 , H01L2924/01055 , H01L2924/01074 , H01L2924/01076 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/30105 , H01L2924/3011 , H01L2924/00014
摘要： A semiconductor device includes a plurality of core chips and an interface chip that controls the core chips. Each of the core chips and the interface chip includes plural through silicon vias that penetrate a semiconductor substrate and plural pads respectively connected to the through silicon vias. The through silicon vias include a through silicon via of a power source system to which a power source potential or a ground potential is supplied, and a through silicon via of a signal system to which various signals are supplied. Among the pads, at least an size of a pad connected to the through silicon via of the power source system is larger than a size of a pad connected to the through silicon via of the signal system. Therefore, a larger parasitic capacitance can be secured.
摘要翻译：半导体器件包括多个核心芯片和控制芯片芯片的接口芯片。芯片芯片和接口芯片中的每一个都包括穿透半导体衬底的多个穿过硅通孔和分别连接到通孔硅通孔的多个焊盘。贯通硅通孔包括供电电源电位或接地电位的电源系统的贯穿硅通孔，以及供给各种信号的信号系统的通孔硅通孔。在焊盘中，连接到电源系统的贯穿硅通孔的焊盘的至少一个尺寸大于连接到信号系统的通过硅通孔的焊盘的尺寸。因此，可以确保更大的寄生电容。

10. 发明授权

US07962074B2 Developing unit, image forming apparatus, and floating developer collecting method for developing unit 有权
标题翻译：用于显影单元的显影单元，成像设备和浮动显影剂收集方法
公开(公告)号：US07962074B2
公开(公告)日：2011-06-14
申请号：US12372001
申请日：2009-02-17
申请人： Hirotaka Fukuyama , Satoshi Itaya
发明人： Hirotaka Fukuyama , Satoshi Itaya
IPC分类号： G03G15/09 , G03G21/20
CPC分类号： G03G15/0942
摘要： A suction duct that sucks air is provided downstream from a magnet roller that applies a developer to a photoconductor while rotating, in a direction of rotation of the photoconductor, and upstream of a surface potential sensor that measures surface potential of the photoconductor. Moreover, ribs for adjusting an air flow are arranged within the suction duct in such a manner that a width of an air flow passage formed by a rear end in a direction of air flow and a forward end of a nearest rib in the direction of air flow is narrowed from a rib installed upstream in the direction of air flow toward a rib installed downstream. The collection duct collects a floating developer by using a negative pressure.
摘要翻译：抽吸空气的吸入管设置在从感光体的旋转方向以及测量光电导体的表面电位的表面电位传感器的上游侧的同时向显影剂施加显影剂的磁性辊的下游。此外，用于调节空气流的肋条以这样一种方式设置在吸入管道内，使得由空气流动方向的后端形成的空气流动通道的宽度和空气方向上最近的肋条的前端气流从安装在空气流动方向上游的肋条向安装在下游的肋条变窄。收集管通过使用负压收集漂浮的显影剂。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式