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    • 4. 发明申请
    • Low power magnetoelectronic device structures utilizing enhanced permeability materials
    • 利用增强的渗透性材料的低功率磁电子器件结构
    • US20060186495A1
    • 2006-08-24
    • US11066884
    • 2005-02-24
    • Nicholas RizzoRenu DaveJon SlaughterSrinivas Pietambaram
    • Nicholas RizzoRenu DaveJon SlaughterSrinivas Pietambaram
    • H01L43/00
    • H01L43/08H01L43/12Y10S977/838Y10S977/933
    • Low power magnetoelectronic device structures and methods for making the same are provided. One magnetoelectronic device structure (100) comprises a programming line (104), a magnetoelectronic device (102) magnetically coupled to the programming line, and an enhanced permeability dielectric material (106) disposed adjacent the magnetoelectronic device. The enhanced permeability dielectric material has a permeability no less than approximately 1.5. A method for making a magnetoelectronic device structure is also provided. The method comprises fabricating a magnetoelectronic device (102) and depositing a conducting line (104). A layer of enhanced permeability dielectric material (106) having a permeability no less than approximately 1.5 is formed, wherein after the step of fabricating a magnetoelectronic device and the step of depositing a conducting line, the layer of enhanced permeability dielectric material is situated adjacent the magnetoelectronic device.
    • 提供了低功率磁电子器件结构及其制造方法。 一个磁电子器件结构(100)包括编程线(104),磁耦合到编程线的磁电子器件(102)和邻近磁电子器件设置的增强的磁导率介电材料(106)。 增强的导电介电材料具有不小于约1.5的渗透性。 还提供了一种制造磁电子器件结构的方法。 该方法包括制造磁电子器件(102)并沉积导线(104)。 形成具有不小于约1.5的磁导率的增强磁导率介电材料层(106),其中在制造磁电子器件的步骤和沉积导线的步骤之后,增强磁导率介电材料层位于 磁电子器件。
    • 6. 发明申请
    • LOW POWER MAGNETOELECTRONIC DEVICE STRUCTURES UTILIZING ENHANCED PERMEABILITY MATERIALS
    • 低功率电子设备结构使用增强渗透性材料
    • US20080017939A1
    • 2008-01-24
    • US11867189
    • 2007-10-04
    • Nicholas RizzoRenu DaveJon SlaughterSrinivas Pietambaram
    • Nicholas RizzoRenu DaveJon SlaughterSrinivas Pietambaram
    • H01L29/82
    • H01L43/08H01L43/12Y10S977/838Y10S977/933
    • Low power magnetoelectronic device structures and methods for making the same are provided. One magnetoelectronic device structure (100) comprises a programming line (104), a magnetoelectronic device (102) magnetically coupled to the programming line, and an enhanced permeability dielectric material (106) disposed adjacent the magnetoelectronic device. The enhanced permeability dielectric material has a permeability no less than approximately 1.5. A method for making a magnetoelectronic device structure is also provided. The method comprises fabricating a magnetoelectronic device (102) and depositing a conducting line (104). A layer of enhanced permeability dielectric material (106) having a permeability no less than approximately 1.5 is formed, wherein after the step of fabricating a magnetoelectronic device and the step of depositing a conducting line, the layer of enhanced permeability dielectric material is situated adjacent the magnetoelectronic device.
    • 提供了低功率磁电子器件结构及其制造方法。 一个磁电子器件结构(100)包括编程线(104),磁耦合到编程线的磁电子器件(102)和邻近磁电子器件设置的增强的磁导率介电材料(106)。 增强的导电介电材料具有不小于约1.5的渗透性。 还提供了一种制造磁电子器件结构的方法。 该方法包括制造磁电子器件(102)并沉积导线(104)。 形成具有不小于约1.5的磁导率的增强磁导率介电材料层(106),其中在制造磁电子器件的步骤和沉积导线的步骤之后,增强磁导率介电材料层位于 磁电子器件。
    • 8. 发明申请
    • Magnetic tunnel junction element structures and methods for fabricating the same
    • 磁隧道结元件结构及其制造方法
    • US20060017081A1
    • 2006-01-26
    • US10899610
    • 2004-07-26
    • JiJun SunRenu DaveJon SlaughterJohan Akerman
    • JiJun SunRenu DaveJon SlaughterJohan Akerman
    • H01L29/94
    • H01L43/08B82Y25/00B82Y40/00H01F10/132H01F10/3254H01F10/3272H01F41/303H01L43/12
    • Magnetic tunnel junction (“MTJ”) element structures and methods for fabricating MTJ element structures are provided. An MTJ element structure may comprise a crystalline pinned layer, an amorphous fixed layer, and a coupling layer disposed between the crystalline pinned layer and the amorphous fixed layer. The amorphous fixed layer is antiferromagnetically coupled to the crystalline pinned layer. The MTJ element further comprises a free layer and a tunnel barrier layer disposed between the amorphous fixed layer and the free layer. Another MTJ element structure may comprise a pinned layer, a fixed layer and a non-magnetic coupling layer disposed therebetween. A tunnel barrier layer is disposed between the fixed layer and a free layer. An interface layer is disposed adjacent the tunnel barrier layer and a layer of amorphous material. The first interface layer comprises a material having a spin polarization that is higher than that of the amorphous material.
