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1. 发明授权

US06193485B1 Seal structure for casing 失效
标题翻译：套管密封结构
公开(公告)号：US06193485B1
公开(公告)日：2001-02-27
申请号：US09242668
申请日：1999-02-22
申请人： Shusaku Ueda , Takeshi Inoue , Kenichi Hashimoto , Kazutaka Hori
发明人： Shusaku Ueda , Takeshi Inoue , Kenichi Hashimoto , Kazutaka Hori
IPC分类号： F01C104
CPC分类号： F04C18/0215 , F04B39/121 , F04C23/008 , F04C2230/231 , F04C2230/60 , F04C2240/30 , F04C2240/603 , Y10S417/902
摘要： An upper casing is outer-fitted to a lower casing. A concave portion for receiving a peripheral portion of a housing is provided at an inner wall of the upper casing. A convex portion for suppressing deformation of the housing caused by deformation when the upper casing is shrinkage-fitted or pressed-fitted is selectively formed at the bottom of the concave portion. A gap is provided between the lower casing and the housing for alleviating the degree of press on the housing by the casing when the upper casing and the lower casing are welded.
摘要翻译：上壳体外嵌于下壳体。在上壳体的内壁设置有用于容纳壳体的周边部分的凹部。在凹部的底部选择性地形成用于抑制上壳体收缩配合时由变形引起的壳体变形的凸部。在下壳体和壳体之间设置有间隙，用于当焊接上壳体和下壳体时，通过壳体减轻壳体上的按压程度。

2. 发明授权

US08889438B2 Peeling apparatus and manufacturing apparatus of semiconductor device 有权
标题翻译：半导体装置的剥离装置及制造装置
公开(公告)号：US08889438B2
公开(公告)日：2014-11-18
申请号：US13406603
申请日：2012-02-28
申请人： Shingo Eguchi , Yohei Monma , Atsuhiro Tani , Misako Hirosue , Kenichi Hashimoto , Yasuharu Hosaka
发明人： Shingo Eguchi , Yohei Monma , Atsuhiro Tani , Misako Hirosue , Kenichi Hashimoto , Yasuharu Hosaka
IPC分类号： H01L21/58 , B32B43/00 , H01L21/683 , H01L21/67 , H01L27/12
CPC分类号： H01L27/1266 , B32B43/006 , G02F1/1303 , G02F1/13306 , G06K19/0772 , H01L21/67132 , H01L21/6835 , H01L27/1214 , H01L27/1218 , H01L27/156 , H01L31/1892 , H01L31/206 , H01L33/005 , H01L51/003 , H01L51/0097 , H01L2221/68318 , H01L2221/6835 , H01L2221/68363 , H01L2221/68386 , H01L2221/68395 , H01L2227/326 , H01L2251/5338 , H01L2924/19041 , H01L2924/30105 , Y10T29/41
摘要： To eliminate electric discharge when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the semiconductor element, a substrate over which an element formation layer and a peeling layer are formed and a film are made to go through a gap between pressurization rollers. The film is attached to the element formation layer between the pressurization rollers, bent along a curved surface of the pressurization roller on a side of the pressurization rollers, and collected. Peeling is generated between the element formation layer and the peeling layer and the element formation layer is transferred to the film. Liquid is sequentially supplied by a nozzle to a gap between the element formation layer and the peeling layer, which is generated by peeling, so that electric charge generated on surfaces of the element formation layer and the peeling layer is diffused by the liquid.
摘要翻译：为了在从用于制造半导体元件的基板剥离包含半导体元件的元件形成层而被除去形成有元件形成层和剥离层的基板和薄膜之间的间隙中时，为了消除放电，加压辊。该膜附着在加压辊之间的元件形成层上，加压辊的一侧的加压辊的弯曲表面沿加压辊的弯曲表面弯曲并收集。在元件形成层和剥离层之间产生剥离，并且元件形成层被转印到膜上。通过喷嘴将液体顺序地供给到通过剥离产生的元件形成层和剥离层之间的间隙，使得在元件形成层和剥离层的表面上产生的电荷被液体扩散。

