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1. 发明申请

US20050098890A1 Method for producing an adhesive bond and adhesive bond between a chip and a planar surface 审中-公开
标题翻译：用于在芯片和平面之间产生粘合剂粘合和粘合剂粘合的方法
公开(公告)号：US20050098890A1
公开(公告)日：2005-05-12
申请号：US10962197
申请日：2004-10-08
申请人： Stephan Blaszczak , Martin Reiss , Bernd Scheibe
发明人： Stephan Blaszczak , Martin Reiss , Bernd Scheibe
IPC分类号： H01L21/58 , H01L23/13 , H01L23/495
CPC分类号： H01L24/48 , H01L23/13 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/05599 , H01L2224/29 , H01L2224/29101 , H01L2224/29198 , H01L2224/2929 , H01L2224/29299 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48465 , H01L2224/73215 , H01L2224/83138 , H01L2224/83194 , H01L2224/8385 , H01L2224/85399 , H01L2924/00013 , H01L2924/00014 , H01L2924/01014 , H01L2924/01028 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/15311 , H01L2924/351 , H01L2224/45099 , H01L2924/00 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199
摘要： A method for producing an adhesive bond between a chip and a planar surface and the arrangement of the adhesive bond are discussed. A flexible coupling medium is applied on the planar surface or on one side of the chip over the extent of its area and, of the surfaces to be bonded to each other. The surface that is free from the coupling agent is brought into contact with the coupling agent and remains in contact under the conditions required until a stable bond is produced. The adhesive bond is characterized in that the surfaces to be bonded to each other lie at a distance opposite each other and the coupling medium spreads at least virtually over the entire surface area of one of the two sides of the chip.
摘要翻译：讨论了在芯片和平面之间产生粘合剂的方法以及粘合剂粘结的布置。将柔性耦合介质施加在其面积的平坦表面上或芯片的一侧上，在其面积的范围内以及要彼此结合的表面。没有偶联剂的表面与偶联剂接触并在所需的条件下保持接触，直到产生稳定的键。粘合剂粘合的特征在于，要彼此接合的表面彼此相对的距离，并且耦合介质至少在实际上扩展到芯片两侧之一的整个表面区域。

2. 发明申请

US20070224729A1 Method for manufacturing a flip-chip package, substrate for manufacturing and flip-chip assembly 审中-公开
标题翻译：倒装芯片封装的制造方法，制造用基板和倒装芯片的组装方法
公开(公告)号：US20070224729A1
公开(公告)日：2007-09-27
申请号：US11386072
申请日：2006-03-21
申请人： Martin Reiss , Bernd Scheibe , Stephan Blaszczak
发明人： Martin Reiss , Bernd Scheibe , Stephan Blaszczak
IPC分类号： H01L21/00
CPC分类号： H01L21/563 , H01L21/565 , H01L23/3128 , H01L24/27 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/92125 , H01L2924/15151 , H01L2924/181 , H01L2924/1815 , H01L2924/00
摘要： A method for manufacturing a flip-chip package, in particular to a method for filling the space between an active side of a chip and a contact side of a substrate is disclosed. Furthermore, a substrate for supporting the filling and a flip-chip assembly is disclosed. The substrate includes a feed opening extending from the chip mounting surface within the chip supporting area to the substrate mounting surface. Via this feed opening, the underfill material is filled into the intervening space between substrate and chip.
摘要翻译：公开了一种用于制造倒装芯片封装的方法，特别涉及用于填充芯片的有源侧和基板的接触侧之间的空间的方法。此外，公开了一种用于支撑填充物的衬底和倒装芯片组件。基板包括从芯片支撑区域内的芯片安装表面延伸到基板安装表面的进料口。通过该进料口，将底部填充材料填充到基板和芯片之间的中间空间中。

3. 发明申请

US20050121807A1 Arrangement of a chip package constructed on a substrate and substrate for production of the same 审中-公开
标题翻译：在基板和基板上构造的芯片封装的布置用于制造它
公开(公告)号：US20050121807A1
公开(公告)日：2005-06-09
申请号：US10961820
申请日：2004-10-08
申请人： Martin Reiss , Stephan Blaszczak , Bernd Scheibe , Kerstin Nocke , Carsten Bender
发明人： Martin Reiss , Stephan Blaszczak , Bernd Scheibe , Kerstin Nocke , Carsten Bender
IPC分类号： H01L23/00 , H01L23/13 , H01L23/48
CPC分类号： H01L23/562 , H01L23/13 , H01L24/48 , H01L2224/48091 , H01L2224/4824 , H01L2924/00014 , H01L2924/15311 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A packaged chip includes a substrate that includes flat and rigid supporting regions that are connected to an upper surface of the substrate. A chip is mounted face-down on the upper surface of the substrate such that a connection between the substrate and the chip extends virtually completely over one side of the chip. An encapsulating compound overlies a backside of the chip. Further, rigid supporting zones can be connected to the backside of the chip such that the supporting zones are at least partly interconnected with the encapsulating compound.
摘要翻译：封装芯片包括基板，该基板包括连接到基板的上表面的平坦且刚性的支撑区域。将芯片面朝下地安装在基板的上表面上，使得基板和芯片之间的连接实际上完全在芯片的一侧上延伸。封装化合物覆盖在芯片的背面。此外，刚性支撑区域可以连接到芯片的背面，使得支撑区域与封装化合物至少部分地互连。

