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1. 发明授权

US08480806B2 Bonding structure and semiconductor device manufacturing apparatus 有权
标题翻译：接合结构和半导体器件制造装置
公开(公告)号：US08480806B2
公开(公告)日：2013-07-09
申请号：US12349693
申请日：2009-01-07
申请人： Taichi Nakamura , Hiroshi Takebayashi , Tomoyuki Fujii
发明人： Taichi Nakamura , Hiroshi Takebayashi , Tomoyuki Fujii
IPC分类号： B32B37/00 , C23C16/00 , B23B31/28
CPC分类号： H01L21/6831 , H01L21/67103 , Y10T279/23
摘要： A bonding structure according to the present invention includes: a ceramic member including a hole; a terminal embedded in the ceramic member and including an exposed surface exposed to a bottom portion of the hole; a brazed bond layer formed in contact with the exposed surface of the terminal; and a connecting member inserted in the hole, and bonded to the terminal via the brazed bond layer. An inner diameter of the hole is larger than an outer diameter of the connecting member. A clearance is formed between the hole and the connecting member when the connecting member is inserted in the hole. A braze pool space is formed in a surface of the hole and has a substantially semicircular shape in a cross-sectional plane. The braze pool space is partially filled with a braze material.
摘要翻译：根据本发明的接合结构包括：陶瓷构件，其包括孔; 嵌入在所述陶瓷构件中并包括暴露于所述孔的底部的暴露表面的端子; 形成为与端子的暴露表面接触的钎焊接合层; 以及插入孔中的连接构件，并通过钎焊接合层与端子接合。孔的内径大于连接构件的外径。当连接构件插入孔中时，在孔和连接构件之间形成间隙。钎焊池空间形成在孔的表面中，并且在横截面中具有大致半圆形形状。钎焊池空间部分填充有钎焊材料。

2. 发明授权

US08193629B2 Bonding structure for a terminal of a susceptor of a semiconductor device manufacturing apparatus 有权
标题翻译：半导体器件制造装置的基座的端子的接合结构
公开(公告)号：US08193629B2
公开(公告)日：2012-06-05
申请号：US12350314
申请日：2009-01-08
申请人： Hiroshi Takebayashi , Taichi Nakamura , Tomoyuki Fujii
发明人： Hiroshi Takebayashi , Taichi Nakamura , Tomoyuki Fujii
IPC分类号： B32B3/00
CPC分类号： H01L21/6833 , H01L21/67005 , Y10T428/12535 , Y10T428/24612 , Y10T428/2462
摘要： A bonding structure including: a ceramic member made of aluminum nitride and including a hole; a terminal embedded in the ceramic member, exposed to a bottom surface of the hole, and made of molybdenum; a brazed bond layer consisting of gold (Au) only; and a connecting member inserted in the hole, bonded to the terminal via the brazed bond layer, and made of molybdenum.
摘要翻译：一种接合结构，包括：由氮化铝制成并包括孔的陶瓷构件; 嵌入在陶瓷构件中的端子，暴露于孔的底表面，并由钼制成; 仅由金（Au）组成的钎焊接合层; 以及插入孔中的连接构件，通过钎焊接合层与钼端子接合，并由钼制成。

3. 发明申请

US20090176065A1 BONDING STRUCTURE AND SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS 有权
标题翻译：粘结结构和半导体器件制造设备
公开(公告)号：US20090176065A1
公开(公告)日：2009-07-09
申请号：US12350314
申请日：2009-01-08
申请人： Hiroshi TAKEBAYASHI , Taichi Nakamura , Tomoyuki Fujii
发明人： Hiroshi TAKEBAYASHI , Taichi Nakamura , Tomoyuki Fujii
IPC分类号： B32B3/00
CPC分类号： H01L21/6833 , H01L21/67005 , Y10T428/12535 , Y10T428/24612 , Y10T428/2462
摘要： A bonding structure according to the present invention includes: a ceramic member made of aluminum nitride and including a hole; a terminal embedded in the ceramic member, exposed to a bottom surface of the hole, and made of molybdenum; a brazed bond layer consisted of gold (Au) only; and a connecting member inserted in the hole, bonded to the terminal via the brazed bond layer, and made of molybdenum.
摘要翻译：根据本发明的接合结构包括：由氮化铝制成并包括孔的陶瓷构件; 嵌入在陶瓷构件中的端子，暴露于孔的底表面，并由钼制成; 钎焊接合层仅由金（Au）组成; 以及插入孔中的连接构件，通过钎焊接合层与钼端子接合，并由钼制成。

