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    • 4. 发明授权
    • Process for continuous casting of a slightly deoxidized steel slab
    • 连续铸造轻度脱氧钢板的工艺
    • US4298050A
    • 1981-11-03
    • US091813
    • 1979-11-06
    • Tetsro OhashiOsamu KitamuraHiromu FujiiSeizo MineyukiEiichi Takeuchi
    • Tetsro OhashiOsamu KitamuraHiromu FujiiSeizo MineyukiEiichi Takeuchi
    • B01F13/08B22D11/10B22D11/11B22D11/115B22D27/02B22D11/00
    • B22D11/11B22D11/115
    • In the continuous casting of steel, it has been possible to produce killed steel industrially, but semikilled and rimmed steel have not been successfully produced due to rimming action occurring in the oscillating mold. The present invention involves a concept of suppressing the nuclei of bubbles which will later grow into CO bubbles. In order to suppress the nuclei of bubbles and to form a non-defective solidification layer of a continuously cast strand, the present invention provides a combination of: a free oxygen concentration of from 50 to 200 ppm in the molten steel; a concave shape at the short sides of the mold; a propulsion forces of the molten steel directed along the long sides of the mold in directions opposite to one another; subjecting a solidification interface to an electromagnetic flow having a speed of from 0.1 to 1.0 m/sec, and; solidifying the molten steel at the solidification interface under the influence of the electromagnetic flow, until a non-defective solidification layer without blow holes is obtained.
    • 在钢的连续铸造中,可以在工业上生产杀死的钢,但是由于在振荡模具中发生皱缩作用,半成品和边缘钢没有成功地生产。 本发明涉及一种抑制气泡核的概念,后者将会生长成CO气泡。 为了抑制气泡的核并形成连续铸造线的无缺陷凝固层,本发明提供了在钢水中游离氧浓度为50〜200ppm的组合, 在模具的短边处形成凹形; 沿着模具的长边方向相反的方向引导的钢水的推进力; 使凝固界面经受0.1〜1.0m /秒的速度的电磁流动, 在电磁流动的影响下在固化界面处固化钢水,直到获得无气孔的无缺陷凝固层。
    • 9. 发明授权
    • Dry etching method
    • 干蚀刻法
    • US5254215A
    • 1993-10-19
    • US792221
    • 1991-11-12
    • Shingo TerakadoOsamu Kitamura
    • Shingo TerakadoOsamu Kitamura
    • H01L21/3065H01L21/311H01L21/3213H01L21/00
    • H01J37/32339H01L21/3065H01L21/31116H01L21/32136H01L21/32137
    • A dry etching method capable of performing fine patterning. A sample substrate is fixedly disposed on a table in a reactant chamber. Gas plasma produced by a gas plasma generator is introduced into the reactant chamber, and excitation light, that is, light capable of exciting inner shell electrons of constituent atoms of the substrate, is irradiated onto the substrate from above the substrate. In the optical path of the excitation light is disposed a mask. The substrate is irradiated with the light in response to a pattern designated by the mask. The excitation light has an energy for exciting electrons of constituent atoms of the substrate. Upon arrival of the light in etched regions, the electrons of the substrate are excited. As a result, etching is effected by the contact of the excited electrons with the gas plasma, and the rate of this etching is greatly enhanced. Since the electrons of the substrate in masked areas are not excited, the masked areas become hardly subjected to etching by the contact of the gas plasma, whereby the pattern of the mask is transferred to the substrate with high accuracy, whereby fine patterns are formed.
    • 能够进行精细图案化的干蚀刻方法。 样品基板固定地设置在反应物室中的工作台上。 由气体等离子体发生器产生的气体等离子体被引入到反应物室中,激发光(即,能够激发衬底的组成原子的内壳电子的光)从衬底上方照射到衬底上。 在激发光的光路中设置掩模。 响应于由掩模指定的图案,用光照射基板。 激发光具有用于激发基板的组成原子的电子的能量。 当光在蚀刻区域到达时,衬底的电子被激发。 结果,通过激发的电子与气体等离子体的接触来实现蚀刻,并且该蚀刻的速率被大大增强。 由于掩模区域中的基板的电子不被激发,所以掩模区域难以通过气体等离子体的接触进行蚀刻,由此掩模的图案以高精度传递到基板,从而形成精细的图案。