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    • 1. 发明授权
    • Floor treating machine
    • 地板处理机
    • US5435035A
    • 1995-07-25
    • US898578
    • 1992-06-15
    • Tadayoshi FujimotoYoshio MiyazakiNobuyoshi Kumaki
    • Tadayoshi FujimotoYoshio MiyazakiNobuyoshi Kumaki
    • A47L11/162
    • A47L11/4002A47L11/162A47L11/4005A47L11/4011A47L11/4069H01H2009/068
    • A floor treating machine includes an electric motor, batteries free from leakage and mounted on a motor deck for supplying a current to the electric motor, a rotary shaft extending vertically and driven by the electric motor, and a floor treating device, such as a brush or sponge, detachably attached to a lower end of the rotary shaft to be rotatable therewith. The floor treating device contacts a floor and supports the machine during a floor treating operation. The electric motor is connected to the batteries through an on/off switch. The floor treating machine further includes a rotating rate varying device operable upon start of the electric motor for gradually increasing a rotating rate of the electric motor to reach a predetermined operational rotating rate after lapse of a predetermined time.
    • 一种地板处理机包括电动机,没有泄漏的电池,并且安装在用于向电动机供应电流的电动机座上,由电动机垂直延伸并由电动机驱动的旋转轴,以及诸如电刷的地板处理装置 或海绵,可拆卸地附接到旋转轴的下端以与其一起旋转。 地板处理装置在地板处理操作期间接触地板并支撑机器。 电动机通过开/关开关连接到电池。 地板处理机还包括可在电动机启动时操作的转速改变装置,用于在经过预定时间之后逐渐增大电动机的转速达到预定的操作转速。
    • 2. 发明申请
    • Method of Maintaining Floor Covering Layer, and Grinding Apparatus for Use in Said Method
    • 维护地板覆盖层的方法,以及用于所述方法的研磨装置
    • US20090232974A1
    • 2009-09-17
    • US12084048
    • 2005-10-28
    • Tadayoshi FujimotoIsao MoritaKatsuaki Namba
    • Tadayoshi FujimotoIsao MoritaKatsuaki Namba
    • B32B43/00B05D3/12B24B7/00
    • A47L11/2025A47L11/4022A47L11/4038A47L11/4069A47L11/408B05D3/12B05D5/005B24B7/186B24B55/06
    • The present invention makes it possible to simplify the work of maintaining the covering performance of a covering layer by a method for maintaining a floor covering layer whereby the covering performance of a covering layer B that is formed on a floor (A) and covers the floor (A) can be maintained. In this method, the resin covering layer B having a thickness (T0) of 30 to 100 μm is formed on the floor. The surface of the resin covering layer B is subjected to dry grinding without the use of a liquid by using grinding pads (6) and (7) provided with grinding surfaces (6a) and (7a) that move along one direction. The generated grindings are recovered, and a layering material (26) for the resin covering layer is then coated onto the resin covering layer (B) to restore the thickness (T1) of the resin covering layer (B), which has been reduced by grinding, to substantially an original thickness (T0). This thickness restoration work is carried out with proper timing that corresponds to a reduction in the covering performance to maintain the covering performance of the covering layer (B).
    • 本发明能够通过保持地板覆盖层的方法简化保持覆盖层的覆盖性能的工作,由此形成在地板(A)上并覆盖地板(A)的覆盖层B的覆盖性能 (A)可以维护。 在该方法中,在地板上形成厚度(T0)为30〜100μm的树脂被覆层B. 通过使用具有沿着一个方向移动的研磨面(6a)和(7a)的研磨垫(6)和(7),树脂被覆层B的表面进行干式研磨而不使用液体。 回收生成的研磨物,然后将用于树脂覆盖层的分层材料(26)涂覆到树脂覆盖层(B)上,以恢复树脂覆盖层(B)的厚度(T1),其已经被减少 研磨至基本上原始厚度(T0)。 该厚度恢复工作通过适当的时间进行,这对应于覆盖层的降低,以保持覆盖层(B)的覆盖性能。