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1. 发明授权

US07883180B2 Nozzle plate of inkjet printhead and method of manufacturing the nozzle plate 失效
标题翻译：喷墨打印头喷嘴板和制造喷嘴板的方法
公开(公告)号：US07883180B2
公开(公告)日：2011-02-08
申请号：US11766283
申请日：2007-06-21
申请人： Tae-woon Cha , Seung-mo Lim , Sung-gyu Kang , Jae-woo Chung
发明人： Tae-woon Cha , Seung-mo Lim , Sung-gyu Kang , Jae-woo Chung
IPC分类号： B41J2/14
CPC分类号： B41J2/1433 , B41J2/1606 , B41J2/162 , B41J2/1642
摘要： A nozzle plate of an inkjet printhead, and a method of manufacturing the nozzle plate. The nozzle plate includes a substrate through which nozzles are formed; an ink-philic coating layer formed on an outer surface of the substrate and inner walls of the nozzles; and an ink-phobic coating layer selectively formed on the ink-philic coating layer disposed around the nozzles.
摘要翻译：喷墨打印头的喷嘴板，以及喷嘴板的制造方法。喷嘴板包括形成喷嘴的基板; 形成在基板的外表面和喷嘴的内壁上的亲油涂层; 以及在设置在喷嘴周围的亲油性涂层上选择性地形成的墨滴涂层。

2. 发明申请

US20080129780A1 NOZZLE PLATE OF INKJET PRINTHEAD AND METHOD OF MANUFACTURING THE NOZZLE PLATE 失效
标题翻译：喷嘴喷嘴板和制造喷嘴板的方法
公开(公告)号：US20080129780A1
公开(公告)日：2008-06-05
申请号：US11766283
申请日：2007-06-21
申请人： Tae-woon Cha , Seung-mo Lim , Sung-gyu Kang , Jae-woo Chung
发明人： Tae-woon Cha , Seung-mo Lim , Sung-gyu Kang , Jae-woo Chung
IPC分类号： B41J2/135 , B05D3/00
CPC分类号： B41J2/1433 , B41J2/1606 , B41J2/162 , B41J2/1642
摘要： A nozzle plate of an inkjet printhead, and a method of manufacturing the nozzle plate. The nozzle plate includes a substrate through which nozzles are formed; an ink-philic coating layer formed on an outer surface of the substrate and inner walls of the nozzles; and an ink-phobic coating layer selectively formed on the ink-philic coating layer disposed around the nozzles.
摘要翻译：喷墨打印头的喷嘴板，以及喷嘴板的制造方法。喷嘴板包括形成喷嘴的基板; 形成在基板的外表面和喷嘴的内壁上的亲油涂层; 以及在设置在喷嘴周围的亲油性涂层上选择性地形成的墨滴涂层。

3. 发明申请

US20110091645A1 NOZZLE PLATE OF INKJET PRINTHEAD AND METHOD OF MANUFACTURING THE NOZZLE PLATE 审中-公开
标题翻译：喷嘴喷嘴板和制造喷嘴板的方法
公开(公告)号：US20110091645A1
公开(公告)日：2011-04-21
申请号：US12979507
申请日：2010-12-28
申请人： Tae-woon CHA , Seung-mo Lim , Sung-gyu Kang , Jae-woo Chung
发明人： Tae-woon CHA , Seung-mo Lim , Sung-gyu Kang , Jae-woo Chung
IPC分类号： B05D7/22 , C23C14/34
CPC分类号： B41J2/1433 , B41J2/1606 , B41J2/162 , B41J2/1642
摘要： A nozzle plate of an inkjet printhead, and a method of manufacturing the nozzle plate. The nozzle plate includes a substrate through which nozzles are formed; an ink-philic coating layer formed on an outer surface of the substrate and inner walls of the nozzles; and an ink-phobic coating layer selectively formed on the ink-philic coating layer disposed around the nozzles.
摘要翻译：喷墨打印头的喷嘴板，以及喷嘴板的制造方法。喷嘴板包括形成喷嘴的基板; 形成在基板的外表面和喷嘴的内壁上的亲油涂层; 以及在设置在喷嘴周围的亲油性涂层上选择性地形成的墨滴涂层。

