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1. 发明授权

US06572748B1 Reference electrode 失效
标题翻译：参考电极
公开(公告)号：US06572748B1
公开(公告)日：2003-06-03
申请号：US09623839
申请日：2001-11-26
申请人： Sigrun Herrmann , Heiner Kaden , Wolfram Oelssner , Günter Igel
发明人： Sigrun Herrmann , Heiner Kaden , Wolfram Oelssner , Günter Igel
IPC分类号： G01N2726
CPC分类号： G01N27/301
摘要： A reference electrode (1) for electrochemical measurements includes a metallic palladium-containing electrode component (3) which is covered by a layer (4) formed of or containing a palladium compound poorly soluble in aqueous media. Positioned on layer (4) is a reference electrolyte (5) which contains anions of this palladium compound in dissolved form (FIG. 4).
摘要翻译：用于电化学测量的参比电极（1）包括由不溶于水性介质的钯化合物形成或含有钯化合物的层（4）覆盖的金属含钯电极组分（3）。位于层（4）上的是参考电解质（5），其含有溶解形式的该钯化合物的阴离子（图4）。

2. 发明授权

US06964927B2 Method and production of a sensor 失效
标题翻译：传感器的方法和生产
公开(公告)号：US06964927B2
公开(公告)日：2005-11-15
申请号：US10149560
申请日：2001-12-07
申请人： Günter Igel , Markus Rogalla
发明人： Günter Igel , Markus Rogalla
IPC分类号： H01L21/56 , H01L31/0203 , H01L31/0232 , H01L21/302
CPC分类号： H01L31/0203 , H01L21/565 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to a method for producing a sensor (1), wherein a carrier chip (2) is produced. Said chip is provided with a sensor structure (3) comprising an active sensor surface (4). A material (9) capable of flowing is applied onto carrier chips (2) in such a way that the sensor structure (3) has a thinner layer thickness on said active sensor surface (4) than on the area of the carrier chip (2) which borders on the active sensor surface (4). The material (9) which is capable of flowing is hardened thereafter. The hardened material (9) is subsequently removed by chemical means from the surface which faces said carrier chip (2) until the active sensor surface of the sensor structure is layed bare.
摘要翻译：本发明涉及一种制造传感器（1）的方法，其中制造了载体芯片（2）。所述芯片设置有包括有源传感器表面（4）的传感器结构（3）。将能够流动的材料（9）施加到载体芯片（2）上，使得传感器结构（3）在所述主动传感器表面（4）上具有比载体芯片（2）的区域更薄的层厚度），其接合在主动传感器表面（4）上。能够流动的材料（9）之后被硬化。随后通过化学方法从面向所述载体芯片（2）的表面去除硬化材料（9），直到传感器结构的有源传感器表面裸露。

