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1. 发明授权

US08445314B2 Method of creating reusable template for detachable thin film substrate 有权
标题翻译：为可拆卸薄膜基板制作可重复使用的模板的方法
公开(公告)号：US08445314B2
公开(公告)日：2013-05-21
申请号：US12786262
申请日：2010-05-24
申请人： Suketu Parikh , David Dutton , Pawan Kapur , Somnath Nag , Mehrdad Moslehi , Joe Kramer , Nevran Ozguven , Asli Buccu Ucok
发明人： Suketu Parikh , David Dutton , Pawan Kapur , Somnath Nag , Mehrdad Moslehi , Joe Kramer , Nevran Ozguven , Asli Buccu Ucok
IPC分类号： H01L21/00
CPC分类号： H01L29/0692 , H01L21/02381 , H01L21/0243 , H01L21/0245 , H01L21/02513 , H01L21/02532 , H01L21/02664 , H01L31/0236 , H01L31/02363 , H01L31/1804 , Y02E10/547 , Y02P70/521 , Y10T29/53265
摘要： A structure and method operable to create a reusable template for detachable thin semiconductor substrates is provided. The template has a shape such that the 3-D shape is substantially retained after each substrate release. Prior art reusable templates may have a tendency to change shape after each subsequent reuse; the present disclosure aims to address this and other deficiencies from the prior art, therefore increasing the reuse life of the template.
摘要翻译：提供了一种用于为可分离的薄半导体衬底创建可重用模板的结构和方法。模板具有使得在每个基底释放之后基本保持3-D形状的形状。现有技术的可再利用模板可能在每次后续重用之后具有改变形状的趋势; 本公开旨在解决现有技术的这种和其他缺陷，因此增加了模板的重用寿命。

2. 发明申请

US20110014742A1 METHOD OF CREATING REUSABLE TEMPLATE FOR DETACHABLE THIN FILM SUBSTRATE 有权
标题翻译：创建可拆卸薄膜基板的可重复模板的方法
公开(公告)号：US20110014742A1
公开(公告)日：2011-01-20
申请号：US12786262
申请日：2010-05-24
申请人： Suketu Parikh , David Dutton , Pawan Kapur , Somnath Nag , Mehrdad Moslehi , Joe Kramer , Nevran Ozguven , Asli Buccu Ucok
发明人： Suketu Parikh , David Dutton , Pawan Kapur , Somnath Nag , Mehrdad Moslehi , Joe Kramer , Nevran Ozguven , Asli Buccu Ucok
IPC分类号： H01L31/18 , H01L31/0368
CPC分类号： H01L29/0692 , H01L21/02381 , H01L21/0243 , H01L21/0245 , H01L21/02513 , H01L21/02532 , H01L21/02664 , H01L31/0236 , H01L31/02363 , H01L31/1804 , Y02E10/547 , Y02P70/521 , Y10T29/53265
摘要： A structure and method operable to create a reusable template for detachable thin semiconductor substrates is provided. The template has a shape such that the 3-D shape is substantially retained after each substrate release. Prior art reusable templates may have a tendency to change shape after each subsequent reuse; the present disclosure aims to address this and other deficiencies from the prior art, therefore increasing the reuse life of the template.
摘要翻译：提供了一种用于为可分离的薄半导体衬底创建可重用模板的结构和方法。模板具有使得在每个基底释放之后基本保持3-D形状的形状。现有技术的可再利用模板可能在每次后续重用之后具有改变形状的趋势; 本公开旨在解决现有技术的这种和其他缺陷，因此增加了模板的重用寿命。

