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1. 发明授权

US07158911B2 Methods and apparatus for thermal management of an integrated circuit die 有权
标题翻译：集成电路管芯的热管理方法和装置
公开(公告)号：US07158911B2
公开(公告)日：2007-01-02
申请号：US10821822
申请日：2004-04-09
申请人： Stephen H. Gunther , Frank Binns , Jack D. Pippin , Linda J. Rankin , Edward A. Burton , Douglas M. Carmean , John M. Bauer
发明人： Stephen H. Gunther , Frank Binns , Jack D. Pippin , Linda J. Rankin , Edward A. Burton , Douglas M. Carmean , John M. Bauer
IPC分类号： H01L31/58
CPC分类号： G06F1/206 , G01K7/015 , G06F1/3237 , G06F1/324 , G06F1/3296 , Y02D10/126 , Y02D10/128 , Y02D10/16 , Y02D10/172
摘要： An integrated, on-chip thermal management system providing closed-loop temperature control of an IC device and methods of performing thermal management of an IC device. The thermal management system comprises a temperature detection element, a power modulation element, a control element, and a visibility element. The temperature detection element includes a temperature sensor for detecting die temperature. The power modulation element may reduce the power consumption of an IC device by directly lowering the power consumption of the IC device, by limiting the speed at which the IC device executes instructions, by limiting the number of instructions executed by the IC device, or by a combination of these techniques. The control element allows for control over the behavior of the thermal management system, and the visibility element allows external devices to monitor the status of the thermal management system.
摘要翻译：集成的片上热管理系统，提供IC器件的闭环温度控制和执行IC器件热管理的方法。热管理系统包括温度检测元件，功率调制元件，控制元件和可见度元件。温度检测元件包括用于检测管芯温度的温度传感器。功率调制元件可以通过直接降低IC器件的功耗来限制IC器件执行指令的速度，通过限制由IC器件执行的指令的数量，或通过这些技术的组合。控制元件允许控制热管理系统的行为，并且可见性元件允许外部设备监视热管理系统的状态。

2. 发明授权

US06980918B2 Methods and apparatus for thermal management of an integrated circuit die 有权
标题翻译：集成电路管芯的热管理方法和装置
公开(公告)号：US06980918B2
公开(公告)日：2005-12-27
申请号：US10821292
申请日：2004-04-09
申请人： Stephen H. Gunther , Frank Binns , Jack D. Pippin , Linda J. Rankin , Edward A. Burton , Douglas M. Carmean , John M. Bauer
发明人： Stephen H. Gunther , Frank Binns , Jack D. Pippin , Linda J. Rankin , Edward A. Burton , Douglas M. Carmean , John M. Bauer
IPC分类号： G01K7/01 , G06F1/20 , G06F15/00
CPC分类号： G06F1/206 , G01K7/015 , G06F1/3237 , G06F1/324 , G06F1/3296 , Y02D10/126 , Y02D10/128 , Y02D10/16 , Y02D10/172
摘要： An integrated, on-chip thermal management system providing closed-loop temperature control of an IC device and methods of performing thermal management of an IC device. The thermal management system comprises a temperature detection element, a power modulation element, a control element, and a visibility element. The temperature detection element includes a temperature sensor for detecting die temperature. The power modulation element may reduce the power consumption of an IC device by directly lowering the power consumption of the IC device, by limiting the speed at which the IC device executes instructions, by limiting the number of instructions executed by the IC device, or by a combination of these techniques. The control element allows for control over the behavior of the thermal management system, and the visibility element allows external devices to monitor the status of the thermal management system.
摘要翻译：集成的片上热管理系统，提供IC器件的闭环温度控制和执行IC器件热管理的方法。热管理系统包括温度检测元件，功率调制元件，控制元件和可见度元件。温度检测元件包括用于检测管芯温度的温度传感器。功率调制元件可以通过直接降低IC器件的功耗来限制IC器件执行指令的速度，通过限制由IC器件执行的指令的数量，或者通过这些技术的组合。控制元件允许控制热管理系统的行为，并且可见性元件允许外部设备监视热管理系统的状态。

