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    • 1. 发明申请
    • NONVOLATILE MEMORY DEVICE FOR REDUCING INTERFERENCE BETWEEN WORD LINES AND OPERATION METHOD THEREOF
    • 用于减少字线之间的干扰的非易失性存储器件及其操作方法
    • US20110222339A1
    • 2011-09-15
    • US13044683
    • 2011-03-10
    • Sung-Hoon KimJai-Hyuk SongYong-Joon Choi
    • Sung-Hoon KimJai-Hyuk SongYong-Joon Choi
    • G11C16/28G11C16/10G11C16/08
    • G11C16/3418G11C16/10G11C16/28
    • Provided are a nonvolatile memory device and a method of operating the same. The nonvolatile memory device in accordance with an embodiment of the inventive concept may include a string select line; a ground select line; a dummy word line adjacent to the ground select line; a first word line adjacent to the dummy word line; and a second word line disposed between the string select line and the first word line. The nonvolatile memory device is configured to apply a voltage to the dummy word line. When programming a memory cell connected to the first word line, a first dummy word line voltage lower than a voltage applied to the second word line is applied to the dummy word line. When programming a memory cell connected to the second word line, a second dummy word line voltage between a voltage applied to the first word line and the first dummy word line voltage is applied to the dummy word line. Accordingly, when a program operation is performed, a charge loss of a memory cell connected to a word line adjacent to a dummy word line can be reduced by changing a voltage applied to the dummy word line according to a select word line.
    • 提供一种非易失性存储器件及其操作方法。 根据本发明构思的实施例的非易失性存储器件可以包括串选择线; 地选线; 与地面选择线相邻的虚拟字线; 与虚拟字线相邻的第一字线; 以及设置在所述串选择线和所述第一字线之间的第二字线。 非易失性存储器件被配置为向虚拟字线施加电压。 当编程连接到第一字线的存储单元时,低于施加到第二字线的电压的第一虚拟字线电压被施加到虚拟字线。 当编程连接到第二字线的存储单元时,施加到第一字线的电压和第一虚拟字线电压之间的第二虚拟字线电压被施加到伪字线。 因此,当执行编程操作时,可以通过根据选择字线改变施加到虚拟字线的电压来减少连接到与虚拟字线相邻的字线的存储单元的电荷损失。
    • 2. 发明授权
    • Nonvolatile memory device for reducing interference between word lines and operation method thereof
    • 用于减少字线之间的干扰的非易失性存储器件及其操作方法
    • US08488386B2
    • 2013-07-16
    • US13044683
    • 2011-03-10
    • Sung-Hoon KimJai-Hyuk SongYong-Joon Choi
    • Sung-Hoon KimJai-Hyuk SongYong-Joon Choi
    • G11C11/34
    • G11C16/3418G11C16/10G11C16/28
    • Provided are a nonvolatile memory device and a method of operating the same. The nonvolatile memory device in accordance with an embodiment of the inventive concept may include a string select line; a ground select line; a dummy word line adjacent to the ground select line; a first word line adjacent to the dummy word line; and a second word line disposed between the string select line and the first word line. The nonvolatile memory device is configured to apply a voltage to the dummy word line. When programming a memory cell connected to the first word line, a first dummy word line voltage lower than a voltage applied to the second word line is applied to the dummy word line. When programming a memory cell connected to the second word line, a second dummy word line voltage between a voltage applied to the first word line and the first dummy word line voltage is applied to the dummy word line. Accordingly, when a program operation is performed, a charge loss of a memory cell connected to a word line adjacent to a dummy word line can be reduced by changing a voltage applied to the dummy word line according to a select word line.