3. 发明授权

US06191489B1 Micromechanical layer stack arrangement particularly for flip chip or similar connections 有权
标题翻译：微机械层堆叠布置，特别适用于倒装芯片或类似连接
公开(公告)号：US06191489B1
公开(公告)日：2001-02-20
申请号：US09506634
申请日：2000-02-18
申请人： Günter Igel , Hans-Jürgen Gahle , Mirko Lehmann
发明人： Günter Igel , Hans-Jürgen Gahle , Mirko Lehmann
IPC分类号： H01L2348
CPC分类号： H01L24/12 , H01L23/3192 , H01L24/11 , H01L2224/13018 , H01L2224/13022 , H01L2224/13099 , H01L2224/13144 , H01L2224/13147 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19043 , H01L2924/351 , H01L2924/00
摘要： A process is provided for manufacturing a layer arrangement (1) having a bump for a flip chip or similar connection. The layer arrangement has a plurality of layers (2, 3, 4, 5, 6, 7, 11) made of solid material and stacked into a layer stack (8). A recess (10) that extends over several layers (2, 3, 4, 5, 6, 7, 11) is made in the layer stack (8) transverse to the coating planes of the layers (2, 3, 4, 5, 6, 7, 11). A bump material (14) is placed in the recess (10). A profiling is created on the lateral boundary wall of the recess (10) by removal of layer material of different layers (2, 3, 4, 5, 6, 7, 11) of the layer stack (8). The profiling, starting from the surface (9) of the layer stack (8) and progressing in layers to the inside of the recess (10), has at least two indentations (12) and at least one projection (13) located between them. After the production of the profiling, a bump material (14) is brought into the recess (10) in such a way that it grasps behind the indentations (12).
摘要翻译：提供了一种用于制造具有用于倒装芯片或类似连接的凸块的层布置（1）的工艺。层布置具有由固体材料制成并堆叠成层堆叠（8）的多个层（2,3,4,5,6,7,11）。在层叠体（8）中横跨多层（2,3,4,5,6,7,11）的层（2,3,4,5,11）的涂层平面（2,3,4,5），6,7,11）。凸起材料（14）放置在凹部（10）中。通过去除层叠（8）的不同层（2,3,4,5,6,7,11）的层材料，在凹槽（10）的侧边界壁上形成轮廓。从层叠体（8）的表面（9）开始并且分层进入凹部（10）的内部的成型具有至少两个凹口（12）和位于它们之间的至少一个突起（13）。在生产轮廓之后，将凸块材料（14）以这样一种方式被带到凹槽（10）中，使得它抓住压痕（12）的后面。

4. 发明授权

US06656678B1 Method for examination of a surface layer 失效
标题翻译：表层检查方法
公开(公告)号：US06656678B1
公开(公告)日：2003-12-02
申请号：US09585146
申请日：2000-06-01
申请人： Bernhard Wolf , Hans-Jürgen Gahle , Günter Igel , Werner Baumann , Ralf Ehret , Mirko Lehmann
发明人： Bernhard Wolf , Hans-Jürgen Gahle , Günter Igel , Werner Baumann , Ralf Ehret , Mirko Lehmann
IPC分类号： C12Q100
CPC分类号： H01L22/24 , G01B11/30 , G01N21/94
摘要： In a method for examination of the surface of an object for a topographic and/or a chemical property, the object-surface is impinged with surface-structure selective biocomponents for examination of a topographic property and/or with chemoselective biocomponents for the examination of a chemical property, together with a nutrient medium and/or an osmotic protective medium for the biocomponents. The biocomponents contained in the nutrient medium and/or the osmotic protective medium are in contact with the object-surface or are spaced from the object surface by less than the detection range of the biocomponents. The object surface is then examined with the biocomponents contained in the nutrient medium and/or the osmotic protective medium by determining at least one examination measurement value. The examination measurement value is compared with a reference measurement value, and conclusions can be drawn about the topographic and/or chemical properties of the object from the result of the comparison. Using the method, an object surface can be examined for a topographic and/or chemical property in a simple manner with a high measuring sensitivity.
摘要翻译：在用于检查地形和/或化学性质的物体的表面的方法中，物体表面与表面结构选择性生物组分碰撞以检查地形性质和/或化学选择性生物成分用于检查化学性质，以及生物组分的营养培养基和/或渗透保护介质。包含在营养培养基和/或渗透保护介质中的生物成分与物体表面接触或与物体表面间隔小于生物成分的检测范围。然后通过确定至少一个检查测量值用包含在营养培养基和/或渗透保护介质中的生物组分检查物体表面。将检查测量值与参考测量值进行比较，并从比较结果中得出关于物体的地形和/或化学性质的结论。使用该方法，可以以高测量灵敏度的简单方式检查物体表面的地形和/或化学特性。