4. 发明申请

US20090173449A1 BONDING STRUCTURE AND SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS 有权
标题翻译：粘结结构和半导体器件制造设备
公开(公告)号：US20090173449A1
公开(公告)日：2009-07-09
申请号：US12349693
申请日：2009-01-07
申请人： Taichi Nakamura , Hiroshi Takebayashi , Tomoyuki Fujii
发明人： Taichi Nakamura , Hiroshi Takebayashi , Tomoyuki Fujii
IPC分类号： B32B37/00
CPC分类号： H01L21/6831 , H01L21/67103 , Y10T279/23
摘要： A bonding structure according to the present invention includes: a ceramic member including a hole; a terminal embedded in the ceramic member and including an exposed surface exposed to a bottom portion of the hole; a brazed bond layer formed in contact with the exposed surface of the terminal; and a connecting member inserted in the hole, and bonded to the terminal via the brazed bond layer. An inner diameter of the hole is larger than an outer diameter of the connecting member. A clearance is formed between the hole and the connecting member when the connecting member is inserted in the hole. A braze pool space is formed in a surface of the hole and has a substantially semicircular shape in a cross-sectional plane. The braze pool space is partially filled with a braze material.
摘要翻译：根据本发明的接合结构包括：陶瓷构件，其包括孔; 嵌入在所述陶瓷构件中并包括暴露于所述孔的底部的暴露表面的端子; 形成为与端子的暴露表面接触的钎焊接合层; 以及插入孔中的连接构件，并通过钎焊接合层与端子接合。孔的内径大于连接构件的外径。当连接构件插入孔中时，在孔和连接构件之间形成间隙。钎焊池空间形成在孔的表面中，并且在横截面中具有大致半圆形形状。钎焊池空间部分填充有钎焊材料。

5. 发明授权

US08414704B2 Bonding structure and semiconductor device manufacturing apparatus 有权
标题翻译：接合结构和半导体器件制造装置
公开(公告)号：US08414704B2
公开(公告)日：2013-04-09
申请号：US12349682
申请日：2009-01-07
申请人： Tomoyuki Fujii , Taichi Nakamura , Hiroshi Takebayashi
发明人： Tomoyuki Fujii , Taichi Nakamura , Hiroshi Takebayashi
IPC分类号： B32B37/00 , C23C16/00 , H01L21/306 , B23B31/28
CPC分类号： H01L21/67103 , C23C16/4586 , H01L21/6833 , Y10T279/23
摘要： The present invention relates to a bonding structure, including: a ceramic member including a hole; a terminal embedded in the ceramic member, an exposed surface exposed to a bottom portion of the hole, and made of a refractory metal having a thermal expansion coefficient substantially equal to a thermal expansion coefficient of the ceramic member; a brazed bond layer including a first tantalum layer in contact with the exposed surface of the terminal, a gold layer formed on the first tantalum layer, and a second tantalum layer formed on the gold layer; and a connecting member inserted in the hole, bonded to the terminal via the brazed bond layer, and made of a refractory metal having a thermal expansion coefficient substantially equal to the thermal expansion coefficient of the ceramic member.
摘要翻译：本发明涉及一种接合结构，包括：陶瓷构件，其包括孔; 嵌入在所述陶瓷构件中的端子，暴露于所述孔的底部的暴露表面，并且由具有基本上等于所述陶瓷构件的热膨胀系数的热膨胀系数的耐热金属制成; 包括与端子的暴露表面接触的第一钽层，形成在第一钽层上的金层和形成在金层上的第二钽层的钎焊接合层; 以及插入孔中的连接构件，其通过钎焊接合层接合到端子，并且由具有基本上等于陶瓷构件的热膨胀系数的热膨胀系数的难熔金属制成。

