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1. 发明授权

US07868430B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US07868430B2
公开(公告)日：2011-01-11
申请号：US12238468
申请日：2008-09-26
申请人： Stefan Paulus , Manfred Fries , Martin Petz , Thomas Mueller
发明人： Stefan Paulus , Manfred Fries , Martin Petz , Thomas Mueller
IPC分类号： H01L29/72
CPC分类号： H01L23/49861 , H01L23/24 , H01L24/48 , H01L24/49 , H01L24/83 , H01L2224/45014 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/83 , H01L2924/00014 , H01L2924/01068 , H01L2924/01078 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： This application relates to a semiconductor device comprising multiple separate leads molded in a molded structure, and a chip attached to the molded structure over at least two of the multiple separate leads.
摘要翻译：本申请涉及包括模制在模制结构中的多个分离引线的半导体器件，以及在多个分离引线中的至少两个上连接到模制结构的芯片。

2. 发明授权

US07012531B2 Product label, method of producing product labels and method for identifying products in a contactless and forgery-proof manner 失效
公开(公告)号：US07012531B2
公开(公告)日：2006-03-14
申请号：US10164552
申请日：2002-06-07
申请人： Manfred Fries , Detlef Houdeau
发明人： Manfred Fries , Detlef Houdeau
IPC分类号： G08B13/14
CPC分类号： G06K19/07749 , G06K19/073 , G06K19/0739
摘要： A product label includes a semiconductor chip and an antenna. The semiconductor chip stores information about a product. The antenna transmits the information about the product to a reading device. The antenna has a predetermined breaking point at which the antenna can be destroyed during the reading operation by energy introduced by the reading device so that the product label can be read only for a specific number of read cycles. A method of producing product labels and a method for a contactless, forgery-proof identification of products are also provided.

3. 发明授权

US06836953B2 Method of producing a biometric sensor 失效
标题翻译：生物传感器的生产方法
公开(公告)号：US06836953B2
公开(公告)日：2005-01-04
申请号：US10289087
申请日：2002-11-06
申请人： Manfred Fries , Thomas Münch , Reinhard Fischbach
发明人： Manfred Fries , Thomas Münch , Reinhard Fischbach
IPC分类号： G01B7/34 , A61B5/1172 , G01B7/28 , G01B21/00 , G06K9/00 , G06T1/00 , G07C9/00 , H01L23/12 , H01S4/00
CPC分类号： A61B5/1172 , G06K9/0002 , G07C9/00158 , Y10T29/49002 , Y10T29/49117 , Y10T29/4913 , Y10T29/49171
摘要： In a biometric sensor and a method for its production, a sensor chip is provided with connecting contacts in the form of electrically conductive bumps. The sensor chip is inserted into a chip housing, the bumps making contact with corresponding connecting leads belonging to the chip housing. At the same time as this contact is made, the sensor chip is bonded adhesively into the chip housing by an adhesive layer, which surrounds the sensor field in a sealing manner.

4. 发明授权

US06414441B1 Flat carrier with an indicating device 失效
标题翻译：带有指示装置的平面载体
公开(公告)号：US06414441B1
公开(公告)日：2002-07-02
申请号：US09636534
申请日：2000-08-10
申请人： Manfred Fries , Wolfgang Friess
发明人： Manfred Fries , Wolfgang Friess
IPC分类号： G09G310
CPC分类号： G06K19/07749 , G06K19/07336 , G06K19/07703 , G09F13/22 , H05K1/16
摘要： A flat carrier having a power supply, for example in the form of a coil. The carrier is characterized by an electroluminescent device that contains two flat electrodes lying above one another and an electroluminescent paste located between the electrodes. The electrodes of the electroluminescent device are connected to terminals of the power supply, which can be implemented, for example, as a coil or battery.
摘要翻译：具有例如线圈形式的电源的平坦载体。载体的特征在于电致发光器件，其包含彼此相对的两个平坦电极和位于电极之间的电致发光膏。电致发光器件的电极连接到电源的端子，其可以例如作为线圈或电池来实现。

