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    • 1. 发明授权
    • Epitaxial growth method
    • 外延生长法
    • US5904769A
    • 1999-05-18
    • US775353
    • 1997-01-03
    • Tadashi OhashiShinichi MitaniTakaaki Honda
    • Tadashi OhashiShinichi MitaniTakaaki Honda
    • C30B29/06C23C16/24C30B25/02H01L21/205C30B25/14
    • C30B29/06C30B25/02
    • This invention provides an epitaxial growth method capable of decreasing variations of the resistance of an epitaxial layer resulting from an in-plane temperature distribution of a silicon wafer and also capable of reducing particles and haze. This epitaxial growth method is an epitaxial growth method of growing a boron- or phosphorus-doped silicon epitaxial layer on the surface of a silicon wafer with an in-plane temperature distribution of 2 to 50.degree. C., and includes the steps of arranging the silicon wafer in a reaction vessel, supplying into the reaction vessel a source gas containing (a) silane, (b) 5 to 600 vol % of hydrogen chloride added to the silane, and (c) a dopant consisting of a boron compound or a phosphorus compound, and growing a boron- or phosphorus-doped silicon epitaxial layer on the surface of the wafer by setting a vacuum degree of 10 to 200 torr in the reaction vessel and heating the wafer to 900 to 1100.degree. C.
    • 本发明提供一种外延生长方法,其能够降低由硅晶片的面内温度分布产生的外延层的电阻的变化,并且还能够减少颗粒和雾度。 这种外延生长方法是在硅晶片的表面上生长含硼或磷掺杂的硅外延层的外延生长方法,其中平面内温度分布为2至50℃,并且包括以下步骤: 硅晶片,向反应容器供应含有(a)硅烷,(b)5至600体积%的加入到硅烷中的氯化氢的源气体,以及(c)由硼化合物或 磷化合物,并通过在反应容器中设置10至200托的真空度并将晶片加热至900至1100℃,在晶片表面上生长硼或磷掺杂的硅外延层。
    • 4. 发明授权
    • Vapor deposition apparatus and method for forming thin film
    • 蒸镀装置及薄膜形成方法
    • US6059885A
    • 2000-05-09
    • US991407
    • 1997-12-16
    • Tadashi OhashiKatuhiro ChakiPing XinTatsuo FujiiKatsuyuki IwataShinichi MitaniTakaaki Honda
    • Tadashi OhashiKatuhiro ChakiPing XinTatsuo FujiiKatsuyuki IwataShinichi MitaniTakaaki Honda
    • C23C16/44C23C16/455C23C16/458C30B25/14C23C16/00
    • C23C16/45574C23C16/4401C23C16/4412C23C16/45502C23C16/45519C23C16/45565C23C16/45576C23C16/4584C30B25/14
    • A vapor deposition apparatus includes a cylindrical hollow reactor having gas supply ports at its upper portion and an exhaust port at its bottom portion. A rotational substrate holder, which seats a wafer substrate, is concentrically placed inside the reactor. The reactor has a straightening vane having gas holes concentrically positioned at its upper portion. Reaction gas is supplied into the reactor to form a thin film on the surface of the wafer substrate on the rotational substrate holder by vapor deposition. In one embodiment, the straightening vane is configured so that the flow rate of the reaction gas in the center portion covering the area of the wafer substrate and the gas flow rate of the reaction gas in the outer portion of the center portion are different from each other. In another embodiment, the reactor is sectioned into upper and lower portions. The inner diameter of the upper portion is smaller than the inner diameter of the lower portion. A link portion connects the lower end of the upper portion and the upper end of the lower portion. The link portion is provided with straightening gas flow-out holes. The rotational substrate holder is positioned below the lower end of the upper portion of the reactor by a predetermined height difference.
    • 蒸镀装置包括:圆筒状中空反应器,其上部具有气体供给口,底部具有排气口。 旋转衬底保持器,其位于晶片衬底上,同心地放置在反应器内。 反应器具有矫直叶片,其具有同心地位于其上部的气孔。 将反应气体供给到反应器中,通过气相沉积在旋转基板保持器上的晶片基板的表面上形成薄膜。 在一个实施例中,矫直叶片被构造成使得覆盖晶片基板的区域的中心部分中的反应气体的流量和中心部分的外部中的反应气体的气体流量各自不同 其他。 在另一个实施方案中,反应器被分成上部和下部。 上部的内径小于下部的内径。 连接部分连接上部的下端和下部的上端。 连杆部设有矫直气体流出孔。 旋转衬底保持器定位在反应器的上部的下端下方预定的高度差。
    • 9. 发明授权
    • Apparatus for reduced-pressure epitaxial growth and method of controlling the apparatus
    • 减压外延生长装置及其控制方法
    • US06485573B2
    • 2002-11-26
    • US09855654
    • 2001-05-16
    • Katsuyuki IwataTadashi OhashiShyuji TobashiShinichi MitaniHideki AraiHideki Ito
    • Katsuyuki IwataTadashi OhashiShyuji TobashiShinichi MitaniHideki AraiHideki Ito
    • C23C1600
    • C23C16/45521C23C16/45557C23C16/4584C23C16/52C30B25/12C30B25/14
    • An apparatus for reduced-pressure gaseous phase epitaxial growth by suppressing contamination upon the machine parts constituting the rotary mechanical portion and suppressing contamination upon the semiconductor wafer by maintaining the pressure in the rotary mechanical portion to lie within a particular range, and a method of controlling the above apparatus. The apparatus comprises a purging gas introduction pipe 6 for purging the interior of the rotary mechanical portion, a purging gas exhaust pipe 7 for exhausting the gas introduced through the purging gas introduction pipe, a pressure adjusting valve 41 provided in the purging gas exhaust pipe, a pressure gauge 21 for detecting the pressure in the rotary mechanical portion, and an arithmetic/control unit 31 for executing an arithmetic operation based upon the detected pressure and for controlling the opening degree of the pressure adjusting valve 41 provided in the purging gas exhaust pipe, so that the pressure in the rotary mechanical portion assumes a proper value.
    • 一种通过抑制构成旋转机械部分的机器部件上的污染并通过将旋转机械部分中的压力维持在特定范围内来抑制半导体晶片上的污染物的减压气相外延生长装置,以及控制方法 上述装置。 该装置包括用于清洗旋转机械部分内部的净化气体引入管6,用于排出通过吹扫气体导入管引入的气体的净化气体排出管7,设置在净化气体排出管中的压力调节阀41, 用于检测旋转机械部分中的压力的​​压力计21以及用于基于检测到的压力执行算术运算并且用于控制设置在净化气体排出管中的压力调节阀41的开度的运算/控制单元31 ,使得旋转机械部分中的压力呈现适当的值。