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    • 4. 发明授权
    • Method and apparatus for the laser scribing of ultra lightweight semiconductor devices
    • 超轻型半导体器件的激光划线方法和装置
    • US07964476B2
    • 2011-06-21
    • US12053712
    • 2008-03-24
    • Shengzhong LiuGinger PietkaKevin BeerninkArindam BanerjeeChi YangSubhendu Guha
    • Shengzhong LiuGinger PietkaKevin BeerninkArindam BanerjeeChi YangSubhendu Guha
    • H01L21/00
    • H01L21/268H01L31/046H01L31/0465H01L31/1876Y02E10/50Y02P70/521
    • A system for the laser scribing of semiconductor devices includes a laser light source operable to selectably deliver laser illumination at a first wavelength and at a second wavelength which is shorter than the first wavelength. The system further includes a support for a semiconductor device and an optical system which is operative to direct the laser illumination from the light source to the semiconductor device. The optical system includes optical elements which are compatible with the laser illumination of the first wavelength and the laser illumination of the second wavelength. In specific instances, the first wavelength is long wavelength illumination such as illumination of at least 1000 nanometers, and the second wavelength is short wavelength illumination which in specific instances is 300 nanometers or shorter. By the use of the differing wavelengths, specific layers of the semiconductor device may be scribed without damage to subjacent layers. Also disclosed are specific scribing processes.
    • 用于半导体器件的激光刻划的系统包括可操作以可选择地提供比第一波长短的第一波长和第二波长的激光照明的激光光源。 该系统还包括用于半导体器件和光学系统的支撑件,该系统可操作以将激光照明从光源引导到半导体器件。 光学系统包括与第一波长的激光照射和第二波长的激光照射兼容的光学元件。 在具体情况下,第一波长是诸如至少1000纳米的照明的长波长照明,而第二波长是在特定情况下为300纳米或更短的短波长照明。 通过使用不同的波长,半导体器件的特定层可以被划刻而不损坏下层。 还公开了具体的划线工艺。