3. 发明授权

US09099584B2 Integrated three-dimensional and planar metallization structure for thin film solar cells 有权
标题翻译：用于薄膜太阳能电池的集成三维和平面金属化结构
公开(公告)号：US09099584B2
公开(公告)日：2015-08-04
申请号：US12767512
申请日：2010-04-26
申请人： Suketu Parikh , Nevran Ozguven , Duncan Harwood , Mehrdad M. Moslehi
发明人： Suketu Parikh , Nevran Ozguven , Duncan Harwood , Mehrdad M. Moslehi
IPC分类号： H01L31/00 , H01L31/0352 , H01L31/0224 , H01L31/0236 , H01L31/028 , H01L31/0392 , H01L31/18
CPC分类号： H01L31/035281 , H01L31/022433 , H01L31/0236 , H01L31/02363 , H01L31/028 , H01L31/0392 , H01L31/03925 , H01L31/03928 , H01L31/1804 , Y02E10/541 , Y02E10/547 , Y02P70/521
摘要： A three-dimensional structure having a mixture of inverted pyramidal cavities and substantially flat areas defines the frontside and backside of a substrate. The substantially flat areas have ridges forming base openings of the inverted pyramidal cavities and planar linear regions across the substrate. Pyramidal sidewalls define the pyramidal cavities from the ridges to pyramidal apices. Metallization contacts emitter regions on the frontside of the substantially flat areas.
摘要翻译：具有倒锥体腔和基本平坦区域的混合物的三维结构限定了衬底的前侧和后侧。基本上平坦的区域具有形成倒锥体腔的基部开口和横穿衬底的平面线性区域的脊。金字塔形的侧壁限定从脊到金字塔形顶点的金字塔形腔。金属化接触基本上平坦区域的前侧的发射极区域。

4. 发明申请

US20100294356A1 INTEGRATED 3-DIMENSIONAL AND PLANAR METALLIZATION STRUCTURE FOR THIN FILM SOLAR CELLS 有权
标题翻译：用于薄膜太阳能电池的集成三维和平面金属化结构
公开(公告)号：US20100294356A1
公开(公告)日：2010-11-25
申请号：US12767512
申请日：2010-04-26
申请人： Suketu Parikh , Nevran Ozguven , Duncan Harwood , Mehrdad M. Moslehi
发明人： Suketu Parikh , Nevran Ozguven , Duncan Harwood , Mehrdad M. Moslehi
IPC分类号： H01L31/0216 , H01L31/18
CPC分类号： H01L31/035281 , H01L31/022433 , H01L31/0236 , H01L31/02363 , H01L31/028 , H01L31/0392 , H01L31/03925 , H01L31/03928 , H01L31/1804 , Y02E10/541 , Y02E10/547 , Y02P70/521
摘要： A method operable to produce integrated 3-dimension and planar metallization structure for thin film solar cells is provided. This method involves depositing a thin film on a template mask, the template mask having both substantially flat and textured areas. The thin film is then released from the template mask. Emitters are formed on the thin film. Finally, metallization of the substantially flat areas takes place.
摘要翻译：提供了一种用于制造用于薄膜太阳能电池的集成的三维和平面金属化结构的方法。该方法包括在模板掩模上沉积薄膜，模板掩模具有基本上平坦和有纹理的区域。然后从模板掩模中释放薄膜。发射体形成在薄膜上。最后，发生基本平坦的区域的金属化。

5. 发明申请

US20100304521A1 Shadow Mask Methods For Manufacturing Three-Dimensional Thin-Film Solar Cells 审中-公开
标题翻译：用于制造三维薄膜太阳能电池的阴影掩模方法
公开(公告)号：US20100304521A1
公开(公告)日：2010-12-02
申请号：US12767791
申请日：2010-04-26
申请人： Sean Michael Seutter , Suketu Parikh , Somnath Nag , Mehrdad M. Moslehi
发明人： Sean Michael Seutter , Suketu Parikh , Somnath Nag , Mehrdad M. Moslehi
IPC分类号： H01L31/18
CPC分类号： H01L31/18 , H01L31/02363 , H01L31/02366 , H01L31/03529 , H01L31/046 , H01L31/0463 , H01L31/0465 , H01L31/056 , H01L31/068 , H01L31/182 , H01L31/1896 , Y02E10/52 , Y02E10/546 , Y02E10/547 , Y02P70/521
摘要： Methods for manufacturing three-dimensional thin-film solar cells using a template. The template comprises a template substrate comprising a plurality of three-dimensional surface features. The three-dimensional thin-film solar cell substrate is formed by forming a sacrificial layer on the template, subsequently depositing a semiconductor layer, selectively etching the sacrificial layer, and releasing the semiconductor layer from the template. Select portions of the three-dimensional thin-film solar cell substrate are then doped with a first dopant, while other select portions are doped with a second dopant. Next, selective emitter and base metallization regions are formed using a PECVD shadow mask process.
摘要翻译：使用模板制造三维薄膜太阳能电池的方法。模板包括包含多个三维表面特征的模板衬底。通过在模板上形成牺牲层，然后沉积半导体层，选择性地蚀刻牺牲层，以及从模板中释放半导体层，形成三维薄膜太阳能电池基板。然后，三维薄膜太阳能电池基板的选择部分掺杂有第一掺杂剂，而其它选择部分掺杂有第二掺杂剂。接下来，使用PECVD阴影掩模处理形成选择性发射极和基极金属化区域。