3. 发明授权

US08048770B2 Method for manufacturing semiconductor device 有权
公开(公告)号：US08048770B2
公开(公告)日：2011-11-01
申请号：US12232036
申请日：2008-09-10
申请人： Shingo Eguchi , Yohei Monma , Atsuhiro Tani , Misako Hirosue , Kenichi Hashimoto , Yasuharu Hosaka
发明人： Shingo Eguchi , Yohei Monma , Atsuhiro Tani , Misako Hirosue , Kenichi Hashimoto , Yasuharu Hosaka
IPC分类号： H01L21/30 , H01L21/46 , H01L21/322 , H01L21/20 , H01L21/36 , H01G9/20
CPC分类号： H01L21/67132 , H01L21/02244 , H01L21/02252 , H01L21/67092 , H01L21/707 , H01L27/1266
摘要： An object is to suppress discharge due to static electricity generated by peeling, when an element formation layer including a semiconductor element is peeled from a substrate. Over the substrate, the release layer and the element formation layer are formed. The support base material which can be peeled later is fixed to the upper surface of the element formation layer. The element formation layer is transformed through the support base material, and peeling is generated at an interface between the element formation layer and the release layer. Peeling is performed while the liquid is being supplied so that the element formation layer and the release layer which appear sequentially by peeling are wetted with the liquid such as pure water. Electric charge generated on the surfaces of the element formation layer and the release layer can be diffused by the liquid, and discharge by peeling electrification can be eliminated.

4. 发明申请

US20090017567A1 Method for manufacturing semiconductor device 有权
公开(公告)号：US20090017567A1
公开(公告)日：2009-01-15
申请号：US12232036
申请日：2008-09-10
申请人： Shingo Eguchi , Yohei Monma , Atsuhiro Tani , Misako Hirosue , Kenichi Hashimoto , Yasuharu Hosaka
发明人： Shingo Eguchi , Yohei Monma , Atsuhiro Tani , Misako Hirosue , Kenichi Hashimoto , Yasuharu Hosaka
IPC分类号： H01L21/50
CPC分类号： H01L21/67132 , H01L21/02244 , H01L21/02252 , H01L21/67092 , H01L21/707 , H01L27/1266
摘要： An object is to suppress discharge due to static electricity generated by peeling, when an element formation layer including a semiconductor element is peeled from a substrate. Over the substrate, the release layer and the element formation layer are formed. The support base material which can be peeled later is fixed to the upper surface of the element formation layer. The element formation layer is transformed through the support base material, and peeling is generated at an interface between the element formation layer and the release layer. Peeling is performed while the liquid is being supplied so that the element formation layer and the release layer which appear sequentially by peeling are wetted with the liquid such as pure water. Electric charge generated on the surfaces of the element formation layer and the release layer can be diffused by the liquid, and discharge by peeling electrification can be eliminated.

5. 发明申请

US20080005541A1 INFORMATION-PROCESSING APPARATUS AND ACTIVATION METHOD AND PROGRAM THEREOF 有权
标题翻译：信息处理装置及其启动方法及程序
公开(公告)号：US20080005541A1
公开(公告)日：2008-01-03
申请号：US11753100
申请日：2007-05-24
申请人： Tatsuo Hase , Kenichi Hashimoto
发明人： Tatsuo Hase , Kenichi Hashimoto
IPC分类号： G06F9/44
CPC分类号： G06F9/4418
摘要： Disclosed herein is an information-processing apparatus including: a computer; an execution-state holding unit configured to hold an execution state of a program executed by the computer; an execution-state saving unit configured to save a particular execution state in effect upon execution of the program at a predetermined execution point; a transfer-history holding unit configured to hold a history of how the particular execution state saved in the execution-state saving unit has been transferred to the execution-state holding unit; an access detection unit configured to detect whether the computer has accessed the execution state held in the execution-state holding unit; and a necessary area transfer unit configured to transfer a particular area of the execution state accessed by the computer from the execution-state saving unit to the execution-state holding unit if, by referencing the transfer history upon detection of the access, the accessed particular area is found yet to be transferred from the execution-state saving unit to the execution-state holding unit.
摘要翻译：这里公开了一种信息处理设备，包括：计算机; 执行状态保持单元，被配置为保持由所述计算机执行的程序的执行状态; 执行状态保存单元，被配置为在预定执行点执行所述程序时保存特定执行状态; 被配置为保存保存在执行状态保存单元中的特定执行状态的历史的传送历史保持单元已被传送到执行状态保持单元; 访问检测单元，被配置为检测所述计算机是否已经访问所述执行状态保持单元中保持的执行状态; 以及必要区域传送单元，其被配置为将由计算机访问的执行状态的特定区域从执行状态保存单元传送到执行状态保持单元，如果通过在检测到访问时参考传送历史，则访问的特定发现区域尚未从执行状态保存单元传送到执行状态保持单元。

