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    • 9. 发明授权
    • Arrangement and method impedance matching
    • 布置和方法阻抗匹配
    • US07113054B2
    • 2006-09-26
    • US10468178
    • 2002-07-28
    • Phillipe RiondetGilles MontoriolJaques Trichet
    • Phillipe RiondetGilles MontoriolJaques Trichet
    • H03H7/38
    • H01L24/49H01L23/66H01L24/48H01L2223/6611H01L2223/6644H01L2224/48227H01L2224/4911H01L2224/49111H01L2224/49171H01L2224/49175H01L2924/00014H01L2924/01005H01L2924/01006H01L2924/01014H01L2924/01015H01L2924/01031H01L2924/01043H01L2924/01058H01L2924/01074H01L2924/10329H01L2924/12041H01L2924/14H01L2924/19041H01L2924/19042H01L2924/19043H01L2924/19107H01L2924/30105H01L2924/30107H01L2924/3011H01L2924/30111H03H7/383H01L2924/00H01L2224/45099H01L2224/05599
    • An arrangement and method for impedance matching (e.g., for a power amplifier) comprising a first node (204a) for receiving an output current to be impedance matched; a second node (212, 214) for receiving output current from the first node; a first current conductor (202c) for carrying current from the first node to the second node; a third node (204b) for receiving output current from the second node; and a second current conductor (202d) for carrying current from said second node to said third node, whereby the first and second current conductors are closely positioned so that their inductance is the sum of their self-inductances and the negative sum of their mutual inductance. The current conductors may be wire bonds, the arrangement may include a capacitor integrated in a power amplifier IC module, in which the capacitor may be provided in a separate IC from the power amplifier, the arrangement may utilise a plurality of impedance matching cells, and the wire bonds may be interdigitated across the semiconductor die. This provides the following advantages: easy to implement; increased accuracy of matching; requires few external components; easy to manufacture; no need for dedicated design flow; requires only standard IC production and test tools; uses low loss matching networks; involves only a small increase in die size (due to integration of capacitor), but the total size of the solution may be significantly reduced (e.g., by 50%) because of the reduced number of external components.
    • 一种用于阻抗匹配(例如功率放大器)的装置和方法,包括用于接收待阻抗匹配的输出电流的第一节点(204a); 用于从第一节点接收输出电流的第二节点(212,214); 用于承载从第一节点到第二节点的电流的第一电流导体(202c); 用于从第二节点接收输出电流的第三节点(204b); 以及用于将电流从所述第二节点传送到所述第三节点的第二电流导体(202d),由此所述第一和第二电流导体被紧密地定位,使得它们的电感是它们的自感和它们相互的负和之和 电感。 电流导体可以是引线接合,该布置可以包括集成在功率放大器IC模块中的电容器,其中电容器可以设置在与功率放大器分离的IC中,该装置可以利用多个阻抗匹配单元,以及 引线键可跨越半导体管芯交错。 这提供了以下优点:易于实现; 提高匹配精度; 需要很少的外部组件; 易于制造; 无需专用设计流程; 只需要标准的IC生产和测试工具; 使用低损耗匹配网络; 仅涉及芯片尺寸的小的增加(由于电容器的集成),但是由于外部部件的数量减少,所以溶液的总尺寸可以显着降低(例如,50%)。