4. 发明授权

US07926177B2 Method of forming hydrophobic coating layer on surface of nozzle plate of inkjet printhead 失效
标题翻译：在喷墨打印头喷嘴板表面形成疏水涂层的方法
公开(公告)号：US07926177B2
公开(公告)日：2011-04-19
申请号：US11425204
申请日：2006-06-20
申请人： Sung-gyu Kang , Kae-dong Back , Seung-mo Lim , Jae-woo Chung
发明人： Sung-gyu Kang , Kae-dong Back , Seung-mo Lim , Jae-woo Chung
IPC分类号： B23P17/00 , B21D53/76 , B41J2/15 , B41J2/145
CPC分类号： B41J2/1433 , B41J2/1606 , B41J2/162 , B41J2/1628 , B41J2/1631 , B41J2/1643 , Y10T29/49401
摘要： A method of forming a hydrophobic coating layer on a surface of a nozzle plate of an inkjet printhead includes forming a plurality of nozzles in the nozzle plate, each of the nozzles having an exit, stacking a film on the surface of the nozzle plate to cover the exit of each of the nozzles, forming a predetermined metal layer on an inner wall of each of the nozzles and an inner surface of the film covering the exit of each of the nozzles using a plating method, removing the film from the surface of the nozzle plate, forming a hydrophobic coating layer on the surface of the nozzle plate to cover the metal layer exposed through the exit of each of the nozzles, and removing the metal layer formed on the inner wall of each of the nozzles and the hydrophobic coating layer formed on the surface of the metal layer.
摘要翻译：在喷墨打印头的喷嘴板的表面上形成疏水涂层的方法包括在喷嘴板中形成多个喷嘴，每个喷嘴具有出口，在喷嘴板的表面上堆叠膜以覆盖每个喷嘴的出口，在每个喷嘴的内壁上形成预定的金属层，并且使用电镀方法将膜的内表面覆盖每个喷嘴的出口，从该表面移除该膜喷嘴板，在喷嘴板的表面上形成疏水涂层，以覆盖通过每个喷嘴的出口暴露的金属层，并且去除形成在每个喷嘴的内壁上的金属层和疏水涂层形成在金属层的表面上。

5. 发明申请

US20050190241A1 Piezoelectric actuator for an ink-jet printhead and method of forming the same 失效
标题翻译：用于喷墨打印头的压电致动器及其形成方法
公开(公告)号：US20050190241A1
公开(公告)日：2005-09-01
申请号：US11064826
申请日：2005-02-25
申请人： Hwa-sun Lee , Jae-woo Chung , Seung-mo Lim , Sung-gyu Kang
发明人： Hwa-sun Lee , Jae-woo Chung , Seung-mo Lim , Sung-gyu Kang
IPC分类号： B41J2/045 , B41J2/055 , B41J2/135 , B41J2/14 , B41J2/16
CPC分类号： B41J2/14233 , B41J2/161 , B41J2/1628 , B41J2/1631 , B41J2/1642 , B41J2002/14491 , Y10T29/42
摘要： In a piezoelectric actuator for an ink-jet printhead, and a method of forming the same, formed on a flow path plate having a pressurizing chamber, the piezoelectric actuator for applying a driving force for ink ejection to the pressurizing chamber, the piezoelectric actuator includes a lower electrode formed on the flow path plate, a bonding pad formed on the flow path plate to be insulated from the lower electrode, wherein a driving circuit for voltage application is bonded to an upper surface of the bonding pad, a piezoelectric layer formed on the lower electrode at a position corresponding to the pressurizing chamber, wherein an end of the piezoelectric layer extends onto the bonding pad, and an upper electrode formed on the piezoelectric layer, wherein an end of the upper electrode extends beyond the end of the piezoelectric layer and contacts the upper surface of the bonding pad.
摘要翻译：在具有加压室的流路板上形成的用于喷墨打印头的压电致动器及其形成方法中，压电致动器用于向加压室施加用于喷墨的驱动力，压电致动器包括形成在所述流路板上的下电极，形成在所述流路板上以与所述下电极绝缘的接合焊盘，其中施加电压的驱动电路接合到所述接合焊盘的上表面，形成在所述接合焊盘的上表面上的压电层所述下部电极在与所述加压室对应的位置处，其中所述压电层的端部延伸到所述接合焊盘上，以及形成在所述压电层上的上部电极，其中所述上部电极的端部延伸超出所述压电层的端部并接触焊盘的上表面。

