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1. 发明申请

US20050098890A1 Method for producing an adhesive bond and adhesive bond between a chip and a planar surface 审中-公开
标题翻译：用于在芯片和平面之间产生粘合剂粘合和粘合剂粘合的方法
公开(公告)号：US20050098890A1
公开(公告)日：2005-05-12
申请号：US10962197
申请日：2004-10-08
申请人： Stephan Blaszczak , Martin Reiss , Bernd Scheibe
发明人： Stephan Blaszczak , Martin Reiss , Bernd Scheibe
IPC分类号： H01L21/58 , H01L23/13 , H01L23/495
CPC分类号： H01L24/48 , H01L23/13 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/05599 , H01L2224/29 , H01L2224/29101 , H01L2224/29198 , H01L2224/2929 , H01L2224/29299 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48465 , H01L2224/73215 , H01L2224/83138 , H01L2224/83194 , H01L2224/8385 , H01L2224/85399 , H01L2924/00013 , H01L2924/00014 , H01L2924/01014 , H01L2924/01028 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/15311 , H01L2924/351 , H01L2224/45099 , H01L2924/00 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199
摘要： A method for producing an adhesive bond between a chip and a planar surface and the arrangement of the adhesive bond are discussed. A flexible coupling medium is applied on the planar surface or on one side of the chip over the extent of its area and, of the surfaces to be bonded to each other. The surface that is free from the coupling agent is brought into contact with the coupling agent and remains in contact under the conditions required until a stable bond is produced. The adhesive bond is characterized in that the surfaces to be bonded to each other lie at a distance opposite each other and the coupling medium spreads at least virtually over the entire surface area of one of the two sides of the chip.
摘要翻译：讨论了在芯片和平面之间产生粘合剂的方法以及粘合剂粘结的布置。将柔性耦合介质施加在其面积的平坦表面上或芯片的一侧上，在其面积的范围内以及要彼此结合的表面。没有偶联剂的表面与偶联剂接触并在所需的条件下保持接触，直到产生稳定的键。粘合剂粘合的特征在于，要彼此接合的表面彼此相对的距离，并且耦合介质至少在实际上扩展到芯片两侧之一的整个表面区域。

2. 发明申请

US20070224729A1 Method for manufacturing a flip-chip package, substrate for manufacturing and flip-chip assembly 审中-公开
标题翻译：倒装芯片封装的制造方法，制造用基板和倒装芯片的组装方法
公开(公告)号：US20070224729A1
公开(公告)日：2007-09-27
申请号：US11386072
申请日：2006-03-21
申请人： Martin Reiss , Bernd Scheibe , Stephan Blaszczak
发明人： Martin Reiss , Bernd Scheibe , Stephan Blaszczak
IPC分类号： H01L21/00
CPC分类号： H01L21/563 , H01L21/565 , H01L23/3128 , H01L24/27 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/92125 , H01L2924/15151 , H01L2924/181 , H01L2924/1815 , H01L2924/00
摘要： A method for manufacturing a flip-chip package, in particular to a method for filling the space between an active side of a chip and a contact side of a substrate is disclosed. Furthermore, a substrate for supporting the filling and a flip-chip assembly is disclosed. The substrate includes a feed opening extending from the chip mounting surface within the chip supporting area to the substrate mounting surface. Via this feed opening, the underfill material is filled into the intervening space between substrate and chip.
摘要翻译：公开了一种用于制造倒装芯片封装的方法，特别涉及用于填充芯片的有源侧和基板的接触侧之间的空间的方法。此外，公开了一种用于支撑填充物的衬底和倒装芯片组件。基板包括从芯片支撑区域内的芯片安装表面延伸到基板安装表面的进料口。通过该进料口，将底部填充材料填充到基板和芯片之间的中间空间中。