5. 发明授权

US06201296B1 Semiconductor chip with protection against analyzing 有权
标题翻译：半导体芯片具有防分析功能
公开(公告)号：US06201296B1
公开(公告)日：2001-03-13
申请号：US09274501
申请日：1999-03-23
申请人： Manfred Fries , Peter Stampka
发明人： Manfred Fries , Peter Stampka
IPC分类号： H01L2302
CPC分类号： H01L23/576 , G06F21/86 , H01L2924/0002 , Y10S257/922 , H01L2924/00
摘要： A copy-protection device for a semiconductor chip with a cover has a resonant oscillating circuit whose elements are located on the chip surface and within the cover. The semiconductor chip also has an evaluation circuit connected to the oscillating circuit. The evaluation circuit disables the semiconductor chip if the oscillating circuit is detuned and thus stopped from resonating. This detuning of the oscillating circuit occurs when the cover is removed, since the cover acts as a dielectric for the capacitor. After the cover has been removed, it is impossible to operate the semiconductor chip, in order to copy or analyze it.
摘要翻译：具有盖的半导体芯片的复制保护装置具有谐振振荡电路，其元件位于芯片表面和盖内。半导体芯片还具有连接到振荡电路的评估电路。如果振荡电路失谐并因此停止谐振，则评估电路禁用半导体芯片。当盖被去除时，振荡电路的失谐发生，因为盖用作电容器的电介质。在盖被去除之后，不可能操作半导体芯片，以便进行复制或分析。

6. 发明授权

US07179680B2 Method for producing an optoelectronic component 有权
标题翻译：光电子元件的制造方法
公开(公告)号：US07179680B2
公开(公告)日：2007-02-20
申请号：US10695580
申请日：2003-10-28
申请人： Manfred Fries
发明人： Manfred Fries
IPC分类号： H01L21/00 , H01L29/06 , H01L31/113 , H01L23/02 , H01L23/28 , H01L23/29
CPC分类号： G02B6/4204 , G02B6/4255 , G02B6/4259 , H01L33/54 , H01L2224/48091 , H01L2224/48247 , H01L2924/1815 , H01L2924/00014
摘要： An optoelectronic component with an optoelectronic transducer is produced with the novel method. The optoelectronic component has a coupling region, which is formed in a radiation-transparent molding of the optoelectronic component. On the base of a clearance of the coupling region, the optoelectronic component has a radiation-optical functional surface, which is formed from the housing material and introduced into the molding with the aid of a profile milling cutter.
摘要翻译：利用新型方法制造出具有光电转换器的光电子元件。光电子部件具有耦合区域，其形成在光电子部件的辐射透明模制中。在耦合区域的间隙的基础上，光电子部件具有辐射光学功能表面，该表面由壳体材料形成，并借助轮廓铣刀引入模制件中。

7. 发明授权

US06848617B1 Smart card module for biometric sensors 有权
标题翻译：用于生物识别传感器的智能卡模块
公开(公告)号：US06848617B1
公开(公告)日：2005-02-01
申请号：US09627181
申请日：2000-07-27
申请人： Manfred Fries , Jürgen Fischer , Detlef Houdeau
发明人： Manfred Fries , Jürgen Fischer , Detlef Houdeau
IPC分类号： A61B5/117 , G06K9/00 , G06K19/077 , G06T1/00 , G07C9/00 , G06K19/06
CPC分类号： G06K19/0718 , G06K9/0002 , G06K19/077 , G07C9/00087 , G07C9/00158
摘要： In a smart card module for biometric sensors for installation in smart cards, a support has at least one through opening or window in the region of a sensor chip. The sensor chip is mounted on the support such that an active surface of the sensor chip is directed toward the support and is situated in the region of the window, so that it can be accessed through the window in the support.
摘要翻译：在用于安装在智能卡中的生物测定传感器的智能卡模块中，支撑件在传感器芯片的区域中具有至少一个通孔或窗口。传感器芯片安装在支撑件上，使得传感器芯片的有效表面指向支撑件并且位于窗口的区域中，使得其可以通过支撑件中的窗口进入。