4. 发明申请

US20050104227A1 Substrate-based package for integrated circuits 审中-公开
标题翻译：基于基板的集成电路封装
公开(公告)号：US20050104227A1
公开(公告)日：2005-05-19
申请号：US10961473
申请日：2004-10-08
申请人： Stephan Blaszczak , Martin Reiss , Bernd Scheibe
发明人： Stephan Blaszczak , Martin Reiss , Bernd Scheibe
IPC分类号： H01L23/31 , H01L29/06 , H01L21/44 , H01L23/48
CPC分类号： H01L29/0657 , H01L23/3114 , H01L23/3142 , H01L24/48 , H01L2224/32225 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2924/00014 , H01L2924/10158 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A substrate-based package for integrated circuits includes a substrate on which at least one chip is attached by a die-attach material. The substrate has, on the side that is opposite from the chip, conductor tracks that are provided with solder balls and are connected to the chip by means of wire bridges that extend through a bonding channel, which is sealed by an encapsulating compound. The chip and parts of the substrate on the chip side are covered by a mold cap. The backside of the chip is provided at least partially with regions with a distinctly enlarged surface as a result of greater roughness by etching or mechanical working. The regions of greater roughness have a predetermined depth on the backside of the chip and also are able to be configured as crossing tracks.
摘要翻译：用于集成电路的基于衬底的封装包括其上至少一个芯片通过管芯附着材料附着在其上的衬底。衬底在与芯片相对的一侧具有设置有焊球的导体轨迹，并且通过延伸穿过由封装化合物密封的接合通道的线桥连接到芯片。芯片上的芯片和芯片的一部分被模具盖覆盖。通过蚀刻或机械加工，芯片的背面至少部分地由具有明显增大的表面的区域提供更大的粗糙度。较粗糙度的区域在芯片的背面具有预定的深度，并且也能够被配置为交叉轨迹。

5. 发明申请

US20070221318A1 Adhesion tape and method for mounting a chip onto a substrate 审中-公开
标题翻译：粘合带和将芯片安装在基板上的方法
公开(公告)号：US20070221318A1
公开(公告)日：2007-09-27
申请号：US11389550
申请日：2006-03-24
申请人： Martin Reiss , Bernd Scheibe , Stephan Blaszczak
发明人： Martin Reiss , Bernd Scheibe , Stephan Blaszczak
IPC分类号： B32B37/00
CPC分类号： H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/8385 , H01L2924/01033 , H01L2924/01082 , H01L2924/07802 , Y10T156/1978 , Y10T428/28 , H01L2924/00
摘要： An adhesion tape can be used for transferring an adhesive material onto the underside of a chip for further mounting of the chip onto a substrate. In order to provide effective compensation of the curvature of the wafers and of the dies without adversely affecting the mounting process in this case, an adhesion tape having an at least two-layered adhesive layer is provided. The adhesive layer comprises a first and a second adhesive layer. Both adhesive layers can be cured selectively with respect to one another.
摘要翻译：粘合带可以用于将粘合剂材料转移到芯片的下侧，以进一步将芯片安装到基板上。为了提供对晶片和模具的曲率的有效补偿，在这种情况下不会对安装过程产生不利影响，提供了具有至少两层粘合剂层的粘合带。粘合剂层包括第一和第二粘合剂层。两个粘合剂层可以相对于彼此选择性地固化。