3. 发明申请

US20050121807A1 Arrangement of a chip package constructed on a substrate and substrate for production of the same 审中-公开
标题翻译：在基板和基板上构造的芯片封装的布置用于制造它
公开(公告)号：US20050121807A1
公开(公告)日：2005-06-09
申请号：US10961820
申请日：2004-10-08
申请人： Martin Reiss , Stephan Blaszczak , Bernd Scheibe , Kerstin Nocke , Carsten Bender
发明人： Martin Reiss , Stephan Blaszczak , Bernd Scheibe , Kerstin Nocke , Carsten Bender
IPC分类号： H01L23/00 , H01L23/13 , H01L23/48
CPC分类号： H01L23/562 , H01L23/13 , H01L24/48 , H01L2224/48091 , H01L2224/4824 , H01L2924/00014 , H01L2924/15311 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A packaged chip includes a substrate that includes flat and rigid supporting regions that are connected to an upper surface of the substrate. A chip is mounted face-down on the upper surface of the substrate such that a connection between the substrate and the chip extends virtually completely over one side of the chip. An encapsulating compound overlies a backside of the chip. Further, rigid supporting zones can be connected to the backside of the chip such that the supporting zones are at least partly interconnected with the encapsulating compound.
摘要翻译：封装芯片包括基板，该基板包括连接到基板的上表面的平坦且刚性的支撑区域。将芯片面朝下地安装在基板的上表面上，使得基板和芯片之间的连接实际上完全在芯片的一侧上延伸。封装化合物覆盖在芯片的背面。此外，刚性支撑区域可以连接到芯片的背面，使得支撑区域与封装化合物至少部分地互连。

4. 发明申请

US20050104227A1 Substrate-based package for integrated circuits 审中-公开
标题翻译：基于基板的集成电路封装
公开(公告)号：US20050104227A1
公开(公告)日：2005-05-19
申请号：US10961473
申请日：2004-10-08
申请人： Stephan Blaszczak , Martin Reiss , Bernd Scheibe
发明人： Stephan Blaszczak , Martin Reiss , Bernd Scheibe
IPC分类号： H01L23/31 , H01L29/06 , H01L21/44 , H01L23/48
CPC分类号： H01L29/0657 , H01L23/3114 , H01L23/3142 , H01L24/48 , H01L2224/32225 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2924/00014 , H01L2924/10158 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A substrate-based package for integrated circuits includes a substrate on which at least one chip is attached by a die-attach material. The substrate has, on the side that is opposite from the chip, conductor tracks that are provided with solder balls and are connected to the chip by means of wire bridges that extend through a bonding channel, which is sealed by an encapsulating compound. The chip and parts of the substrate on the chip side are covered by a mold cap. The backside of the chip is provided at least partially with regions with a distinctly enlarged surface as a result of greater roughness by etching or mechanical working. The regions of greater roughness have a predetermined depth on the backside of the chip and also are able to be configured as crossing tracks.
摘要翻译：用于集成电路的基于衬底的封装包括其上至少一个芯片通过管芯附着材料附着在其上的衬底。衬底在与芯片相对的一侧具有设置有焊球的导体轨迹，并且通过延伸穿过由封装化合物密封的接合通道的线桥连接到芯片。芯片上的芯片和芯片的一部分被模具盖覆盖。通过蚀刻或机械加工，芯片的背面至少部分地由具有明显增大的表面的区域提供更大的粗糙度。较粗糙度的区域在芯片的背面具有预定的深度，并且也能够被配置为交叉轨迹。

5. 发明申请

US20070221318A1 Adhesion tape and method for mounting a chip onto a substrate 审中-公开
标题翻译：粘合带和将芯片安装在基板上的方法
公开(公告)号：US20070221318A1
公开(公告)日：2007-09-27
申请号：US11389550
申请日：2006-03-24
申请人： Martin Reiss , Bernd Scheibe , Stephan Blaszczak
发明人： Martin Reiss , Bernd Scheibe , Stephan Blaszczak
IPC分类号： B32B37/00
CPC分类号： H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/8385 , H01L2924/01033 , H01L2924/01082 , H01L2924/07802 , Y10T156/1978 , Y10T428/28 , H01L2924/00
摘要： An adhesion tape can be used for transferring an adhesive material onto the underside of a chip for further mounting of the chip onto a substrate. In order to provide effective compensation of the curvature of the wafers and of the dies without adversely affecting the mounting process in this case, an adhesion tape having an at least two-layered adhesive layer is provided. The adhesive layer comprises a first and a second adhesive layer. Both adhesive layers can be cured selectively with respect to one another.
摘要翻译：粘合带可以用于将粘合剂材料转移到芯片的下侧，以进一步将芯片安装到基板上。为了提供对晶片和模具的曲率的有效补偿，在这种情况下不会对安装过程产生不利影响，提供了具有至少两层粘合剂层的粘合带。粘合剂层包括第一和第二粘合剂层。两个粘合剂层可以相对于彼此选择性地固化。