6. 发明授权

US5280469A System for monitoring normality of operation of ATM cross-connecting apparatus 失效
标题翻译：监控ATM交叉连接设备运行正常的系统
公开(公告)号：US5280469A
公开(公告)日：1994-01-18
申请号：US900957
申请日：1992-06-18
申请人： Ikuo Taniguchi , Kenji Narita , Kenichi Hashimoto
发明人： Ikuo Taniguchi , Kenji Narita , Kenichi Hashimoto
IPC分类号： H04L12/26 , H04L12/56
CPC分类号： H04L43/00 , H04L12/26
摘要： A system for monitoring an ATM cross-connecting apparatus by rewriting a VPI conversion table to various values, inputting a test cell, and examining the test cell after the test cell passes through the ATM cross-connecting apparatus. Entries of a VPI conversion table are accompanied by traffic flags indicating whether or not the corresponding entry is occupied for use for user's signals. First, the traffic flags are examined. Each entry not occupied for user's signals can be freely rewritten. Each entry occupied for user's signals is not rewritten. The examination of the test cell is carried out by comparing the test cell output from the ATM cross-connecting apparatus, with a reference cell which is expected from a normal operation of the ATM cross-connecting apparatus. The virtual path identifier converted in the ATM cross-connecting apparatus and contained in the output test cell, is expected corresponding to the above rewriting operations, and is contained in the reference cell.
摘要翻译：一种用于通过将VPI转换表重写为各种值来监视ATM交叉连接装置的系统，输入测试单元，以及在测试单元通过ATM交叉连接装置之后检查测试单元。 VPI转换表的条目伴随着流量标志，指示对应的条目是否被占用用于用户的信号。首先，检查交通标志。不占用用户信号的每个条目都可以自由重写。用户信号占用的每个条目都不会被重写。通过将来自ATM交叉连接装置的测试单元输出与从ATM交叉连接装置的正常操作预期的参考单元进行比较来进行测试单元的检查。在ATM交叉连接装置中转换并包含在输出测试单元中的虚拟路径标识符预期对应于上述重写操作，并且被包含在参考单元中。

7. 发明授权

US4877994A Electroluminescent device and process for producing the same 失效
标题翻译：电致发光器件及其制造方法
公开(公告)号：US4877994A
公开(公告)日：1989-10-31
申请号：US172415
申请日：1988-03-23
申请人： Moriaki Fuyama , Katsumi Tamura , Kazuo Taguchi , Kenichi Onisawa , Akira Sato , Kenichi Hashimoto , Takahiro Nakayama , Yoshio Abe
发明人： Moriaki Fuyama , Katsumi Tamura , Kazuo Taguchi , Kenichi Onisawa , Akira Sato , Kenichi Hashimoto , Takahiro Nakayama , Yoshio Abe
IPC分类号： H05B33/10 , H05B33/12 , H05B33/14 , H05B33/22
CPC分类号： H05B33/145 , H05B33/10 , H05B33/22 , Y10S428/917
摘要： An electroluminescent device comprising an electroluminescent layer capable of emitting light under application of AC voltage, the electroluminescent layer comprising strontium sulfide as a matrix and containing at least one of halides and sulfides of cerium, europium, thulium, terbium and samarium, and having a lattice constant of not more than 6.04 .ANG. and a half-width value at the (111) face of not more than 0.21 degree has a higher brightness than an electroluminescent device having an electroluminescent layer comprising ZnS as a matrix.
摘要翻译：一种电致发光器件，包括能够在施加AC电压的情况下发光的电致发光层，所述电致发光层包含硫化锶作为基质并且含有铈，铕，ium，铽和钐的卤化物和硫化物中的至少一种，并具有晶格不大于6.04的常数和（111）面处的不大于0.21度的半值的亮度比具有包含ZnS作为基质的电致发光层的电致发光器件具有更高的亮度。