6. 发明授权

US08828517B2 Structure and method for improving solar cell efficiency and mechanical strength 有权
标题翻译：提高太阳能电池效率和机械强度的结构和方法
公开(公告)号：US08828517B2
公开(公告)日：2014-09-09
申请号：US12728772
申请日：2010-03-22
申请人： David Xuan-Qi Wang , Mehrdad M. Moslehi , Pawan Kapur , Suketu Parikh
发明人： David Xuan-Qi Wang , Mehrdad M. Moslehi , Pawan Kapur , Suketu Parikh
IPC分类号： H01L27/14 , B32B33/00 , B32B3/12
CPC分类号： H01L31/02366 , H01J37/32651 , H01J2237/3346 , H01L31/02327 , H01L31/028 , H01L31/035281 , H01L31/03921 , H01L31/046 , H01L31/054 , H01L31/1804 , Y02E10/52 , Y02E10/547 , Y02P70/521 , Y10T428/24149
摘要： A three-dimensional thin film solar cell (3-D TFSC) substrate having enhanced mechanical strength, light trapping, and metal modulation coverage properties. The substrate includes a plurality of unit cells, which may or may not be different. Unit cells are defined as a small self-contained geometrical pattern which may be repeated. Each unit cell structure includes a wall enclosing a trench. Further, the unit cell includes an aperture having an aperture diameter. A pre-determined variation in wall thickness, wall height, and aperture diameter among unit cells across the substrate produces specific advantages.
摘要翻译：具有增强的机械强度，光捕获和金属调制覆盖性能的三维薄膜太阳能电池（3-D TFSC）基板。衬底包括多个单元电池，其可以是或可以不是不同的。单元单元被定义为可以重复的小的独立几何图案。每个单电池结构都包括一个包围沟槽的墙壁。此外，单元电池包括具有孔径的孔。在基板之间的单元电池中的壁厚，壁高度和孔径的预定变化产生了特定的优点。

7. 发明申请

US20100294333A1 STRUCTURE AND METHOD FOR IMPROVING SOLAR CELL EFFICIENCY AND MECHANICAL STRENGTH 有权
标题翻译：改善太阳能电池效率和机械强度的结构和方法
公开(公告)号：US20100294333A1
公开(公告)日：2010-11-25
申请号：US12728772
申请日：2010-03-22
申请人： David Xuan-Qi Wang , Mehrdad M. Moslehi , Pawan Kapur , Suketu Parikh
发明人： David Xuan-Qi Wang , Mehrdad M. Moslehi , Pawan Kapur , Suketu Parikh
IPC分类号： H01L31/042 , H01L31/18
CPC分类号： H01L31/02366 , H01J37/32651 , H01J2237/3346 , H01L31/02327 , H01L31/028 , H01L31/035281 , H01L31/03921 , H01L31/046 , H01L31/054 , H01L31/1804 , Y02E10/52 , Y02E10/547 , Y02P70/521 , Y10T428/24149
摘要： The present disclosure presents a three-dimensional thin film solar cell (3-D TFSC) substrate having enhanced mechanical strength, light trapping, and metal modulation coverage properties. The substrate includes a plurality of unit cells, which may or may not be different. Unit cells are defined as a small self-contained geometrical pattern which may be repeated. Each unit cell structure includes a wall enclosing a trench. Further, the unit cell includes an aperture having an aperture diameter. For the purposes of the present disclosure, the dimensions of interest include wall thickness, wall height, and aperture diameter. A pre-determined variation in these dimensions among unit cells across the substrate produces specific advantages.
摘要翻译：本公开内容提供了具有增强的机械强度，光捕获和金属调制覆盖性能的三维薄膜太阳能电池（3-D TFSC）基板。衬底包括多个单元电池，其可以是或可以不是不同的。单元单元被定义为可以重复的小的独立几何图案。每个单电池结构都包括一个包围沟槽的墙壁。此外，单元电池包括具有孔径的孔。为了本公开的目的，感兴趣的尺寸包括壁厚度，壁高度和孔直径。在衬底之间的单元电池中这些尺寸的预定变化产生了特定的优点。