6. 发明申请

US20070120889A1 METHOD OF FORMING HYDROPHOBIC COATING LAYER ON SURFACE OF NOZZLE PLATE OF INKJET PRINTHEAD 失效
标题翻译：在喷嘴喷嘴板表面形成疏水涂层的方法
公开(公告)号：US20070120889A1
公开(公告)日：2007-05-31
申请号：US11425204
申请日：2006-06-20
申请人： Sung-gyu KANG , Kae-dong Back , Seung-mo Lim , Jae-woo Chung
发明人： Sung-gyu KANG , Kae-dong Back , Seung-mo Lim , Jae-woo Chung
IPC分类号： B41J2/135
CPC分类号： B41J2/1433 , B41J2/1606 , B41J2/162 , B41J2/1628 , B41J2/1631 , B41J2/1643 , Y10T29/49401
摘要： A method of forming a hydrophobic coating layer on a surface of a nozzle plate of an inkjet printhead includes forming a plurality of nozzles in the nozzle plate, each of the nozzles having an exit, stacking a film on the surface of the nozzle plate to cover the exit of each of the nozzles, forming a predetermined metal layer on an inner wall of each of the nozzles and an inner surface of the film covering the exit of each of the nozzles using a plating method, removing the film from the surface of the nozzle plate, forming a hydrophobic coating layer on the surface of the nozzle plate to cover the metal layer exposed through the exit of each of the nozzles, and removing the metal layer formed on the inner wall of each of the nozzles and the hydrophobic coating layer formed on the surface of the metal layer.
摘要翻译：在喷墨打印头的喷嘴板的表面上形成疏水涂层的方法包括在喷嘴板中形成多个喷嘴，每个喷嘴具有出口，在喷嘴板的表面上堆叠膜以覆盖每个喷嘴的出口，在每个喷嘴的内壁上形成预定的金属层，并且使用电镀方法将膜的内表面覆盖每个喷嘴的出口，从该表面移除该膜喷嘴板，在喷嘴板的表面上形成疏水涂层，以覆盖通过每个喷嘴的出口暴露的金属层，并且去除形成在每个喷嘴的内壁上的金属层和疏水涂层形成在金属层的表面上。