5. 发明授权

US06471838B1 Measuring device and process for its manufacture 失效
标题翻译：测量装置及其制造工艺
公开(公告)号：US06471838B1
公开(公告)日：2002-10-29
申请号：US09506646
申请日：2000-02-18
申请人： Günter Igel , Hans-Jürgen Gahle , Mirko Lehmann
发明人： Günter Igel , Hans-Jürgen Gahle , Mirko Lehmann
IPC分类号： G01N27327
CPC分类号： G01N27/226 , G01N21/03 , G01N27/07
摘要： A measuring device (1), for examining a medium (2) that is liquid or free-flowing, has at least two electrically and/or optically conducting layers or layer areas (5a, 5b, 5c, 6a, 6b, 7a, 7b) located on a substrate layer (3), wherein these layers or layer areas are electrically and/or optically insulated from each other. At least one of these layers or layer areas (5a, 5b, 5c, 6a, 6b, 7a, 7b) is part of a layer stack (4), which has several layers arranged on top of each other on the substrate layer (3). The layer stack has, on its side facing away from the substrate layer (3), a recess that adjoins the electrically and/or optically conducting layers or layer areas (5a, 5b, 6a, 6b, 7a, 7b). At least one electrically and/or optically conducting layer or layer area (5a, 5b, 6a, 6b, 7a, 7b) located in the layer stack (4) is spaced at a distance from the bottom (11) of the recess (10).
摘要翻译：用于检查液体或自由流动的介质（2）的测量装置（1）具有至少两个电和/或光导电层或层区（5a，5b，5c，6a，6b，7a，7b）），其中这些层或层区域彼此电隔离和/或光学绝缘。这些层或层区域（5a，5b，5c，6a，6b，7a，7b）中的至少一个是层叠体（4）的一部分，其在基底层（3）上彼此顶部布置有多个层）。层叠体在其背离衬底层（3）的一侧具有邻接电和/或光传导层或层区（5a，5b，6a，6b，7a，7b）的凹部。位于层叠体（4）中的至少一个电和/或光传导层或层区（5a，5b，6a，6b，7a，7b）与凹部（10）的底部（11））。

6. 发明授权

US06294218B1 Process for coating a substrate 有权
标题翻译：涂覆基材的方法
公开(公告)号：US06294218B1
公开(公告)日：2001-09-25
申请号：US09339898
申请日：1999-06-25
申请人： Günter Igel , Joachim Krumrey
发明人： Günter Igel , Joachim Krumrey
IPC分类号： B05D500
CPC分类号： C23C14/5806 , C23C14/024 , C23C14/588
摘要： In a process for coating a substrate, a texture (4) is created in a portion of its surface. A first layer (5) to be applied on the surface of the substrate adheres better to the texture (4) than it does to a surface area located outside of the texture (4). Then, the layer (5) is applied to the surface of the substrate and after that, areas of the layer projecting laterally beyond the texture (4) are mechanically removed. The material of the texture (4) contains at least one chemical element or a compound, which the layer (5) does not have or has only in a smaller concentration than the material of the texture (4). On the first layer (5), at least one second layer (7) is then applied which does not have the chemical element or compound contained in the material of the texture (4), or it has it only in a smaller concentration than the material of the texture (4). The process makes it possible to apply to a substrate a textured layer, which has surface properties that remain for the most part unchanged when it is heated.
摘要翻译：在用于涂覆基材的方法中，在其表面的一部分中形成纹理（4）。施加在基材表面上的第一层（5）比纹理（4）外表面区域更好地粘贴到纹理（4）上。然后，将层（5）施加到基板的表面，之后，横向超过纹理（4）的层的区域被机械地去除。纹理（4）的材料含有至少一种化学元素或化合物，其中层（5）不具有或仅具有比纹理（4）的材料更小的浓度。在第一层（5）上，然后施加至少一个第二层（7），其不具有包含在纹理（4）的材料中的化学元素或化合物，或者仅具有比材质材质（4）。该方法使得可以向基底施加纹理层，其具有在加热时大部分保持不变的表面性质。