    • 提供一种非易失性存储器件及其操作方法。 根据本发明构思的实施例的非易失性存储器件可以包括串选择线; 地选线; 与地面选择线相邻的虚拟字线; 与虚拟字线相邻的第一字线; 以及设置在所述串选择线和所述第一字线之间的第二字线。 非易失性存储器件被配置为向虚拟字线施加电压。 当编程连接到第一字线的存储单元时,低于施加到第二字线的电压的第一虚拟字线电压被施加到虚拟字线。 当编程连接到第二字线的存储单元时,施加到第一字线的电压和第一虚拟字线电压之间的第二虚拟字线电压被施加到伪字线。 因此,当执行编程操作时,可以通过根据选择字线改变施加到虚拟字线的电压来减少连接到与虚拟字线相邻的字线的存储单元的电荷损失。
    • 6. 发明申请
    • Method of manufacturing a non-volatile semiconductor device
    • 制造非易失性半导体器件的方法
    • US20090035906A1
    • 2009-02-05
    • US12222074
    • 2008-08-01
    • Choong-Ho LeeJai-Hyuk SongDong-Uk ChoiSuk-Kang Sung
    • Choong-Ho LeeJai-Hyuk SongDong-Uk ChoiSuk-Kang Sung
    • H01L21/336
    • H01L21/324H01L27/115H01L27/11521H01L27/11524H01L27/11568
    • Example embodiments relate to methods of fabricating a non-volatile memory device. According to example embodiments, a method of fabricating a non-volatile memory device may include forming at least one gate structure on an upper face of a substrate. The at least one gate structure may include a tunnel insulation layer pattern, a charge storing layer pattern, a dielectric layer pattern and a control gate. According to example embodiments, a method of fabricating a non-volatile memory device may also include forming a silicon nitride layer on the upper face of the substrate to cover the at least one gate structure, forming an insulating interlayer on the silicon nitride layer on the upper face of the substrate, and providing an annealing gas toward the upper face of the substrate and a lower face of the substrate to cure defects of the tunnel insulation layer pattern.
    • 示例实施例涉及制造非易失性存储器件的方法。 根据示例性实施例,制造非易失性存储器件的方法可以包括在衬底的上表面上形成至少一个栅极结构。 至少一个栅极结构可以包括隧道绝缘层图案,电荷存储层图案,电介质层图案和控制栅极。 根据示例实施例,制造非易失性存储器件的方法还可以包括在衬底的上表面上形成氮化硅层以覆盖至少一个栅极结构,在氮化硅层上形成绝缘中间层 并且朝向基板的上表面和基板的下表面提供退火气体,以固化隧道绝缘层图案的缺陷。
    • 10. 发明授权
    • Method of fabricating DRAM device
    • 制造DRAM器件的方法
    • US6156605A
    • 2000-12-05
    • US370936
    • 1999-08-09
    • Jai-Hyuk Song
    • Jai-Hyuk Song
    • H01L21/8234H01L27/108H01L21/8242
    • H01L21/823493H01L21/823456H01L27/10897
    • A DRAM device having a triple well structure and a manufacturing method of the device are disclosed. The DRAM device includes first and second well regions of a first conductivity type formed in a semiconductor substrate of the first conductivity type. The first and second well regions are spaced apart from each other. The DRAM device also includes a third well region of a second conductivity type formed in the semiconductor substrate to encapsulate one of the first and second well regions for electrically isolating the encapsulated region from the semiconductor substrate. At least one first MOS transistor and at least one memory cell are formed in one of the first and second well regions. At least one second MOS transistor is formed in the other of the first and second well regions. In the present invention, one of the first and second MOS transistors has a gate length less than the gate length of the other.
    • 公开了具有三重阱结构的DRAM器件和该器件的制造方法。 DRAM器件包括形成在第一导电类型的半导体衬底中的第一导电类型的第一阱区和第二阱区。 第一和第二阱区彼此间隔开。 DRAM器件还包括形成在半导体衬底中的第二导电类型的第三阱区,以封装第一和第二阱区中的一个,用于将封装区域与半导体衬底电隔离。 至少一个第一MOS晶体管和至少一个存储单元形成在第一和第二阱区域之一中。 在第一和第二阱区域中的另一个中形成至少一个第二MOS晶体管。 在本发明中,第一和第二MOS晶体管之一的栅极长度小于另一个的栅极长度。