7. 发明申请

US20110049095A1 METHOD OF FORMING HYDROPHOBIC COATING LAYER ON SURFACE OF NOZZLE PLATE OF INKJET PRINTHEAD 审中-公开
标题翻译：在喷嘴喷嘴板表面形成疏水涂层的方法
公开(公告)号：US20110049095A1
公开(公告)日：2011-03-03
申请号：US12941218
申请日：2010-11-08
申请人： Sung-gyu Kang , Kae-dong Back , Seung-mo Lim , Jae-Woo Chung
发明人： Sung-gyu Kang , Kae-dong Back , Seung-mo Lim , Jae-Woo Chung
IPC分类号： B05D3/10 , B05D1/02 , B05D3/00
CPC分类号： B41J2/1433 , B41J2/1606 , B41J2/162 , B41J2/1628 , B41J2/1631 , B41J2/1643 , Y10T29/49401
摘要： A method of forming a hydrophobic coating layer on a surface of a nozzle plate of an inkjet printhead includes forming a plurality of nozzles in the nozzle plate, each of the nozzles having an exit, stacking a film on the surface of the nozzle plate to cover the exit of each of the nozzles, forming a predetermined metal layer on an inner wall of each of the nozzles and an inner surface of the film covering the exit of each of the nozzles using a plating method, removing the film from the surface of the nozzle plate, forming a hydrophobic coating layer on the surface of the nozzle plate to cover the metal layer exposed through the exit of each of the nozzles, and removing the metal layer formed on the inner wall of each of the nozzles and the hydrophobic coating layer formed on the surface of the metal layer.
摘要翻译：在喷墨打印头的喷嘴板的表面上形成疏水涂层的方法包括在喷嘴板中形成多个喷嘴，每个喷嘴具有出口，在喷嘴板的表面上堆叠膜以覆盖每个喷嘴的出口，在每个喷嘴的内壁上形成预定的金属层，并且使用电镀方法将膜的内表面覆盖每个喷嘴的出口，从该表面移除该膜喷嘴板，在喷嘴板的表面上形成疏水涂层，以覆盖通过每个喷嘴的出口暴露的金属层，并且去除形成在每个喷嘴的内壁上的金属层和疏水涂层形成在金属层的表面上。

8. 发明授权

US07681989B2 Piezoelectric actuator for an ink-jet printhead and method of forming the same 失效
标题翻译：用于喷墨打印头的压电致动器及其形成方法
公开(公告)号：US07681989B2
公开(公告)日：2010-03-23
申请号：US11064826
申请日：2005-02-25
申请人： Hwa-sun Lee , Jae-woo Chung , Seung-mo Lim , Sung-gyu Kang
发明人： Hwa-sun Lee , Jae-woo Chung , Seung-mo Lim , Sung-gyu Kang
IPC分类号： B41J2/16 , H01L41/24 , B41J2/45
CPC分类号： B41J2/14233 , B41J2/161 , B41J2/1628 , B41J2/1631 , B41J2/1642 , B41J2002/14491 , Y10T29/42
摘要： In a piezoelectric actuator for an ink-jet printhead, and a method of forming the same, formed on a flow path plate having a pressurizing chamber, the piezoelectric actuator for applying a driving force for ink ejection to the pressurizing chamber, the piezoelectric actuator includes a lower electrode formed on the flow path plate, a bonding pad formed on the flow path plate to be insulated from the lower electrode, wherein a driving circuit for voltage application is bonded to an upper surface of the bonding pad, a piezoelectric layer formed on the lower electrode at a position corresponding to the pressurizing chamber, wherein an end of the piezoelectric layer extends onto the bonding pad, and an upper electrode formed on the piezoelectric layer, wherein an end of the upper electrode extends beyond the end of the piezoelectric layer and contacts the upper surface of the bonding pad.
摘要翻译：在具有加压室的流路板上形成的用于喷墨打印头的压电致动器及其形成方法中，压电致动器用于向加压室施加用于喷墨的驱动力，压电致动器包括形成在所述流路板上的下电极，形成在所述流路板上以与所述下电极绝缘的接合焊盘，其中施加电压的驱动电路接合到所述接合焊盘的上表面，形成在所述接合焊盘的上表面上的压电层所述下部电极在与所述加压室对应的位置处，其中所述压电层的端部延伸到所述接合焊盘上，以及形成在所述压电层上的上部电极，其中所述上部电极的端部延伸超出所述压电层的端部并接触焊盘的上表面。