7. 发明授权

US06642126B2 Process for manufacturing a semiconductor wafer with passivation layer mask for etching with mechanical removal 失效
标题翻译：制造具有钝化层掩模的半导体晶片的方法，用于机械去除蚀刻
公开(公告)号：US06642126B2
公开(公告)日：2003-11-04
申请号：US09745090
申请日：2000-12-21
申请人： Günter Igel
发明人： Günter Igel
IPC分类号： H01L21301
CPC分类号： B81C1/00904 , B81C1/00896 , B81C2201/053 , H01L21/78 , H01L23/3171 , H01L2924/0002 , Y10S438/928 , H01L2924/00
摘要： A process for manufacturing a semiconductor arrangement (3), whereby in particular a wafer (1) with a large number of semiconductor arrangements forming chips (7) is manufactured, and the wafer is divided afterward, and in this way the semiconductor arrangements are separated. At least one region of a wafer side is covered by a passivation layer (9) during the etching of the remaining wafer area. After etching, the passivation layer (9) is removed. At least in an outer edge region of the wafer, if need be additionally in the shape of the wafer front side, outside the active chip surface and especially in the regions bounding the respective chip systems, adhesion zones (8) for the passivation layer (9) are created which enter into a sealing, and in particular a chemical combination with the material used for the passivation layer. Outside the adhesion zones, a diminished ability to adhere is present, so that the passivation layer (9), for example following the reverse side etching in the area lying outside the adhesion zones (8), can be removed from the wafer surface mechanically by one of a liquid stream, a gas stream, and by being acted upon by ultrasound.
摘要翻译：制造半导体装置（3）的方法，特别是制造具有形成芯片（7）的大量半导体装置的晶片（1），并且之后分割晶片，并且以这种方式分离半导体装置。在蚀刻剩余晶片区域期间，晶片侧的至少一个区域被钝化层（9）覆盖。蚀刻后，去除钝化层（9）。至少在晶片的外边缘区域中，如果需要另外形成晶片正面的形状，则在有源芯片表面之外，特别是在限定各个芯片系统的区域中，用于钝化层的粘合区域（8） 9）被形成，其进入密封，特别是与用于钝化层的材料的化学组合。在粘附区域之外，存在粘附能力降低，使得例如在位于粘附区域（8）之外的区域中的反向蚀刻之后的钝化层（9）可以通过机械地从晶片表面去除液体流，气流中的一种，并通过超声波作用。

8. 发明授权

US06368851B1 Method and apparatus for measuring a state variable 有权
标题翻译：用于测量状态变量的方法和装置
公开(公告)号：US06368851B1
公开(公告)日：2002-04-09
申请号：US09321458
申请日：1999-05-27
申请人： Werner Baumann , Ralf Ehret , Mirko Lehmann , Günter Igel , Hans-Jürgen Gahle , Bernhard Wolf , Ulrich Sieben , Ingo Freund , Martin Brischwein
发明人： Werner Baumann , Ralf Ehret , Mirko Lehmann , Günter Igel , Hans-Jürgen Gahle , Bernhard Wolf , Ulrich Sieben , Ingo Freund , Martin Brischwein
IPC分类号： C12M142
CPC分类号： C12N15/89 , C12M35/02 , C12M35/04 , C12M35/08 , C12N13/00
摘要： A method is provided for measuring a state variable of a biological cell (3) located in a nutrient medium (2) and supported on and adhering to a support area (5). Within the support area (5) for the cell (3) and at a distance from the support area edge, an opening is made in the membrane of the cell (3). The edge of the cell membrane that surrounds the opening and adheres to the support area (5) seals off the liquid found inside the cell (3) from the nutrient medium (2). Through the opening the state variable (2) is measured. An apparatus for performing the method is also provided.
摘要翻译：提供了一种用于测量位于营养介质（2）中并被支撑并附着到支撑区域（5）上的生物体（3）的状态变量的方法。在电池（3）的支撑区域（5）内并且距离支撑区域边缘一定距离处，在电池（3）的膜中形成开口。围绕开口并附着到支撑区域（5）的细胞膜的边缘将从细胞（3）内发现的液体与营养培养基（2）密封。通过打开状态变量（2）进行测量。还提供了一种用于执行该方法的装置。

