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    • 1. 发明申请
    • Magnetic tunnel junction element structures and methods for fabricating the same
    • 磁隧道结元件结构及其制造方法
    • US20060017081A1
    • 2006-01-26
    • US10899610
    • 2004-07-26
    • JiJun SunRenu DaveJon SlaughterJohan Akerman
    • JiJun SunRenu DaveJon SlaughterJohan Akerman
    • H01L29/94
    • H01L43/08B82Y25/00B82Y40/00H01F10/132H01F10/3254H01F10/3272H01F41/303H01L43/12
    • Magnetic tunnel junction (“MTJ”) element structures and methods for fabricating MTJ element structures are provided. An MTJ element structure may comprise a crystalline pinned layer, an amorphous fixed layer, and a coupling layer disposed between the crystalline pinned layer and the amorphous fixed layer. The amorphous fixed layer is antiferromagnetically coupled to the crystalline pinned layer. The MTJ element further comprises a free layer and a tunnel barrier layer disposed between the amorphous fixed layer and the free layer. Another MTJ element structure may comprise a pinned layer, a fixed layer and a non-magnetic coupling layer disposed therebetween. A tunnel barrier layer is disposed between the fixed layer and a free layer. An interface layer is disposed adjacent the tunnel barrier layer and a layer of amorphous material. The first interface layer comprises a material having a spin polarization that is higher than that of the amorphous material.
    • 提供磁隧道结(“MTJ”)元件结构和制造MTJ元件结构的方法。 MTJ元件结构可以包括结晶钉扎层,非晶固定层和设置在结晶钉扎层和非晶固定层之间的耦合层。 非晶固定层与结晶钉扎层反铁磁耦合。 MTJ元件还包括设置在非晶固定层和自由层之间的自由层和隧道势垒层。 另一MTJ元件结构可以包括被钉扎层,固定层和设置在它们之间的非磁性耦合层。 隧道势垒层设置在固定层和自由层之间。 界面层邻近隧道势垒层和非晶材料层设置。 第一界面层包括具有比无定形材料高的自旋极化的材料。
    • 5. 发明申请
    • LOW POWER MAGNETOELECTRONIC DEVICE STRUCTURES UTILIZING ENHANCED PERMEABILITY MATERIALS
    • 低功率电子设备结构使用增强渗透性材料
    • US20080017939A1
    • 2008-01-24
    • US11867189
    • 2007-10-04
    • Nicholas RizzoRenu DaveJon SlaughterSrinivas Pietambaram
    • Nicholas RizzoRenu DaveJon SlaughterSrinivas Pietambaram
    • H01L29/82
    • H01L43/08H01L43/12Y10S977/838Y10S977/933
    • Low power magnetoelectronic device structures and methods for making the same are provided. One magnetoelectronic device structure (100) comprises a programming line (104), a magnetoelectronic device (102) magnetically coupled to the programming line, and an enhanced permeability dielectric material (106) disposed adjacent the magnetoelectronic device. The enhanced permeability dielectric material has a permeability no less than approximately 1.5. A method for making a magnetoelectronic device structure is also provided. The method comprises fabricating a magnetoelectronic device (102) and depositing a conducting line (104). A layer of enhanced permeability dielectric material (106) having a permeability no less than approximately 1.5 is formed, wherein after the step of fabricating a magnetoelectronic device and the step of depositing a conducting line, the layer of enhanced permeability dielectric material is situated adjacent the magnetoelectronic device.
    • 提供了低功率磁电子器件结构及其制造方法。 一个磁电子器件结构(100)包括编程线(104),磁耦合到编程线的磁电子器件(102)和邻近磁电子器件设置的增强的磁导率介电材料(106)。 增强的导电介电材料具有不小于约1.5的渗透性。 还提供了一种制造磁电子器件结构的方法。 该方法包括制造磁电子器件(102)并沉积导线(104)。 形成具有不小于约1.5的磁导率的增强磁导率介电材料层(106),其中在制造磁电子器件的步骤和沉积导线的步骤之后,增强磁导率介电材料层位于 磁电子器件。
    • 6. 发明申请
    • Low power magnetoelectronic device structures utilizing enhanced permeability materials
    • 利用增强的渗透性材料的低功率磁电子器件结构
    • US20060186495A1
    • 2006-08-24
    • US11066884
    • 2005-02-24
    • Nicholas RizzoRenu DaveJon SlaughterSrinivas Pietambaram
    • Nicholas RizzoRenu DaveJon SlaughterSrinivas Pietambaram
    • H01L43/00
    • H01L43/08H01L43/12Y10S977/838Y10S977/933
    • Low power magnetoelectronic device structures and methods for making the same are provided. One magnetoelectronic device structure (100) comprises a programming line (104), a magnetoelectronic device (102) magnetically coupled to the programming line, and an enhanced permeability dielectric material (106) disposed adjacent the magnetoelectronic device. The enhanced permeability dielectric material has a permeability no less than approximately 1.5. A method for making a magnetoelectronic device structure is also provided. The method comprises fabricating a magnetoelectronic device (102) and depositing a conducting line (104). A layer of enhanced permeability dielectric material (106) having a permeability no less than approximately 1.5 is formed, wherein after the step of fabricating a magnetoelectronic device and the step of depositing a conducting line, the layer of enhanced permeability dielectric material is situated adjacent the magnetoelectronic device.
    • 提供了低功率磁电子器件结构及其制造方法。 一个磁电子器件结构(100)包括编程线(104),磁耦合到编程线的磁电子器件(102)和邻近磁电子器件设置的增强的磁导率介电材料(106)。 增强的导电介电材料具有不小于约1.5的渗透性。 还提供了一种制造磁电子器件结构的方法。 该方法包括制造磁电子器件(102)并沉积导线(104)。 形成具有不小于约1.5的磁导率的增强磁导率介电材料层(106),其中在制造磁电子器件的步骤和沉积导线的步骤之后,增强磁导率介电材料层位于 磁电子器件。