6. 发明申请

US20150177112A1 Tensile Test Machine 有权
标题翻译：拉力试验机
公开(公告)号：US20150177112A1
公开(公告)日：2015-06-25
申请号：US14363308
申请日：2012-12-04
申请人： Tomoyuki FUJII , Keiichiro TOHGO , Yoshinobu SHIMAMURA
发明人： Tomoyuki Fujii , Keiichiro Tohgo , Yoshinobu Shimamura
IPC分类号： G01N3/08
CPC分类号： G01N3/08 , G01N2203/0017
摘要： A tensile test machine which has a simple structure and which can measure the strength of a sample having a minute tensile strength is provided. The tensile test machine 100 has a first gripping member 117 and a second gripping member 125 which oppose each other in the horizontal direction and grip two end portions of a sample WK. The first gripping member 117 is supported by a moment receiving member 113a of a torque meter 113 through a first support beam 116 and a tensile force transmitting member 115. The tensile force transmitting member 115 is formed so as to extend in the radial direction of the moment receiving member 113a. The second gripping member 125 is supported by a displacement table 121 through a second support beam 124 and a gripping member support base 123. It is displaced in the direction away from the first gripping member 117, and the amount of displacement is measured by a displacement measuring device 128. An external computer 130 measures the tensile strength of the sample WK using the tensile force sensed by the torque meter 113 and the amount of displacement of the second gripping member 125 sensed by the displacement measuring device 128.
摘要翻译：提供了具有简单结构并且可以测量具有微小拉伸强度的样品的强度的拉伸试验机。拉伸试验机100具有在水平方向上彼此相对并夹持样品WK的两个端部的第一夹持构件117和第二夹持构件125。第一夹持构件117由力矩计113的力矩承受构件113a通过第一支撑梁116和张力传递构件115支撑。张力传递构件115形成为沿着径向方向力矩接收构件113a。第二夹持构件125通过第二支撑梁124和夹持构件支撑基座123由位移台121支撑。其沿远离第一夹持构件117的方向移位，并且通过位移来测量位移量测量装置128.外部计算机130使用由扭矩计113感测的拉力和由位移测量装置128感测到的第二夹持构件125的位移量来测量样品WK的拉伸强度。

7. 发明授权

US06617514B1 Ceramics joint structure and method of producing the same 失效
标题翻译：陶瓷接头结构及其制造方法
公开(公告)号：US06617514B1
公开(公告)日：2003-09-09
申请号：US09095157
申请日：1998-06-10
申请人： Ryusuke Ushikoshi , Hideyoshi Tsuruta , Tomoyuki Fujii
发明人： Ryusuke Ushikoshi , Hideyoshi Tsuruta , Tomoyuki Fujii
IPC分类号： H01R400
CPC分类号： H01L21/6833
摘要： The disclosed ceramics joint structure, in which a ceramics member having an oxidation resistance property and a metal member are joined via a joint layer, has a structure such that a part of the embedded member is exposed to a joint surface of the ceramics member, which is contacted with the joint layer to form a metal exposing portion, and the ceramics member and the metal exposing portion are joined via the joint layer to the metal member respectively. Moreover, the joint layer is mainly made of one or more metal selected from the group consisting of gold, platinum and palladium.
摘要翻译：所公开的具有耐氧化性的陶瓷构件和金属构件的陶瓷接头结构通过接合层接合，具有使嵌入构件的一部分暴露于陶瓷构件的接合面的结构，与接合层接触以形成金属暴露部分，并且陶瓷构件和金属暴露部分分别经由接合层接合到金属构件。此外，接合层主要由选自金，铂和钯的一种或多种金属制成。