8. 发明申请

US20090154215A1 REDUCING NOISE AND DISTURBANCE BETWEEN MEMORY STORAGE ELEMENTS USING ANGLED WORDLINES 审中-公开
标题翻译：使用ANGLED WORDLINES减少存储元素之间的噪音和干扰
公开(公告)号：US20090154215A1
公开(公告)日：2009-06-18
申请号：US11957028
申请日：2007-12-14
申请人： Suketu Parikh , Vidyut Gopal , Brad Davis
发明人： Suketu Parikh , Vidyut Gopal , Brad Davis
IPC分类号： G11C5/06 , G11C5/02
CPC分类号： G11C8/08 , G11C5/063
摘要： Devices and/or methods that facilitate reducing cross-talk noise and/or complementary bit disturb between adjacent storage elements in a memory device are presented. A memory device includes a memory array with wordlines formed in a zig-zag pattern such that each wordline can have segments that are parallel to the x-axis and other segments that are angled from a direction parallel to the x-axis based in part on a predetermined angle. Adjacent storage elements can be positioned at respective ends of an angled segment of a wordline to facilitate increasing the distance between such storage elements, as compared to the distance between storage elements associated with an orthogonal memory array, where the increase in distance can be based in part on the predetermined angle. The size of the memory array can be the same or substantially the same size, as compared to an orthogonal memory array.
摘要翻译：提出了有助于减少存储器件中的相邻存储元件之间的串扰噪声和/或互补位干扰的装置和/或方法。存储器件包括具有以Z字形图案形成的字线的存储器阵列，使得每个字线可以具有平行于x轴的部分和从平行于x轴的方向成角度的部分，部分地基于预定角度。与相对于正交存储器阵列相关的存储元件之间的距离相比，可以将相邻的存储元件定位在字线的成角度段的相应端部，以便于增加这些存储元件之间的距离，其中距离的增加可以基于部分在预定角度。与正交存储器阵列相比，存储器阵列的大小可以是相同或基本上相同的大小。

9. 发明授权

US07074626B2 Method and apparatus for providing intra-tool monitoring and control 有权
公开(公告)号：US07074626B2
公开(公告)日：2006-07-11
申请号：US10804324
申请日：2004-03-19
申请人： Suketu Parikh , Robin Cheung
发明人： Suketu Parikh , Robin Cheung
IPC分类号： H01L21/00 , H01L21/66
CPC分类号： H01L22/20 , G05B19/4187 , G05B19/41875 , G05B2219/32179 , G05B2219/32182 , G05B2219/45031 , Y02P90/14 , Y02P90/205 , Y02P90/22
摘要： A method and apparatus for performing intra-tool monitoring and control within a multi-step processing system. The method monitors the processing of a workpiece as the workpiece is processed by independently operating processing tools and produces control parameters for the various independently operating processing tools to optimize the processing of the workpiece. More specifically, the apparatus provides a metrology station located between each of a plurality of semiconductor wafer processing tools such that measurements can be made on wafers as they are passed from one tool to another providing intra tool monitoring. The data collected by the metrology station is coupled to a metrology data analyzer, which determines whether any of the plurality of wafer processing tools should be adjusted to improve the processing of the overall wafer. As such, the output of the metrology data analyzer provides control parameters to process controllers connected controllers connected to each of the tools within the semiconductor wafer processing system. Consequently, the operation of the metrology stations and the metrology data analyzer provides both feed forward and feed back data to control the tools based upon certain information that is gathered within the metrology station.

10. 发明申请

US20070231750A1 Method of forming damascene structure 有权
标题翻译：形成镶嵌结构的方法
公开(公告)号：US20070231750A1
公开(公告)日：2007-10-04
申请号：US11390641
申请日：2006-03-28
申请人： Suketu Parikh
发明人： Suketu Parikh
IPC分类号： G03F7/26
CPC分类号： H01L21/76811 , H01L21/31144 , H01L21/76808
摘要： A method for forming a damascene structure utilizes dual hard mask layers and a thin etch stop layer, and does not require a sacrificial layer within the via. A floating etch stop layer can additionally be used. The dual hard masks may be formed of dielectric and neither of the hard masks is required to contain metal. The thin etch stop layer reduces capacitance problems.
摘要翻译：用于形成镶嵌结构的方法利用双硬掩模层和薄蚀刻停止层，并且不需要通孔内的牺牲层。另外可以使用浮动蚀刻停止层。双硬掩模可以由电介质形成，并且硬掩模都不需要包含金属。薄的蚀刻停止层减少电容问题。

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