3. 发明授权

US06789037B2 Methods and apparatus for thermal management of an integrated circuit die 有权
公开(公告)号：US06789037B2
公开(公告)日：2004-09-07
申请号：US09784255
申请日：2001-02-14
申请人： Stephen H. Gunther , Frank Binns , Jack D. Pippin , Linda J. Rankin , Edward A. Burton , Douglas M. Carmean , John M. Bauer
发明人： Stephen H. Gunther , Frank Binns , Jack D. Pippin , Linda J. Rankin , Edward A. Burton , Douglas M. Carmean , John M. Bauer
IPC分类号： G01K710
CPC分类号： G06F1/206 , G01K7/015 , G06F1/3237 , G06F1/324 , G06F1/3296 , Y02D10/126 , Y02D10/128 , Y02D10/16 , Y02D10/172
摘要： An integrated, on-chip thermal management system providing closed-loop temperature control of an IC device and methods of performing thermal management of an IC device. The thermal management system comprises a temperature detection element, a power modulation element, a control element, and a visibility element. The temperature detection element includes a temperature sensor for detecting die temperature. The power modulation element may reduce the power consumption of an IC device by directly lowering the power consumption of the IC device, by limiting the speed at which the IC device executes instructions, by limiting the number of instructions executed by the IC device, or by a combination of these techniques. The control element allows for control over the behavior of the thermal management system, and the visibility element allows external devices to monitor the status of the thermal management system.

4. 发明授权

US06393374B1 Programmable thermal management of an integrated circuit die 有权
标题翻译：集成电路管芯的可编程热管理
公开(公告)号：US06393374B1
公开(公告)日：2002-05-21
申请号：US09281237
申请日：1999-03-30
申请人： Linda J. Rankin , Edward A. Burton , Stephen H. Gunther , Jack D. Pippin
发明人： Linda J. Rankin , Edward A. Burton , Stephen H. Gunther , Jack D. Pippin
IPC分类号： G01N2500
CPC分类号： G06F1/206 , G01K7/015 , G06F1/3237 , G06F1/324 , G06F1/3296 , Y02D10/126 , Y02D10/128 , Y02D10/16 , Y02D10/172
摘要： A method and apparatus for power throttling to manage the temperature of an IC. A temperature sensor is manufactured on the same die as the IC components. The temperature sensor generates an output in response to junction temperature of the IC components. A state machine is coupled to receive the output of the temperature sensor and to provide power reduction functions in response to the temperature sensor output exceeding a maximum thermal value. The maximum thermal value is less than the maximum allowable temperature of the IC corresponding to maximum power consumption. Thus, the invention reduces power consumption at a thermal value lower that a potentially catastrophic value rather than shutting down the IC when catastrophic failure is imminent.
摘要翻译：用于节电控制IC的温度的方法和装置。温度传感器在与IC部件相同的芯片上制造。温度传感器响应于IC组件的结温而产生输出。状态机被耦合以接收温度传感器的输出并且响应于温度传感器输出超过最大热值而提供功率降低功能。最大热值小于对应于最大功耗的IC的最大允许温度。因此，本发明降低了低于潜在灾难性值的热值的功率消耗，而不是在灾难性故障即将发生时关闭IC。

5. 发明授权

US6006169A Method and apparatus for trimming an integrated circuit 失效
标题翻译：用于修整集成电路的方法和装置
公开(公告)号：US6006169A
公开(公告)日：1999-12-21
申请号：US1606
申请日：1997-12-31
申请人： Bal S. Sandhu , Jack D. Pippin , Edward A. Burton
发明人： Bal S. Sandhu , Jack D. Pippin , Edward A. Burton
IPC分类号： G05F3/24 , G01K1/00
CPC分类号： G05F3/245
摘要： An integrated circuit has circuitry formed by a fabrication process. The circuitry has an electrical characteristic that is different from a predetermined value due to variations in the fabrication process. The electrical characteristic is responsive to a level of a current, and a current source of the integrated circuit is configured to be selectably enabled to adjust the level of the current to move the electrical characteristic closer to the predetermined value.
摘要翻译：集成电路具有通过制造工艺形成的电路。电路具有由于制造工艺的变化而与预定值不同的电特性。电特性响应于电流水平，并且集成电路的电流源被配置为可选择地使能以调整电流的电平以将电特性更接近预定值。

