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1. 发明授权

US07476037B2 Apparatus for coupling a fiber optic cable to an optoelectronic device, a system including the apparatus, and a method of forming the same 有权
公开(公告)号：US07476037B2
公开(公告)日：2009-01-13
申请号：US11461656
申请日：2006-08-01
申请人： Suresh Golwalkar , Noah Davis , John Burns , Kannan Raj , Phil McClay , Wuchun Chou , Jonathan McFarland
发明人： Suresh Golwalkar , Noah Davis , John Burns , Kannan Raj , Phil McClay , Wuchun Chou , Jonathan McFarland
IPC分类号： G02B6/36 , H01R33/945 , B29D11/00
CPC分类号： G02B6/4231 , G02B6/3817 , G02B6/4201 , G02B6/4212 , G02B6/4249 , G02B6/4284 , G02B6/4292
摘要： A device for forming an optical connection between an optoelectronic device and an optical fiber and for forming an electrical connection between the optoelectronic device and a substrate, a system including the device and materials, and methods of forming the device and system are disclosed. The device for forming an optical connection includes a—light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes guide grooves configured to receive guide pins from a fiber ribbon connector, such that when the fiber ribbon connector is attached to the device, fibers of the ribbon align with the optoelectronic device via the light transmission medium.

2. 发明授权

US07101091B2 Apparatus for coupling a fiber optic cable to an optoelectronic device, a system including the apparatus, and a method of forming the same 有权
公开(公告)号：US07101091B2
公开(公告)日：2006-09-05
申请号：US09911918
申请日：2001-07-24
申请人： Suresh Golwalkar , Noah Davis , John Burns , Kannan Raj , Phil McClay , Wuchun Chou , Jonathan McFarland
发明人： Suresh Golwalkar , Noah Davis , John Burns , Kannan Raj , Phil McClay , Wuchun Chou , Jonathan McFarland
IPC分类号： G02B6/36 , B29D11/00
CPC分类号： G02B6/4231 , G02B6/3817 , G02B6/4201 , G02B6/4212 , G02B6/4249 , G02B6/4284 , G02B6/4292
摘要： A device for forming an optical connection between an optoelectronic device and an optical fiber and for forming an electrical connection between the optoelectronic device and a substrate, a system including the device and materials, and methods of forming the device and system are disclosed. The device for forming an optical connection includes a—light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes guide grooves configured to receive guide pins from a fiber ribbon connector, such that when the fiber ribbon connector is attached to the device, fibers of the ribbon align with the optoelectronic device via the light transmission medium.

3. 发明申请

US20070053637A1 APPARATUS FOR COUPLING A FIBER OPTIC CABLE TO AN OPTOELECTRONIC DEVICE, A SYSTEM INCLUDING THE APPARATUS, AND A METHOD OF FORMING THE SAME 有权
标题翻译：用于将光纤电缆连接到光电装置的装置，包括装置的系统及其形成方法
公开(公告)号：US20070053637A1
公开(公告)日：2007-03-08
申请号：US11461656
申请日：2006-08-01
申请人： Suresh Golwalkar , Noah Davis , John Burns , Kannan Raj , Phil McClay , Wuchun Chou , Jonathan McFarland
发明人： Suresh Golwalkar , Noah Davis , John Burns , Kannan Raj , Phil McClay , Wuchun Chou , Jonathan McFarland
IPC分类号： G02B6/36
CPC分类号： G02B6/4231 , G02B6/3817 , G02B6/4201 , G02B6/4212 , G02B6/4249 , G02B6/4284 , G02B6/4292
摘要： A device for forming an optical connection between an optoelectronic device and an optical fiber and for forming an electrical connection between the optoelectronic device and a substrate, a system including the device and materials, and methods of forming the device and system are disclosed. The device for forming an optical connection includes a—light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes guide grooves configured to receive guide pins from a fiber ribbon connector, such that when the fiber ribbon connector is attached to the device, fibers of the ribbon align with the optoclectronic device via the light transmission medium.
摘要翻译：公开了一种用于在光电子器件和光纤之间形成光连接并用于形成光电器件与衬底之间的电连接的装置，包括该器件和材料的系统以及形成器件和系统的方法。用于形成光学连接的装置包括至少部分封装的光传输介质和电连接器。另外，该装置包括构造成从光纤带连接器接收引导销的引导槽，使得当光纤带连接器附接到该装置时，带的光纤经由光传输介质与光电装置对准。

