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1. 发明授权

US06619858B1 Optical interconnect 有权
标题翻译：光互连
公开(公告)号：US06619858B1
公开(公告)日：2003-09-16
申请号：US09575418
申请日：2000-05-20
申请人： Rick Lytel , Howard Davidson , Theresa Sze , Nyles Nettleton , Dawei Huang
发明人： Rick Lytel , Howard Davidson , Theresa Sze , Nyles Nettleton , Dawei Huang
IPC分类号： G02B636
CPC分类号： G02B6/43 , G02B6/4249
摘要： An optical interconnect is provided that optically connects two adjacent printed circuit boards, or electrical component. The optical interconnect includes a floating frame which is flexibly connected to one electrical component. The floating frame includes a plurality of optical guides. The optical guides are connected to the electrical component either electronically or optically. A second frame, coupled to a second electrical component also contains a plurality of optical guides. A mechanical guide assembly positions the first frame and the second frame are optically coupled. The optical guide in the second frame connects to the second electrical component providing a path for a signal from the first electrical component to the second electrical component.
摘要翻译：提供光学互连以光学连接两个相邻的印刷电路板或电气部件。光学互连包括浮动框架，该浮动框架柔性地连接到一个电气部件。浮动框架包括多个光导件。光导件以电子方式或光学方式连接到电气部件。耦合到第二电气部件的第二框架还包含多个光导件。机械引导组件定位第一框架并且第二框架被光耦合。第二框架中的光导件连接到第二电气部件，从而提供用于从第一电气部件到第二电气部件的信号的路径。

2. 发明申请

US20130230272A1 CHIP ASSEMBLY CONFIGURATION WITH DENSELY PACKED OPTICAL INTERCONNECTS 审中-公开
标题翻译：芯片组件配置与密封包装光学互连
公开(公告)号：US20130230272A1
公开(公告)日：2013-09-05
申请号：US13410113
申请日：2012-03-01
申请人： Kannan Raj , Dawei Huang , Nicholas E. Aneshansley , Theresa Sze , David K. McElfresh
发明人： Kannan Raj , Dawei Huang , Nicholas E. Aneshansley , Theresa Sze , David K. McElfresh
IPC分类号： G02B6/12
CPC分类号： G02B6/428 , G02B6/4246 , G02B6/4269 , G02B6/4274
摘要： A chip assembly configuration includes an substrate with an integrated circuit on one side and a conversion mechanism on the other side. The integrated circuit and the conversion mechanism are electrically coupled by a short electrical transmission line through the substrate. Moreover, the conversion mechanism converts signals between an electrical and an optical domain, thereby allowing high-speed communication between the integrated circuit and other components and devices using optical communication (for example, in an optical fiber or an optical waveguide).
摘要翻译：芯片组装配置包括在一侧具有集成电路的基板和另一侧上的转换机构。集成电路和转换机构通过穿过衬底的短电传输线电耦合。此外，转换机构在电区域和光学域之间转换信号，从而允许集成电路与使用光通信的其他部件和设备（例如，在光纤或光波导中）之间的高速通信。

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