6. 发明授权

US07228508B1 Fail-safe thermal sensor apparatus and method 失效
标题翻译：故障安全热传感器装置及方法
公开(公告)号：US07228508B1
公开(公告)日：2007-06-05
申请号：US09707386
申请日：2000-11-07
申请人： Jack D. Pippin
发明人： Jack D. Pippin
IPC分类号： G06F17/50 , H03K19/00
CPC分类号： G06F1/324 , G05D23/19 , G05F3/265 , G05F3/267 , G06F1/206 , G06F11/3024 , G06F11/3058 , G06F11/3093 , Y02D10/16 , Y10T307/773
摘要： A fail-safe thermal sensor is implemented in an integrated circuit such as a microprocessor. The fail-safe thermal sensor monitors the temperature of the integrated circuit and halt logic halts operation of the integrated circuit in response to the fail-safe thermal sensor indicating that a threshold temperature has been exceeded. The threshold temperature may be a predetermined fixed critical temperature. The halt logic may inhibit operation of the integrated circuit by stopping a clock for the integrated circuit.
摘要翻译：在诸如微处理器的集成电路中实现故障安全的热传感器。故障安全热传感器监测集成电路的温度，并且响应于指示已经超过阈值温度的故障安全热传感器停止逻辑停止集成电路的操作。阈值温度可以是预定的固定临界温度。停止逻辑可以通过停止集成电路的时钟来禁止集成电路的操作。

7. 发明申请

US20140029150A1 INTERPOSER TO REGULATE CURRENT FOR WAFER TEST TOOLING 有权
标题翻译：用于调节流量测试工具的插件
公开(公告)号：US20140029150A1
公开(公告)日：2014-01-30
申请号：US13976970
申请日：2012-03-06
申请人： Evan M. Fledell , Paul B. Fischer , Roy E. Swart , Timothy J. Maloney , Jack D. Pippin
发明人： Evan M. Fledell , Paul B. Fischer , Roy E. Swart , Timothy J. Maloney , Jack D. Pippin
IPC分类号： H02H9/02
CPC分类号： H02H9/02 , G01R1/07385 , G01R1/36 , G01R31/2889
摘要： An interposer is described to regulate the current in wafer test tooling. In one example, the interposer includes a first connection pad to couple to automated test equipment and a second connection pad to couple to a device under test. The interposer further includes an overcurrent limit circuit to connect the first and second connection pads and to disconnect the first and second connection pads when the current between the first and second connection pads is over a predetermined amount.
摘要翻译：描述了内插器来调节晶圆测试工具中的电流。在一个示例中，插入器包括耦合到自动测试设备的第一连接焊盘和耦合到被测器件的第二连接焊盘。插入器还包括过电流限制电路，用于连接第一和第二连接焊盘，并且当第一和第二连接焊盘之间的电流超过预定量时，断开第一和第二连接焊盘。