4. 发明授权

US06786651B2 Optical interconnect structure, system and transceiver including the structure, and method of forming the same 有权
标题翻译：光互连结构，系统和收发器包括结构及其形成方法
公开(公告)号：US06786651B2
公开(公告)日：2004-09-07
申请号：US10104942
申请日：2002-03-22
申请人： Kannan Raj , Wuchun Chou , C. Phillip McClay , Robert Carroll , Suresh Golwalkar , Noah Davis , John Burns
发明人： Kannan Raj , Wuchun Chou , C. Phillip McClay , Robert Carroll , Suresh Golwalkar , Noah Davis , John Burns
IPC分类号： G02B636
CPC分类号： G02B6/43 , G02B6/4214 , G02B6/424 , G02B6/4245 , G02B6/4246 , G02B6/4257 , G02B6/4269 , G02B6/4274
摘要： A system for coupling optoelectronic devices, associated electrical components, and optical fibers is described. The system includes a substrate to which optoelectronic devices and at least some of the associated electronic components are formed on or formed using the substrate material. The substrate is further configured to receive and attach to one or more optical fibers. The system can be used to form transceivers for multiplexing and/or demultiplexing electronic information.
摘要翻译：描述了用于耦合光电子器件，相关电子部件和光纤的系统。该系统包括基板，光电子器件和至少一些相关联的电子元件在基底上形成，或者使用基板材料形成。衬底还被配置为接收并附接到一个或多个光纤。该系统可用于形成用于复用和/或解复用电子信息的收发器。

5. 发明授权

US07340120B2 Optical and electrical interconnect 有权
标题翻译：光电互连
公开(公告)号：US07340120B2
公开(公告)日：2008-03-04
申请号：US11020985
申请日：2004-12-22
申请人： Jonathan McFarland , Kannan Raj
发明人： Jonathan McFarland , Kannan Raj
IPC分类号： G02B6/12
CPC分类号： G02B6/125 , G02B2006/12069
摘要： A method of fabricating an interconnect includes forming one or more holes in an anisotropic conductive film on a carrier substrate, filling at least one of the one or more holes with a material capable of transmitting an optical signal, and laminating the anisotropic conductive film on a packaging substrate. An electronic package includes a first substrate, a second substrate, and an interconnect located between the first substrate and the second substrate. The interconnect includes a conductive film for electrically coupling a first terminal formed on the first substrate to a second terminal formed on the second substrate, and one or more optically transmissive units embedded in the conductive film, wherein at least one of the one or more optically transmissive units provides an optical signal path between an optical element on the first substrate and an optical element on the second substrate.
摘要翻译：制造互连的方法包括在载体基板上的各向异性导电膜中形成一个或多个孔，用能够传输光信号的材料填充一个或多个孔中的至少一个孔，并将各向异性导电膜层压在包装基材。电子封装包括第一衬底，第二衬底和位于第一衬底和第二衬底之间的互连。互连包括用于将形成在第一衬底上的第一端子与形成在第二衬底上的第二端子电耦合的导电膜和嵌入导电膜中的一个或多个光学透射单元，其中一个或多个光学透射单元在第一基板上的光学元件和第二基板上的光学元件之间提供光信号路径。

