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    • 7. 发明授权
    • Method and apparatus for the laser scribing of ultra lightweight semiconductor devices
    • 超轻型半导体器件的激光划线方法和装置
    • US07964476B2
    • 2011-06-21
    • US12053712
    • 2008-03-24
    • Shengzhong LiuGinger PietkaKevin BeerninkArindam BanerjeeChi YangSubhendu Guha
    • Shengzhong LiuGinger PietkaKevin BeerninkArindam BanerjeeChi YangSubhendu Guha
    • H01L21/00
    • H01L21/268H01L31/046H01L31/0465H01L31/1876Y02E10/50Y02P70/521
    • A system for the laser scribing of semiconductor devices includes a laser light source operable to selectably deliver laser illumination at a first wavelength and at a second wavelength which is shorter than the first wavelength. The system further includes a support for a semiconductor device and an optical system which is operative to direct the laser illumination from the light source to the semiconductor device. The optical system includes optical elements which are compatible with the laser illumination of the first wavelength and the laser illumination of the second wavelength. In specific instances, the first wavelength is long wavelength illumination such as illumination of at least 1000 nanometers, and the second wavelength is short wavelength illumination which in specific instances is 300 nanometers or shorter. By the use of the differing wavelengths, specific layers of the semiconductor device may be scribed without damage to subjacent layers. Also disclosed are specific scribing processes.
    • 用于半导体器件的激光刻划的系统包括可操作以可选择地提供比第一波长短的第一波长和第二波长的激光照明的激光光源。 该系统还包括用于半导体器件和光学系统的支撑件,该系统可操作以将激光照明从光源引导到半导体器件。 光学系统包括与第一波长的激光照射和第二波长的激光照射兼容的光学元件。 在具体情况下,第一波长是诸如至少1000纳米的照明的长波长照明,而第二波长是在特定情况下为300纳米或更短的短波长照明。 通过使用不同的波长,半导体器件的特定层可以被划刻而不损坏下层。 还公开了具体的划线工艺。
    • 8. 发明申请
    • METHOD FOR STABILIZING SILICONE MATERIAL, STABILIZED SILICONE MATERIAL, AND DEVICES INCORPORATING THAT MATERIAL
    • 用于稳定硅材料,稳定的硅酮材料的方法和与材料合成的装置
    • US20090029053A1
    • 2009-01-29
    • US11782681
    • 2007-07-25
    • Shengzhong LiuArindam BanerjeeChi YangSubhendu Guha
    • Shengzhong LiuArindam BanerjeeChi YangSubhendu Guha
    • B05D3/10C08F8/00B05D3/06
    • H01L31/0481B64G1/443Y02E10/50
    • Darkening of silicone containing materials caused by exposure to ultraviolet illumination is prevented or reversed by exposure of those materials to an atmosphere containing a reactive species, which may comprise activated oxygen. The activated oxygen may be generated by ultraviolet irradiation of the silicone material in an oxygen containing atmosphere. In other instances, the activated oxygen may comprise ozone or some other activated oxygen species. In yet other instances, the reactive species may comprise an oxygen containing material such as nitrous oxide or nitrates. It may also comprise other materials such as halogens, atomic hydrogen, protons or the like. The treatment may be applied prior to ultraviolet exposure so as to prevent or minimize darkening, or it may be applied after darkening has occurred for purposes of reversing the darkening. Also disclosed are silicone materials which have been treated so as to make them resistant to ultraviolet induced darkening, as well as photovoltaic devices which have such silicone materials coated thereupon.
    • 通过将这些材料暴露于包含活性物质的气氛(其可以包含活性氧)来防止或逆转由暴露于紫外线照射引起的含硅氧烷材料的变暗。 活性氧可以通过在含氧气氛中的硅氧烷材料的紫外线照射而产生。 在其他情况下,活化的氧可以包括臭氧或一些其它活化的氧物质。 在其他情况下,反应性物质可以包含含氧材料如一氧化二氮或硝酸盐。 它还可以包括其它材料,例如卤素,原子氢,质子等。 在紫外线照射之前可以进行处理,以防止或最小化变暗,或者可以在发生变暗之后施加以改变变暗的目的。 还公开了已经被处理以使其耐紫外线诱导的变暗的硅材料,以及在其上涂覆了这种硅氧烷材料的光伏器件。