8. 发明授权

US07216064B1 Method and apparatus for programmable thermal sensor for an integrated circuit 失效
标题翻译：用于集成电路的可编程热传感器的方法和装置
公开(公告)号：US07216064B1
公开(公告)日：2007-05-08
申请号：US08636024
申请日：1996-04-19
申请人： Jack D. Pippin
发明人： Jack D. Pippin
IPC分类号： G06F17/50 , G01K3/00
CPC分类号： G06F1/324 , G05D23/19 , G05F3/265 , G05F3/267 , G06F1/206 , G06F11/3024 , G06F11/3058 , G06F11/3093 , Y02D10/16 , Y10T307/773
摘要： A programmable thermal sensor is implemented in an integrated circuit such as a microprocessor. The programmable thermal sensor monitors the temperature of the integrated circuit, and generates an output to indicate that the temperature of the integrated circuit has attained a preprogrammed threshold temperature. In a microprocessor implementation, the microprocessor contains a processor unit, an internal register, microprogram and clock circuitry. The microprogram writes programmable input values, corresponding to threshold temperatures, to the internal register. The programmable thermal sensor reads the programmable input values, and generates an interrupt when the temperature of the microprocessor reaches the threshold temperature. In addition to a programmable thermal sensor, the microprocessor contains a fail safe thermal sensor that halts operation of the microprocessor when the temperature attains a critical temperature.
摘要翻译：可编程热传感器在诸如微处理器的集成电路中实现。可编程热传感器监控集成电路的温度，并产生一个输出，以指示集成电路的温度达到预编程的阈值温度。在微处理器实现中，微处理器包含处理器单元，内部寄存器，微程序和时钟电路。微程序将对应于阈值温度的可编程输入值写入内部寄存器。可编程热敏传感器读取可编程输入值，并在微处理器的温度达到阈值温度时产生中断。除可编程热敏传感器外，微处理器还包含一个故障安全的热传感器，当温度达到临界温度时，该传感器会停止微处理器的运行。

9. 发明申请

US20130173082A1 METHOD AND APPARATUS FOR PROGRAMMABLE THERMAL SENSOR FOR AN INTEGRATED CIRCUIT 审中-公开
标题翻译：用于集成电路的可编程热传感器的方法和装置
公开(公告)号：US20130173082A1
公开(公告)日：2013-07-04
申请号：US13786274
申请日：2013-03-05
申请人： Jack D. Pippin
发明人： Jack D. Pippin
IPC分类号： G05D23/19
CPC分类号： G06F1/324 , G05D23/19 , G05F3/265 , G05F3/267 , G06F1/206 , G06F11/3024 , G06F11/3058 , G06F11/3093 , Y02D10/16 , Y10T307/773
摘要： A programmable thermal sensor is implemented in an integrated circuit such as a microprocessor. The programmable thermal sensor monitors the temperature of the integrated circuit, and generates an output to indicate that the temperature of the integrated circuit has attained a pre-programmed threshold temperature. In a microprocessor implementation, the microprocessor contains a processor unit, an internal register, microprogram and clock circuitry. The microprogram writes programmable input values, corresponding to threshold temperatures, to the internal register. The programmable thermal sensor reads the programmable input values, and generates an interrupt when the temperature of the microprocessor reaches the threshold temperature. In addition to a programmable thermal sensor, the microprocessor contains a fail safe thermal sensor that halts operation of the microprocessor when the temperature attains a critical temperature.
摘要翻译：可编程热传感器在诸如微处理器的集成电路中实现。可编程热传感器监测集成电路的温度，并产生一个输出，以指示集成电路的温度达到预编程的阈值温度。在微处理器实现中，微处理器包含处理器单元，内部寄存器，微程序和时钟电路。微程序将对应于阈值温度的可编程输入值写入内部寄存器。可编程热敏传感器读取可编程输入值，并在微处理器的温度达到阈值温度时产生中断。除可编程热敏传感器外，微处理器还包含一个故障安全的热传感器，当温度达到临界温度时，该传感器会停止微处理器的运行。

10. 发明授权

US6072349A Comparator 失效
标题翻译：比较器
公开(公告)号：US6072349A
公开(公告)日：2000-06-06
申请号：US001608
申请日：1997-12-31
申请人： Jack D. Pippin , Bal S. Sandhu
发明人： Jack D. Pippin , Bal S. Sandhu
IPC分类号： G06F1/20 , H03F3/45 , H03F3/72 , H03K5/24 , H03F1/02
CPC分类号： G06F1/324 , G06F1/20 , H03F3/45479 , H03F3/72 , H03K5/2481 , Y02B60/1217
摘要： A comparator includes an amplifier that has an offset voltage that is responsive to a level of current. A current source of the comparator is configured to be selectably enabled to adjust the level of the current to change the offset voltage.
摘要翻译：比较器包括具有响应于电流电平的偏移电压的放大器。比较器的电流源被配置为可选择地使能以调整电流的电平以改变偏移电压。

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