6. 发明申请

US20050104178A1 Optical and electrical interconnect 有权
标题翻译：光电互连
公开(公告)号：US20050104178A1
公开(公告)日：2005-05-19
申请号：US11020985
申请日：2004-12-22
申请人： Jonathan McFarland , Kannan Raj
发明人： Jonathan McFarland , Kannan Raj
IPC分类号： G02B6/12 , G02B6/125 , H01L21/44 , H01L21/4763 , H01L23/02 , H01L29/40
CPC分类号： G02B6/125 , G02B2006/12069
摘要： A method of fabricating an interconnect includes forming one or more holes in an anisotropic conductive film on a carrier substrate, filling at least one of the one or more holes with a material capable of transmitting an optical signal, and laminating the anisotropic conductive film on a packaging substrate. An electronic package includes a first substrate, a second substrate, and an interconnect located between the first substrate and the second substrate. The interconnect includes a conductive film for electrically coupling a first terminal formed on the first substrate to a second terminal formed on the second substrate, and one or more optically transmissive units embedded in the conductive film, wherein at least one of the one or more optically transmissive units provides an optical signal path between an optical element on the first substrate and an optical element on the second substrate.
摘要翻译：制造互连的方法包括在载体基板上的各向异性导电膜中形成一个或多个孔，用能够传输光信号的材料填充一个或多个孔中的至少一个孔，并将各向异性导电膜层压在包装基材。电子封装包括第一衬底，第二衬底和位于第一衬底和第二衬底之间的互连。互连包括用于将形成在第一衬底上的第一端子与形成在第二衬底上的第二端子电耦合的导电膜和嵌入导电膜中的一个或多个光学透射单元，其中一个或多个光学透射单元在第一基板上的光学元件和第二基板上的光学元件之间提供光信号路径。

7. 发明授权

US06847747B2 Optical and electrical interconnect 有权
标题翻译：光电互连
公开(公告)号：US06847747B2
公开(公告)日：2005-01-25
申请号：US09846032
申请日：2001-04-30
申请人： Jonathan McFarland , Kannan Raj
发明人： Jonathan McFarland , Kannan Raj
IPC分类号： G02B6/12 , G02B6/125
CPC分类号： G02B6/125 , G02B2006/12069
摘要： An interconnect comprising an anisotropic conductive film and an optically transmissive unit embedded in the anisotropic conductive film. The optically transmissive unit provides an optically transmissive path through the anisotropic conductive film. In an alternative embodiment, an electronic package comprises a first substrate, a second substrate, and an interconnect located between the first substrate and the second substrate. The interconnect comprises an anisotropic conductive film for electrically coupling a first conductive element formed on the first substrate to a second conductive element formed on the second substrate and one or more optically transmissive units embedded in the anisotropic conductive film. At least one of the one or more optically transmissive units couples an optical signal path on the first substrate to an optical receiver on the second substrate.
摘要翻译：包括各向异性导电膜和嵌入各向异性导电膜中的光学透射单元的互连。光学透射单元提供穿过各向异性导电膜的光学透射路径。在替代实施例中，电子封装包括第一衬底，第二衬底和位于第一衬底和第二衬底之间的互连。互连包括用于将形成在第一衬底上的第一导电元件电耦合到形成在第二衬底上的第二导电元件和嵌入各向异性导电膜中的一个或多个光学透射单元的各向异性导电膜。一个或多个光学透射单元中的至少一个将第一基板上的光信号路径耦合到第二基板上的光接收器。

8. 发明授权

US08873961B2 Echelle grating with cyclic free-spectral range 有权
标题翻译：具有循环自由光谱范围的Echelle光栅
公开(公告)号：US08873961B2
公开(公告)日：2014-10-28
申请号：US13205879
申请日：2011-08-09
申请人： Ying Luo , Xuezhe Zheng , Guoliang Li , Kannan Raj , Ashok V. Krishnamoorthy
发明人： Ying Luo , Xuezhe Zheng , Guoliang Li , Kannan Raj , Ashok V. Krishnamoorthy
IPC分类号： H04J14/02 , G02B6/293
CPC分类号： H04J14/02 , G02B6/29308 , G02B6/2931
摘要： An optical de-multiplexer (de-MUX) that includes an optical device that images and diffracts an optical signal using a reflective geometry is described, where a free spectral range (FSR) of the optical device associated with a given diffraction order abuts FSRs associated with adjacent diffraction orders. Moreover, the channel spacings within diffraction orders and between adjacent diffraction orders are equal to the predefined channel spacing associated with the optical signal. As a consequence, the optical device has a comb-filter output spectrum, which reduces a tuning energy of the optical device by eliminating spectral gaps between diffraction orders of the optical device.
摘要翻译：描述了包括使用反射几何形状对光信号进行成像和衍射的光学装置的光学去多路复用器（de-MUX），其中与给定衍射级相关联的光学装置的自由光谱范围（FSR）与相关联的FSR相邻具有相邻衍射级。此外，衍射级之间和相邻衍射级之间的沟道间隔等于与光信号相关联的预定的沟道间隔。因此，光学器件具有梳状滤波器输出光谱，其通过消除光学器件的衍射级之间的光谱间隙来减少光学器件的调谐能量。