9. 发明申请

US20070155056A1 Silicon direct bonding method 有权
标题翻译：硅直接键合法
公开(公告)号：US20070155056A1
公开(公告)日：2007-07-05
申请号：US11505420
申请日：2006-08-17
申请人： Sung-gyu Kang , Seung-mo Lim , Jae-chang Lee , Woon-bae Kim
发明人： Sung-gyu Kang , Seung-mo Lim , Jae-chang Lee , Woon-bae Kim
IPC分类号： H01L21/00
CPC分类号： H01L21/187 , H01L21/2007
摘要： A silicon direct bonding (SDB) method by which void formation caused by gases is suppressed. The SDB method includes: preparing two silicon substrates having corresponding bonding surfaces; forming trenches having a predetermined depth in at least one bonding surface of the two silicon substrates; forming gas discharge outlets connected to the trenches on at least one of the two silicon substrates to vertically penetrate the bonding surface; cleaning the two silicon substrates; closely contacting the two silicon substrates to each other; and thermally treating the two substrates to bond them to each other. The trenches are formed along at least a part of a plurality of dicing lines, and both ends of the trenches are clogged. Gases generated during a thermal treatment process can be smoothly and easily discharged through the trenches and the gas discharge outlet such that a void is prevented from being formed in the junctions of the two silicon substrates due to the gases.
摘要翻译：抑制由气体引起的空隙形成的硅直接接合（SDB）方法。 SDB方法包括：制备具有相应粘合表面的两个硅衬底; 在所述两个硅衬底的至少一个接合表面中形成具有预定深度的沟槽; 形成连接到所述两个硅衬底中的至少一个上的沟槽的气体放电出口，以垂直地穿透所述接合表面; 清洁两个硅衬底; 使两个硅衬底彼此紧密接触; 并对两个基板进行热处理以将它们彼此粘合。沟槽沿着多个切割线的至少一部分形成，并且沟槽的两端被堵塞。在热处理过程中产生的气体可以通过沟槽和气体排出口平滑且容易地排出，从而防止由于气体而在两个硅衬底的接合处形成空隙。

10. 发明授权

US07442622B2 Silicon direct bonding method 有权
标题翻译：硅直接键合法
公开(公告)号：US07442622B2
公开(公告)日：2008-10-28
申请号：US11505420
申请日：2006-08-17
申请人： Sung-gyu Kang , Seung-mo Lim , Jae-chang Lee , Woon-bae Kim
发明人： Sung-gyu Kang , Seung-mo Lim , Jae-chang Lee , Woon-bae Kim
IPC分类号： H01L21/30
CPC分类号： H01L21/187 , H01L21/2007
摘要： A silicon direct bonding (SDB) method by which void formation caused by gases is suppressed. The SDB method includes: preparing two silicon substrates having corresponding bonding surfaces; forming trenches having a predetermined depth in at least one bonding surface of the two silicon substrates; forming gas discharge outlets connected to the trenches on at least one of the two silicon substrates to vertically penetrate the bonding surface; cleaning the two silicon substrates; closely contacting the two silicon substrates to each other; and thermally treating the two substrates to bond them to each other. The trenches are formed along at least a part of a plurality of dicing lines, and both ends of the trenches are clogged. Gases generated during a thermal treatment process can be smoothly and easily discharged through the trenches and the gas discharge outlet such that a void is prevented from being formed in the junctions of the two silicon substrates due to the gases.
摘要翻译：抑制由气体引起的空隙形成的硅直接接合（SDB）方法。 SDB方法包括：制备具有相应粘合表面的两个硅衬底; 在所述两个硅衬底的至少一个接合表面中形成具有预定深度的沟槽; 形成连接到所述两个硅衬底中的至少一个上的沟槽的气体放电出口，以垂直地穿透所述接合表面; 清洁两个硅衬底; 使两个硅衬底彼此紧密接触; 并对两个基板进行热处理以将它们彼此粘合。沟槽沿着多个切割线的至少一部分形成，并且沟槽的两端被堵塞。在热处理过程中产生的气体可以通过沟槽和气体排出口平滑且容易地排出，从而防止由于气体而在两个硅衬底的接合处形成空隙。

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