    • 提供磁隧道结(“MTJ”)元件结构和制造MTJ元件结构的方法。 MTJ元件结构可以包括结晶钉扎层,非晶固定层和设置在结晶钉扎层和非晶固定层之间的耦合层。 非晶固定层与结晶钉扎层反铁磁耦合。 MTJ元件还包括设置在非晶固定层和自由层之间的自由层和隧道势垒层。 另一MTJ元件结构可以包括被钉扎层,固定层和设置在它们之间的非磁性耦合层。 隧道势垒层设置在固定层和自由层之间。 界面层邻近隧道势垒层和非晶材料层设置。 第一界面层包括具有比无定形材料高的自旋极化的材料。
    • 9. 发明申请
    • ENHANCED PERMEABILITY DEVICE STRUCTURES AND METHOD
    • 增强渗透性设备结构和方法
    • US20070284683A1
    • 2007-12-13
    • US11740066
    • 2007-04-25
    • Srinivas PietambaramNicholas RizzoJon Slaughter
    • Srinivas PietambaramNicholas RizzoJon Slaughter
    • H01L43/08H01L43/12
    • H01L43/08H01L43/12Y10S977/838Y10S977/933
    • Low power magnetoelectronic device structures and methods therefore are provided. The magnetoelectronic device structure (100, 150, 450, 451) comprises a programming line (104, 154, 156, 454, 456), a magnetoelectronic device (102, 152, 452) magnetically coupled to the programming line (104, 154, 156, 454, 456), and an enhanced permeability dielectric (EPD) material (106, 108, 110, 158, 160, 162, 458, 460, 462) disposed adjacent the magnetoelectronic device. The EPD material (106, 108, 110, 158, 160, 162, 458, 460, 462) comprises multiple composite layers (408) of magnetic nano-particles (406) embedded in a dielectric matrix (409). The composition of the composite layers is chosen to provide a predetermined permeability profile. A method for making a magnetoelectronic device structure is also provided. The method comprises fabricating the magnetoelectronic device (102, 152, 452) and depositing the programming line (104, 154, 156, 454, 456). The EPD material (106, 108, 110, 158, 160, 162, 458, 460, 462) comprising the multiple composite layers (408) is formed around the magnetoelectronic device (102, 152, 452) and/or between the device (102, 152, 452) and the programming line (104, 154, 156, 454, 456). The presence of the EPD structure (470, 480, 490) in proximity to the programming line (104, 154, 156, 454, 456) and/or the magnetoelectronic device (102, 152, 452) reduces the required programming current.
    • 因此提供了低功率磁电子器件结构和方法。 磁电子器件结构(100,150,450,451)包括编程线(104,154,156,454,456),磁耦合到编程线(104,154,452)的磁电子器件(102,152,452) 156,454,456)以及邻近磁电子器件设置的增强磁导率电介质(EPD)材料(106,108,110,158,160,162,458,460,462)。 EPD材料(106,108,110,158,160,162,458,460,462)包括嵌入电介质矩阵(409)中的磁性纳米颗粒(406)的多个复合层(408)。 选择复合层的组成以提供预定的渗透率分布。 还提供了一种制造磁电子器件结构的方法。 该方法包括制造磁电子器件(102,152,452)并沉积编程线(104,154,156,454,456)。 包括多个复合层(408)的EPD材料(106,108,110,158,160,162,458,460,462)形成在磁电子器件(102,152,452)周围和/或在器件( 102,152,452)和编程线(104,154,156,454,465)。 靠近编程线(104,154,156,454,465)和/或磁电子器件(102,152,452)的EPD结构(470,480,490)的存在减少了所需的编程电流。