6. 发明申请

US20060270109A1 Manufacturing method for an electronic component assembly and corresponding electronic component assembly 审中-公开
标题翻译：电子部件组件和相应电子部件组件的制造方法
公开(公告)号：US20060270109A1
公开(公告)日：2006-11-30
申请号：US11140687
申请日：2005-05-31
申请人： Stephan Blaszczak , Martin Reiss , Bernd Scheibe , Steffen Kroehnert , Knut Kahlisch , Ingolf Rau , Harry Hedler , Soo Park
发明人： Stephan Blaszczak , Martin Reiss , Bernd Scheibe , Steffen Kroehnert , Knut Kahlisch , Ingolf Rau , Harry Hedler , Soo Park
IPC分类号： H01L21/00
CPC分类号： H01L23/3128 , H01L23/13 , H01L23/3135 , H01L23/49816 , H01L24/48 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48464 , H01L2224/73215 , H01L2924/00014 , H01L2924/01327 , H01L2924/14 , H01L2924/15311 , H05K3/303 , H05K3/3436 , H05K2201/10568 , H05K2201/10734 , H05K2201/2036 , Y02P70/613 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Manufacturing method for an electronic component assembly and corresponding electronic component assembly The present invention provides a manufacturing method for an electronic component assembly and to a corresponding electronic component assembly. The method comprises the steps of: providing a substrate having a first and a second side and having at least one through-hole, said second side having a first plurality of solder connection pads; attaching a semiconductor chip to said first side of said substrate; performing a mould process on said substrate and said attached semiconductor chip so as to obtain a mould package, said mould package including at least one first mould section covering said semiconductor chip on the first side and at least one second mould section extending through said throughhole and protruding over said solder connection pads on the second side; and providing a printed circuit board having a surface with a second plurality of solder connection pads corresponding to said first plurality of solder connection pads; and soldering said mould package to said printed circuit board by means of solder balls between said first and second plurality of solder connection pads such that said at least one second section forms a spacer structure supporting said mould package on said surface of said printed circuit board.
摘要翻译：电子部件组件和相应的电子部件组件的制造方法本发明提供一种用于电子部件组件和相应的电子部件组件的制造方法。该方法包括以下步骤：提供具有第一和第二侧面并且具有至少一个通孔的基板，所述第二侧面具有第一多个焊接连接焊盘; 将半导体芯片附接到所述基板的所述第一侧; 在所述基板和所述附接的半导体芯片上执行模制工艺以获得模具包装，所述模具包装包括至少一个覆盖所述第一侧上的半导体芯片的第一模具部分和延伸穿过所述通孔的至少一个第二模具部分，突出在第二侧上的焊料连接焊盘上; 以及提供具有表面的印刷电路板，所述表面具有对应于所述第一多个焊料连接焊盘的第二多个焊料连接焊盘; 以及通过所述第一和第二多个焊接连接焊盘之间的焊球将所述模具封装焊接到所述印刷电路板，使得所述至少一个第二部分形成支撑所述印刷电路板的所述表面上的所述模具封装的间隔结构。

7. 发明授权

US09880702B2 Content structures and content navigation interfaces 有权
公开(公告)号：US09880702B2
公开(公告)日：2018-01-30
申请号：US11502680
申请日：2006-08-11
申请人： Torsten Both , Christian Lindholm , Bernd Scheibe , Torsten Schulz
发明人： Torsten Both , Christian Lindholm , Bernd Scheibe , Torsten Schulz
IPC分类号： G06F3/00 , G06F3/0482 , G06F3/0481 , G06F3/0489
CPC分类号： G06F3/0482 , G06F3/04817 , G06F3/04892
摘要： In one example, a content navigation interface apparatus includes display logic for displaying selections for accessing a first entry of a content structure and a second entry of the content structure, wherein the second entry is a sub-entry of the first entry. The apparatus further including selection logic for determining the second entry for display based on a user characteristic (e.g., history, user profile, etc.). The first entry may be associated with a first level of a hierarchical content structure, and the second entry associated with a second level of the hierarchical content structure. In one example, the first entry is associated with a broad content category and the second entry associated with content, such as a media object.

