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    • 7. 发明授权
    • Method of manufacturing a non-volatile semiconductor device
    • 制造非易失性半导体器件的方法
    • US07867849B2
    • 2011-01-11
    • US12222074
    • 2008-08-01
    • Choong-Ho LeeJai-Hyuk SongDong-Uk ChoiSuk-Kang Sung
    • Choong-Ho LeeJai-Hyuk SongDong-Uk ChoiSuk-Kang Sung
    • H01L21/336
    • H01L21/324H01L27/115H01L27/11521H01L27/11524H01L27/11568
    • Example embodiments relate to methods of fabricating a non-volatile memory device. According to example embodiments, a method of fabricating a non-volatile memory device may include forming at least one gate structure on an upper face of a substrate. The at least one gate structure may include a tunnel insulation layer pattern, a charge storing layer pattern, a dielectric layer pattern and a control gate. According to example embodiments, a method of fabricating a non-volatile memory device may also include forming a silicon nitride layer on the upper face of the substrate to cover the at least one gate structure, forming an insulating interlayer on the silicon nitride layer on the upper face of the substrate, and providing an annealing gas toward the upper face of the substrate and a lower face of the substrate to cure defects of the tunnel insulation layer pattern.
    • 示例实施例涉及制造非易失性存储器件的方法。 根据示例性实施例,制造非易失性存储器件的方法可以包括在衬底的上表面上形成至少一个栅极结构。 至少一个栅极结构可以包括隧道绝缘层图案,电荷存储层图案,电介质层图案和控制栅极。 根据示例实施例,制造非易失性存储器件的方法还可以包括在衬底的上表面上形成氮化硅层以覆盖至少一个栅极结构,在氮化硅层上形成绝缘中间层 并且朝向基板的上表面和基板的下表面提供退火气体,以固化隧道绝缘层图案的缺陷。
    • 8. 发明申请
    • Method of manufacturing a non-volatile semiconductor device
    • 制造非易失性半导体器件的方法
    • US20090035906A1
    • 2009-02-05
    • US12222074
    • 2008-08-01
    • Choong-Ho LeeJai-Hyuk SongDong-Uk ChoiSuk-Kang Sung
    • Choong-Ho LeeJai-Hyuk SongDong-Uk ChoiSuk-Kang Sung
    • H01L21/336
    • H01L21/324H01L27/115H01L27/11521H01L27/11524H01L27/11568
    • Example embodiments relate to methods of fabricating a non-volatile memory device. According to example embodiments, a method of fabricating a non-volatile memory device may include forming at least one gate structure on an upper face of a substrate. The at least one gate structure may include a tunnel insulation layer pattern, a charge storing layer pattern, a dielectric layer pattern and a control gate. According to example embodiments, a method of fabricating a non-volatile memory device may also include forming a silicon nitride layer on the upper face of the substrate to cover the at least one gate structure, forming an insulating interlayer on the silicon nitride layer on the upper face of the substrate, and providing an annealing gas toward the upper face of the substrate and a lower face of the substrate to cure defects of the tunnel insulation layer pattern.
    • 示例实施例涉及制造非易失性存储器件的方法。 根据示例性实施例,制造非易失性存储器件的方法可以包括在衬底的上表面上形成至少一个栅极结构。 至少一个栅极结构可以包括隧道绝缘层图案,电荷存储层图案,电介质层图案和控制栅极。 根据示例实施例,制造非易失性存储器件的方法还可以包括在衬底的上表面上形成氮化硅层以覆盖至少一个栅极结构,在氮化硅层上形成绝缘中间层 并且朝向基板的上表面和基板的下表面提供退火气体,以固化隧道绝缘层图案的缺陷。
    • 9. 发明申请
    • SEMICONDUCTOR MEMORY DEVICES
    • 半导体存储器件
    • US20110095377A1
    • 2011-04-28
    • US12984860
    • 2011-01-05
    • Jong-Sun SelJung-Dal ChoiChoong-Ho LeeJu-Hyuck ChungHee-Soo KangDong-uk Choi
    • Jong-Sun SelJung-Dal ChoiChoong-Ho LeeJu-Hyuck ChungHee-Soo KangDong-uk Choi
    • H01L27/088
    • H01L23/485H01L21/76804H01L21/76816H01L27/11519H01L27/11521H01L27/11524H01L2924/0002H01L2924/00
    • In some embodiments, a semiconductor memory device includes a substrate that includes a cell array region and a peripheral circuit region. The semiconductor memory device further includes a device isolation pattern on the substrate. The device isolation pattern defines a first active region and a second active region within the cell array region and a third active region in the peripheral circuit region. The semiconductor memory device further includes a first common source region, a plurality of first source/drain regions, and a first drain region in the first active region. The semiconductor memory device further includes a second common source region, a plurality of second source/drain regions, and a second drain region in the second active region. The semiconductor memory device further includes a third source/drain region in the third active region. The semiconductor memory device further includes a common source line contacting the first and second common source regions.
    • 在一些实施例中,半导体存储器件包括包括单元阵列区域和外围电路区域的衬底。 半导体存储器件还包括在衬底上的器件隔离图案。 器件隔离图案限定了单元阵列区域内的第一有源区和第二有源区以及外围电路区中的第三有源区。 半导体存储器件还包括第一有源区中的第一公共源极区,多个第一源极/漏极区和第一漏极区。 半导体存储器件还包括第二公共源极区域,多个第二源极/漏极区域和第二有源区域中的第二漏极区域。 半导体存储器件还包括第三有源区中的第三源/漏区。 半导体存储器件还包括与第一和第二公共源极区域接触的公共源极线。