9. 发明授权

US08548287B2 Direct interlayer optical coupler 有权
标题翻译：直接层间光耦合器
公开(公告)号：US08548287B2
公开(公告)日：2013-10-01
申请号：US13293624
申请日：2011-11-10
申请人： Hiren D. Thacker , Xuezhe Zheng , Ivan Shubin , Kannan Raj , John E. Cunningham , Ashok V. Krishnamoorthy
发明人： Hiren D. Thacker , Xuezhe Zheng , Ivan Shubin , Kannan Raj , John E. Cunningham , Ashok V. Krishnamoorthy
IPC分类号： G02B6/12
CPC分类号： G02B6/26 , Y10T29/49826
摘要： In an MCM, an optical signal is conveyed by an optical waveguide disposed on a surface of a first substrate to an optical coupler having a vertical facet. This optical coupler has an optical mode that is different than the optical mode of the optical waveguide. For example, the spatial extent of the optical mode associated with the optical coupler may be larger, thereby reducing optical losses and sensitivity to alignment errors. Then, the optical signal is directly coupled from the vertical facet to a facing vertical facet of an identical optical coupler on another substrate, and the optical signal is conveyed in another optical waveguide disposed on the other substrate.
摘要翻译：在MCM中，光信号由设置在第一基板的表面上的光波导传送到具有垂直面的光耦合器。该光耦合器具有与光波导的光学模式不同的光学模式。例如，与光耦合器相关联的光学模式的空间范围可能更大，从而减少光学损耗和对准误差的灵敏度。然后，光信号从另一基板上的垂直面到同一光耦合器的面向垂直面直接耦合，并且光信号在设置在另一基板上的另一光波导中传送。

10. 发明申请

US20130230272A1 CHIP ASSEMBLY CONFIGURATION WITH DENSELY PACKED OPTICAL INTERCONNECTS 审中-公开
标题翻译：芯片组件配置与密封包装光学互连
公开(公告)号：US20130230272A1
公开(公告)日：2013-09-05
申请号：US13410113
申请日：2012-03-01
申请人： Kannan Raj , Dawei Huang , Nicholas E. Aneshansley , Theresa Sze , David K. McElfresh
发明人： Kannan Raj , Dawei Huang , Nicholas E. Aneshansley , Theresa Sze , David K. McElfresh
IPC分类号： G02B6/12
CPC分类号： G02B6/428 , G02B6/4246 , G02B6/4269 , G02B6/4274
摘要： A chip assembly configuration includes an substrate with an integrated circuit on one side and a conversion mechanism on the other side. The integrated circuit and the conversion mechanism are electrically coupled by a short electrical transmission line through the substrate. Moreover, the conversion mechanism converts signals between an electrical and an optical domain, thereby allowing high-speed communication between the integrated circuit and other components and devices using optical communication (for example, in an optical fiber or an optical waveguide).
摘要翻译：芯片组装配置包括在一侧具有集成电路的基板和另一侧上的转换机构。集成电路和转换机构通过穿过衬底的短电传输线电耦合。此外，转换机构在电区域和光学域之间转换信号，从而允许集成电路与使用光通信的其他部件和设备（例如，在光纤或光波导中）之间的高速通信。

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