6. 发明申请

US20060270109A1 Manufacturing method for an electronic component assembly and corresponding electronic component assembly 审中-公开
标题翻译：电子部件组件和相应电子部件组件的制造方法
公开(公告)号：US20060270109A1
公开(公告)日：2006-11-30
申请号：US11140687
申请日：2005-05-31
申请人： Stephan Blaszczak , Martin Reiss , Bernd Scheibe , Steffen Kroehnert , Knut Kahlisch , Ingolf Rau , Harry Hedler , Soo Park
发明人： Stephan Blaszczak , Martin Reiss , Bernd Scheibe , Steffen Kroehnert , Knut Kahlisch , Ingolf Rau , Harry Hedler , Soo Park
IPC分类号： H01L21/00
CPC分类号： H01L23/3128 , H01L23/13 , H01L23/3135 , H01L23/49816 , H01L24/48 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48464 , H01L2224/73215 , H01L2924/00014 , H01L2924/01327 , H01L2924/14 , H01L2924/15311 , H05K3/303 , H05K3/3436 , H05K2201/10568 , H05K2201/10734 , H05K2201/2036 , Y02P70/613 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Manufacturing method for an electronic component assembly and corresponding electronic component assembly The present invention provides a manufacturing method for an electronic component assembly and to a corresponding electronic component assembly. The method comprises the steps of: providing a substrate having a first and a second side and having at least one through-hole, said second side having a first plurality of solder connection pads; attaching a semiconductor chip to said first side of said substrate; performing a mould process on said substrate and said attached semiconductor chip so as to obtain a mould package, said mould package including at least one first mould section covering said semiconductor chip on the first side and at least one second mould section extending through said throughhole and protruding over said solder connection pads on the second side; and providing a printed circuit board having a surface with a second plurality of solder connection pads corresponding to said first plurality of solder connection pads; and soldering said mould package to said printed circuit board by means of solder balls between said first and second plurality of solder connection pads such that said at least one second section forms a spacer structure supporting said mould package on said surface of said printed circuit board.
摘要翻译：电子部件组件和相应的电子部件组件的制造方法本发明提供一种用于电子部件组件和相应的电子部件组件的制造方法。该方法包括以下步骤：提供具有第一和第二侧面并且具有至少一个通孔的基板，所述第二侧面具有第一多个焊接连接焊盘; 将半导体芯片附接到所述基板的所述第一侧; 在所述基板和所述附接的半导体芯片上执行模制工艺以获得模具包装，所述模具包装包括至少一个覆盖所述第一侧上的半导体芯片的第一模具部分和延伸穿过所述通孔的至少一个第二模具部分，突出在第二侧上的焊料连接焊盘上; 以及提供具有表面的印刷电路板，所述表面具有对应于所述第一多个焊料连接焊盘的第二多个焊料连接焊盘; 以及通过所述第一和第二多个焊接连接焊盘之间的焊球将所述模具封装焊接到所述印刷电路板，使得所述至少一个第二部分形成支撑所述印刷电路板的所述表面上的所述模具封装的间隔结构。

7. 发明授权

US07223639B2 Method of producing an electronic component and a panel with a plurality of electronic components 有权
标题翻译：电子部件的制造方法以及具有多个电子部件的面板
公开(公告)号：US07223639B2
公开(公告)日：2007-05-29
申请号：US10989650
申请日：2004-11-16
申请人： Stephan Blaszczak , Martin Reiss
发明人： Stephan Blaszczak , Martin Reiss
IPC分类号： H01L23/28
CPC分类号： H01L24/97 , H01L21/561 , H01L23/3128 , H01L23/49816 , H01L24/16 , H01L24/48 , H01L24/50 , H01L2224/0401 , H01L2224/05599 , H01L2224/13099 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48465 , H01L2224/48471 , H01L2224/73204 , H01L2224/73215 , H01L2224/73265 , H01L2224/85399 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01039 , H01L2924/01068 , H01L2924/01327 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/3511 , H01L2224/85 , H01L2224/83 , H01L2224/81 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： The electronic component has a semiconductor chip embedded in a plastic compound. The electronic component is produced by first producing a number of electronic components on a panel and subsequent dicing into single electronic components. The semiconductor chip of this component is disposed on a substrate which includes or is entirely formed of plastic and is embedded in a plastic package molding compound. The plastic of the substrate has a glass transition temperature range which is lower than the glass transition temperature range of the plastic package molding compound.
摘要翻译：电子部件具有嵌入塑料化合物中的半导体芯片。电子部件通过首先在面板上产生多个电子部件并随后切割成单个电子部件来制造。该部件的半导体芯片设置在基板上，该基板包括或完全由塑料形成，并且嵌入在塑料封装模塑料中。基板的塑料的玻璃化转变温度范围低于塑料封装模塑料的玻璃化转变温度范围。

