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    • 9. 发明授权
    • Dielectric, radiation-curable coating compositions
    • 电介质,可辐射固化的涂料组合物
    • US07109253B1
    • 2006-09-19
    • US08961084
    • 1997-10-30
    • Vadim V. KrongauzStephen C. LapinAnthony J. Tortorello
    • Vadim V. KrongauzStephen C. LapinAnthony J. Tortorello
    • C08F2/50C09D163/10C09D175/16
    • C09D175/16C08G18/69C08G18/8175G03F7/027
    • A metal conductor is provided with a cured coating of about 2.5 μm to about 500 μm thickness, which cured coating has a dielectric dissipation factor (60 Hz, 24° C.) of lower than about 0.05 and is a radiation-cured coating formulated from components comprising: a) an acrylate functional urethane oligomer having a hydrocarbon backbone; b) one or more mono- or polyfunctional diluents; and optionally, c) one or more light sensitive radical generating compounds. The invention further provides a radiation-curable coating composition for coating a metal conductor. Also disclosed is a method of making a metal conductor provided with a cured coating of about 2.5 μm to about 500 μm thickness, which cured coating has a dielectric dissipation factor (60 Hz, 24° C.) of lower than about 0.05.
    • 金属导体设置有约2.5μm至约500μm厚度的固化涂层,该固化涂层具有低于约0.05的介电损耗因子(60Hz,24℃),并且是由 组分包括:a)具有烃主链的丙烯酸酯官能氨基甲酸酯低聚物; b)一种或多种单或多官能稀释剂; 和任选地,c)一种或多种光敏自由基产生化合物。 本发明还提供了一种用于涂覆金属导体的可辐射固化涂料组合物。 还公开了一种制造具有约2.5μm至约500μm厚度的固化涂层的金属导体的方法,该固化涂层的介电损耗因子(60Hz,24℃)低于约0.05。