8. 发明授权

US06590760B1 Joint structure of ceramics and metal and intermediate insertion member used in this joint structure 有权
标题翻译：在这种接头结构中使用的陶瓷和金属和中间插入件的接头结构
公开(公告)号：US06590760B1
公开(公告)日：2003-07-08
申请号：US09580073
申请日：2000-05-30
申请人： Tomoyuki Fujii
发明人： Tomoyuki Fujii
IPC分类号： H01T2300
CPC分类号： H01L21/6833 , B32B9/005 , B32B9/041 , B32B2250/42 , B32B2307/202 , B32B2457/14 , C04B37/026 , C04B2235/9607 , C04B2237/12 , C04B2237/121 , C04B2237/123 , C04B2237/124 , C04B2237/125 , C04B2237/343 , C04B2237/366 , C04B2237/368 , C04B2237/401 , C04B2237/405 , C04B2237/68 , C04B2237/708 , C04B2237/72 , C04B2237/765 , C04B2237/84
摘要： A joint structure of a first member includes a substrate made of ceramics and a metal embedded member embedded in the substrate, in which a part of the metal embedded member is exposed to a joint surface of the first member, and a second member made of metal. The joint structure includes: an intermediate insertion member interposed between the joint surface of the first member and the second member; a first joint layer which joins the joint surface of the first member and the intermediate insertion member; and a second joint layer which joins the second member and the intermediate insertion member. In the joint structure, the intermediate insertion member is made of a laminated member of a plurality of ceramics layers and at least one metal layer interposed between respective ceramics layers.
摘要翻译：第一构件的接合结构包括由陶瓷制成的基板和嵌入到基板中的金属嵌入构件，其中金属嵌入构件的一部分暴露于第一构件的接合表面，以及由金属制成的第二构件。接头结构包括：中间插入构件，其插入在第一构件的接合面和第二构件之间; 第一接合层，其接合第一构件和中间插入构件的接合表面; 以及连接第二构件和中间插入构件的第二接合层。在接合结构中，中间插入部件由多个陶瓷层的层压部件和介于各陶瓷层之间的至少一个金属层构成。

9. 发明授权

US6057513A Joint structure of metal member and ceramic member and method of producing the same 失效
标题翻译：金属构件和陶瓷构件的接合结构及其制造方法
公开(公告)号：US6057513A
公开(公告)日：2000-05-02
申请号：US13199
申请日：1998-01-26
申请人： Ryusuke Ushikoshi , Hideyoshi Tsuruta , Tomoyuki Fujii
发明人： Ryusuke Ushikoshi , Hideyoshi Tsuruta , Tomoyuki Fujii
IPC分类号： C04B37/02 , H01L21/683 , H05K1/16
CPC分类号： H01L21/6833 , Y10T279/23 , Y10T29/49149
摘要： A joint structure having a metal member and a ceramic member having a housing hole for accommodating at least a part of the metal member therein, in which an electrically conductive joint layer is formed between a bottom face of the metal member and a bottom face of the housing hole, and a film having a given wettability by the electrically conductive joint layer is formed on at least a part of the side wall face of the metal member.
摘要翻译：一种具有金属构件和陶瓷构件的接合结构，其具有用于容纳至少一部分金属构件的容纳孔，其中在金属构件的底面和底面之间形成导电接合层在金属构件的侧壁面的至少一部分上形成有由导电性接合层赋予润湿性的膜的容纳孔和膜。

10. 发明授权

US07854975B2 Joined body and manufacturing method for the same 有权
标题翻译：加盟身体和制造方法相同
公开(公告)号：US07854975B2
公开(公告)日：2010-12-21
申请号：US11354428
申请日：2006-02-15
申请人： Tomoyuki Fujii
发明人： Tomoyuki Fujii
IPC分类号： A47G19/22 , B32B15/04 , H05B3/68 , H05B3/10 , B23K31/02 , C22C21/04
CPC分类号： C04B37/006 , C04B35/645 , C04B35/6455 , C04B2235/6581 , C04B2235/96 , C04B2235/9607 , C04B2237/121 , C04B2237/343 , C04B2237/365 , C04B2237/366 , C04B2237/368 , C04B2237/708 , H05B3/283 , Y10T428/131
摘要： A joined body includes a first ceramic member, a second ceramic member, and a joining layer which contains soft metal, and joins the first ceramic member and the second ceramic member to each other by being thermally compressed at a joining temperature lower than a solidus of the soft metal.
摘要翻译：接合体包括第一陶瓷构件，第二陶瓷构件和包含软金属的接合层，并且通过在比第一陶瓷构件和第二陶瓷构件的固相线的接合温度低的温度下进行热压接将第一陶瓷构件和第二陶瓷构件彼此接合软金属。

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