8. 发明申请

US20060138632A1 Package for semiconductor components and method for producing the same 有权
标题翻译：半导体元件用封装及其制造方法
公开(公告)号：US20060138632A1
公开(公告)日：2006-06-29
申请号：US10518141
申请日：2003-06-10
申请人： Juergen Zacherl , Stephan Blaszczak , Martin Reiss , Sylke Ludewig
发明人： Juergen Zacherl , Stephan Blaszczak , Martin Reiss , Sylke Ludewig
IPC分类号： H01L21/50 , H01L23/24
CPC分类号： H01L21/565 , H01L23/3142 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to a packaging for semiconductor components such as FBGA packages in BOC technology or the like, wherein at least the back and the lateral edges of a chip (2) mounted on a substrate are enclosed by a mold coating (6), the casting compound used for the mold coating (6) being linked with the substrate and forming an integrated whole therewith. The invention further relates to a method for producing such a packaging for semiconductor components. The aim of the invention is to provide a packaging for semiconductor components which is characterized by reduced thermomechanical stress and at the same time a substantially improved adhesion of the mold coating to the substrate, thereby allowing for a higher package load. According to the invention, this aim is achieved in that the substrate (1), at least in some areas, has a spongy structure (7) that is provided with pore-type openings and that extends from the surface to the depths of the structure so that the molding material penetrates the substrate (1) by capillary attraction.
摘要翻译：本发明涉及用于诸如BOC技术等中的FBGA封装的半导体部件的封装，其中至少安装在基板上的芯片（2）的背面和侧边缘被模具涂层（6）包围，用于模具涂层（6）的铸造复合材料与基材连接并与其形成整体。本发明还涉及一种用于制造半导体元件用封装的方法。本发明的目的是提供一种用于半导体部件的封装，其特征在于减少了热机械应力，同时显着改善了模具涂层对基板的粘附性，从而允许更高的封装负载。根据本发明，该目的的实现是，至少在一些区域中，衬底（1）具有海绵状结构（7），其具有孔型开口并且从表面延伸到结构的深度使得成型材料通过毛细吸引而穿透基板（1）。

9. 发明授权

US07034383B2 Electronic component and panel and method for producing the same 失效
标题翻译：电子元件及面板及其制造方法
公开(公告)号：US07034383B2
公开(公告)日：2006-04-25
申请号：US10501599
申请日：2003-01-14
申请人： Stephan Blaszczak , Martin Reiss
发明人： Stephan Blaszczak , Martin Reiss
IPC分类号： H01L23/02
CPC分类号： H01L21/56 , H01L23/3107 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/4824 , H01L2224/48465 , H01L2224/85439 , H01L2224/85444 , H01L2224/85455 , H01L2924/00014 , H01L2924/01004 , H01L2924/01068 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2224/45015 , H01L2924/207 , H01L2924/00012 , H01L2924/00
摘要： The invention relates to an electronic component and a panel, the electronic component having a semiconductor chip with a wiring board and a plastic package. The plastic package is made up of two layers of plastic package molding compound arranged one on top of the other. These layers are created with the aid of a printing operation under normal atmosphere.
摘要翻译：本发明涉及电子部件和面板，电子部件具有带有布线板的半导体芯片和塑料封装。塑料包装由两层塑料包装模塑料组成，一层叠在一起。这些层是在正常气氛下通过打印操作创建的。

10. 发明授权

US07384822B2 Package for semiconductor components and method for producing the same 有权
标题翻译：半导体元件用封装及其制造方法
公开(公告)号：US07384822B2
公开(公告)日：2008-06-10
申请号：US10518141
申请日：2003-06-10
申请人： Juergen Zacherl , Stephan Blaszczak , Martin Reiss , Sylke Ludewig
发明人： Juergen Zacherl , Stephan Blaszczak , Martin Reiss , Sylke Ludewig
IPC分类号： H01L21/48
CPC分类号： H01L21/565 , H01L23/3142 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to a packaging for semiconductor components such as FBGA packages in BOC technology or the like, wherein at least the back and the lateral edges of a chip (2) mounted on a substrate are enclosed by a mold coating (6), the casting compound used for the mold coating (6) being linked with the substrate and forming an integrated whole therewith. The invention further relates to a method for producing such a packaging for semiconductor components. The aim of the invention is to provide a packaging for semiconductor components which is characterized by reduced thermomechanical stress and at the same time a substantially improved adhesion of the mold coating to the substrate, thereby allowing for a higher package load. According to the invention, this aim is achieved in that the substrate (1), at least in some areas, has a spongy structure (7) that is provided with pore-type openings and that extends from the surface to the depths of the structure so that the molding material penetrates the substrate (1) by capillary attraction.
摘要翻译：本发明涉及用于诸如BOC技术等中的FBGA封装的半导体部件的封装，其中至少安装在基板上的芯片（2）的背面和侧边缘被模具涂层（6）包围，用于模具涂层（6）的铸造复合材料与基材连接并与其形成整体。本发明还涉及一种用于制造半导体元件用封装的方法。本发明的目的是提供一种用于半导体部件的封装，其特征在于减少了热机械应力，同时显着改善了模具涂层对基板的粘附性，从而允许更高的封装负载。根据本发明，该目的的实现是，至少在一些区域中，衬底（1）具有海绵状结构（7），其具有孔型开口并且从表面延伸到结构的深度使得成型材料通过毛细吸引而穿透基板（1）。

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