8. 发明授权

US08775420B2 Text display of geo-referenced information based on relative distance to a user location 有权
标题翻译：基于与用户位置的相对距离的地理参考信息的文本显示
公开(公告)号：US08775420B2
公开(公告)日：2014-07-08
申请号：US11931332
申请日：2007-10-31
申请人： Bernd Scheibe
发明人： Bernd Scheibe
IPC分类号： G06F17/30 , H04Q7/20
CPC分类号： H04W4/02 , H04L67/18
摘要： A system, method, and computer readable medium are provided for displaying geographically referenced information. In one example, a method includes causing a display of search results from a search of geographically referenced information (e.g., point-of-interest locations, geo-tagged objects, other users, and so on), the display comprising text associated with each of the search results, where the text varies for at least one of the search results based on the distance of the search results from a user location. For example, text associated with relatively close search results displayed more prominently than relatively distant search results. The method may further include generating presentation data according to a display scheme for displaying search results and communicating the presentation data to a user device. The method may vary the text based on at least one of font size, font style, color, shading, three-dimensional height, associated features, animation, combinations thereof, and the like.
摘要翻译：提供了一种用于显示地理参考信息的系统，方法和计算机可读介质。在一个示例中，一种方法包括通过搜索地理参考信息（例如，兴趣点位置，地理标签对象，其他用户等）来显示搜索结果，该显示器包括与每个相关联的文本相关联的文本的搜索结果，其中基于搜索结果与用户位置的距离的文本对于至少一个搜索结果的变化。例如，与相对较近的搜索结果相关联的文本比相对较远的搜索结果更显着地显示。该方法还可以包括根据用于显示搜索结果并将呈现数据传送给用户设备的显示方案来生成呈现数据。该方法可以基于字体大小，字体样式，颜色，阴影，三维高度，相关联的特征，动画，其组合等中的至少一个来改变文本。

9. 外观设计

USD595728S1 Display panel with graphical user interface for navigating content 有权
标题翻译：具有图形用户界面的显示面板，用于浏览内容
公开(公告)号：USD595728S1
公开(公告)日：2009-07-07
申请号：US29296164
申请日：2007-10-15
申请人： Bernd Scheibe , Torsten Both , Pamela Mead , Matti Keltanen
设计人： Bernd Scheibe , Torsten Both , Pamela Mead , Matti Keltanen

10. 发明申请

US20130160832A1 MARKING OF A SUBSTRATE OF A SOLAR CELL 审中-公开
标题翻译：太阳能电池基板的标记
公开(公告)号：US20130160832A1
公开(公告)日：2013-06-27
申请号：US13335370
申请日：2011-12-22
申请人： Andreas Krause , Frank Martin , Grit Bonsdorf , Matthias Georgi , Bernd Scheibe , Matthias Wagner
发明人： Andreas Krause , Frank Martin , Grit Bonsdorf , Matthias Georgi , Bernd Scheibe , Matthias Wagner
IPC分类号： H01L31/18 , H01L31/0236
CPC分类号： H01L31/02168 , H01L31/02 , Y02E10/50
摘要： The present invention relates to a solar-cell-marking method. The method comprises providing a substrate for a solar cell, forming an etching mask on the substrate, and carrying out an etching process, wherein an elevated marking structure defined by the etching mask is formed on the substrate. The invention further relates to a solar cell comprising such a marking structure.
摘要翻译：本发明涉及一种太阳能电池标记方法。该方法包括提供太阳能电池用衬底，在衬底上形成蚀刻掩模，并进行蚀刻工艺，其中在衬底上形成由蚀刻掩模限定的升高的标记结构。本发明还涉及一种包括这种标记结构的太阳能电池。

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