9. 发明授权

US06346675B1 Coupling and method for its manufacture 失效
标题翻译：联轴器及其制造方法
公开(公告)号：US06346675B1
公开(公告)日：2002-02-12
申请号：US09506635
申请日：2000-02-18
申请人： Günter Igel , Hans-Jürgen Gahle , Mirko Lehmann
发明人： Günter Igel , Hans-Jürgen Gahle , Mirko Lehmann
IPC分类号： H02G318
CPC分类号： F16B21/088 , Y10T16/05
摘要： A coupling (1) has a coupling receiver (2) and a coupling counterpart (3) connectable with it, which in the coupling position is held in a receiver depression (6) of the coupling receiver. The receiver depression (6) is arranged in a layer stack (4) with at least two layers (5a, 5b, 5c, 5d, 5e). Proceeding from the flat surface of the layer stack (4) bordering upon the recess depression (6) to the interior of the receiver depression (6), the lateral boundary wall of the recess depression (6) has at least one cutback, which is formed by a receding layer (5a, 5c) or a receding layer area. The coupling counterpart (3) has at least one lateral guide and/or locking projection (9a, 9b), which engages into a cutback (8a, 8b) of the component (2) in the coupling position.
摘要翻译：耦合器（1）具有耦合接收器（2）和可与其连接的耦合对应器（3），其在耦合位置被保持在耦合接收器的接收器凹部（6）中。接收器凹部（6）布置在具有至少两层（5a，5b，5c，5d，5e）的层叠体（4）中。从凹陷（6）与接收器凹部（6）的内部接合的层叠体（4）的平坦表面开始，凹陷凹部（6）的侧边界壁具有至少一个切口由后退层（5a，5c）或后退层区域形成。耦合对应物（3）具有至少一个横向引导和/或锁定突起（9a，9b），其在联接位置处接合到部件（2）的切口（8a，8b）中。

10. 发明授权

US07720265B2 Fingerprint recognition module having a thin-film structure and comprising resistive, temperature-sensitive elements 有权
标题翻译：指纹识别模块具有薄膜结构并且包括电阻性温度敏感元件
公开(公告)号：US07720265B2
公开(公告)日：2010-05-18
申请号：US10513331
申请日：2003-05-15
申请人： Burkhard Büstgens , Gerald Urban , Joachim Aurich , Günter Igel
发明人： Burkhard Büstgens , Gerald Urban , Joachim Aurich , Günter Igel
IPC分类号： G06K9/00
CPC分类号： G06K9/0002
摘要： The invention relates to a fingerprint recognition module comprising a substrate consisting of a material that is electrically insulating at least on its upper side and at least partially thermally insulating. Said substrate receives a composite of structured thin films on its surface, which directly forms a measuring field on the surface of the substrate for measuring a fingerprint. Said composite consists of an array of resistive, temperature-dependent elements, and contains strip conductors which connect the resistive, temperature-dependent elements to at least one connection field located on the substrate, outside the measuring field, and form part of the composite of structured thin films. The substrate also contains at least one microelectronic switching circuit which is electrically connected to the at least one connection field and contains the switching circuits by which means the thin film structures are controlled in order to heat the resistive, temperature-sensitive elements, the resistive, temperature-sensitive elements are read out, and the data is retransmitted.
摘要翻译：本发明涉及一种指纹识别模块，其包括由至少在其上侧电绝缘且至少部分热绝缘的材料构成的基板。所述衬底在其表面上接收结构化薄膜的复合物，其在衬底的表面上直接形成测量场，用于测量指纹。所述复合材料由电阻温度依赖元件阵列组成，并且包含带状导体，其将电阻性温度依赖元件连接到位于测量场外部的至少一个位于基板上的连接场，并形成部分复合材料结构薄膜。衬底还包含至少一个微电子开关电路，其电连接到至少一个连接场，并且包含切换电路，通过该开关电路来控制薄膜结构，以便加热电阻式温度敏感元件，电阻式，读出温度敏感元件，重发数据。

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