8. 发明授权

US06778407B2 Portable data carrier 有权
标题翻译：便携式数据载体
公开(公告)号：US06778407B2
公开(公告)日：2004-08-17
申请号：US10211077
申请日：2002-08-02
申请人： Jürgen Fischer , Manfred Fries , Frank Püschner , Annemarie Seidl
发明人： Jürgen Fischer , Manfred Fries , Frank Püschner , Annemarie Seidl
IPC分类号： H05K710
CPC分类号： G06K19/07728 , G06K19/07743 , H01L2224/32225 , H01L2224/48091 , H01L2224/48228 , H01L2224/48465 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A portable data carrier includes a card-shaped body having a recess for receiving a chip module. The chip module includes at least one semiconductor chip on a first main side of a chip carrier connected to the card-shaped body, and a metallization layer disposed on a second main side of the chip carrier and having contact lugs. The chip carrier has desired bending points which, upon the occurrence of bending stresses, reduce forces on the semiconductor chip and wire connections.
摘要翻译：便携式数据载体包括具有用于接收芯片模块的凹部的卡形体。芯片模块包括在与卡形体连接的芯片载体的第一主侧上的至少一个半导体芯片，以及设置在芯片载体的第二主侧上并具有接触凸耳的金属化层。芯片载体具有所需的弯曲点，其在发生弯曲应力时减小半导体芯片和电线连接上的力。

9. 发明授权

US06375083B2 Smart card 有权
标题翻译：智能卡
公开(公告)号：US06375083B2
公开(公告)日：2002-04-23
申请号：US09354131
申请日：1999-07-15
申请人： Manfred Fries , Frank Püschner , Josef Mundigl , Jürgen Fischer , Detlef Houdeau
发明人： Manfred Fries , Frank Püschner , Josef Mundigl , Jürgen Fischer , Detlef Houdeau
IPC分类号： G06K1906
CPC分类号： G06K19/07747 , G06K19/07749 , G06K19/07779 , G06K19/07783 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/01078 , H01L2924/30107 , H01L2924/00014 , H01L2924/00
摘要： A smart card with a card carrier on which a data processing circuit and also a connection assembly for the contactless communication of data between the data processing circuit and an external data processing station are provided. In the course of producing a prior art smart card, an integrated circuit is applied to a card carrier made of plastic. Afterwards, a transmitting/receiving coil connected to corresponding terminals of the integrated circuit is applied along the outer edges of the prior art smart card. In the case of the prior art smart card, the fact that defective prior art smart cards have to be destroyed is disadvantageous. According to the invention, the data processing circuit and the connection assembly are provided in a region of at least one module carrier and the card carrier has a region for accommodating the module carrier. This makes it possible firstly to test the completed module carrier in respect of its proper functioning before it is incorporated into a card carrier.
摘要翻译：一种具有卡载体的智能卡，其上提供有数据处理电路和数据处理电路与外部数据处理站之间的数据无接触通信的连接组件。在生产现有技术的智能卡的过程中，将集成电路应用于由塑料制成的卡片载体。之后，沿着现有技术的智能卡的外边缘施加连接到集成电路的相应端子的发送/接收线圈。在现有技术的智能卡的情况下，缺陷的现有技术的智能卡必须被销毁的事实是不利的。根据本发明，数据处理电路和连接组件设置在至少一个模块载体的区域中，并且卡载体具有用于容纳模块载体的区域。这使得首先可以在完成的模块载体合并到卡载体之前对其正常工作进行测试。

10. 发明授权

US06971519B2 Configuration of a flat carrier with a chip module in a padded envelope and method of arranging the configuration 失效
标题翻译：配置带有封装信封中的芯片模块的扁平载体以及配置方法
公开(公告)号：US06971519B2
公开(公告)日：2005-12-06
申请号：US10306181
申请日：2002-11-27
申请人： Manfred Fries
发明人： Manfred Fries
IPC分类号： B42D15/02 , B42D15/10 , B65D27/02 , G06K17/00 , G06K19/00 , G06K19/077 , G07B17/00 , B65D85/48
CPC分类号： G06K19/07728 , B65D27/02 , G06K19/077 , G06K2017/0038 , G07B17/00467 , G07B2017/00491
摘要： A configuration of a flat carrier with a chip module in a padded envelope, which can be transported in a transport device in the direction of one of the envelope's side edges, includes disposing the chip module in the padded envelope such that wire connections in the chip module extend over a side of the semiconductor chip that runs parallel to the transport device. Such a configuration is made possible by the fact that the flat carrier is applied in a standard way to a further carrier, which is folded in a suitable way.
摘要翻译：具有芯片模块的扁平载体的结构可以在填充的封套中，其可以沿着封套的侧边之一的方向在输送装置中输送，包括将芯片模块设置在填充的封套中，使得芯片中的导线连接模块在平行于传送装置延伸的半导体芯片的一侧延伸。这样的配置可以通过以标准方式施加到另一个以适当方式折叠的另外的载体的事实成为可能。

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