8. 发明授权

US07934872B2 Drawn cup roller bearing and method of producing drawn cup roller bearing 有权
标题翻译：拉丝杯滚子轴承和拉丝杯滚子轴承的生产方法
公开(公告)号：US07934872B2
公开(公告)日：2011-05-03
申请号：US12076412
申请日：2008-03-18
申请人： Kenichi Hashimoto
发明人： Kenichi Hashimoto
IPC分类号： F16C33/58 , F16C33/64
CPC分类号： F16C33/64 , F16C19/466 , F16C33/7809 , Y10T29/49691
摘要： A drawn cup roller bearing includes: a drawn cup outer ring that includes a cylindrical portion serving as an outer raceway surface, a first rib which is formed at one axial end portion of the cylindrical portion and is bent radially inwardly such that a step portion is formed at an intermediate portion of the first rib, and a second rib which is formed at the other axial end portion of the cylindrical portion and is radially inwardly folded back; an annular seal which is press-fitted in the step portion; and a cage which holds a plurality of rollers and is inserted into the drawn cup outer ring from the second rib to be mounted in the drawn cup outer ring in such a manner that the cage is retained against withdrawal by the step portion and the plurality of rollers is retained against withdrawal by the second rib.
摘要翻译：拉丝杯滚子轴承包括：拉拔杯外圈，其包括用作外滚道表面的圆筒部分，第一肋条，其形成在圆柱形部分的一个轴向端部处并且径向向内弯曲，使得台阶部分形成在所述第一肋的中间部分，以及第二肋，所述第二肋形成在所述圆筒部的另一个轴向端部，并且径向向内折回; 被压入所述台阶部的环形密封件; 以及保持器，其保持多个辊，并且从所述第二肋插入到所述拉拔的杯外圈中，以安装在所述拉拔的杯外圈中，使得所述保持架不被所述台阶部保持而不被所述台阶部分抽出，保持辊不被第二肋取出。

9. 发明申请

US20090017599A1 Method for manufacturing semiconductor device 有权
公开(公告)号：US20090017599A1
公开(公告)日：2009-01-15
申请号：US12232049
申请日：2008-09-10
申请人： Shingo Eguchi , Yohei Monma , Atsuhiro Tani , Misako Hirosue , Kenichi Hashimoto , Yasuharu Hosaka
发明人： Shingo Eguchi , Yohei Monma , Atsuhiro Tani , Misako Hirosue , Kenichi Hashimoto , Yasuharu Hosaka
IPC分类号： H01L21/30
CPC分类号： H01L21/67132 , H01L21/02244 , H01L21/02252 , H01L21/67092 , H01L21/707 , H01L27/1266
摘要： An object is to suppress discharge due to static electricity generated by peeling, when an element formation layer including a semiconductor element is peeled from a substrate. Over the substrate, the release layer and the element formation layer are formed. The support base material which can be peeled later is fixed to the upper surface of the element formation layer. The element formation layer is transformed through the support base material, and peeling is generated at an interface between the element formation layer and the release layer. Peeling is performed while the liquid is being supplied so that the element formation layer and the release layer which appear sequentially by peeling are wetted with the liquid such as pure water. Electric charge generated on the surfaces of the element formation layer and the release layer can be diffused by the liquid, and discharge by peeling electrification can be eliminated.

10. 发明申请

US20080302859A1 METHOD OF REFLOW SOLDERING A PRINTED CIRCUIT BOARD WHEREIN AN ELECTROCONDUCTIVE COATING MATERIAL IS USED 审中-公开
标题翻译：使用电镀涂层材料反射印刷电路板的方法
公开(公告)号：US20080302859A1
公开(公告)日：2008-12-11
申请号：US12133521
申请日：2008-06-05
申请人： Nobuo Kasagi , Kenichi Hashimoto
发明人： Nobuo Kasagi , Kenichi Hashimoto
IPC分类号： B23K1/20
CPC分类号： B23K1/008 , B23K1/20 , B23K3/0646 , H05K1/095 , H05K3/3484 , H05K3/3494 , H05K2203/086 , H05K2203/111
摘要： A reflow soldering method for use with circuit patterns and land patterns formed by an electoconductive coating material. Reflow soldering is performed in an air atmosphere within a range of 150°-190° C. and with a preheating time set within a range of 60±30 sec. Alternatively, preheating is performed in a nitrogen atmosphere.
摘要翻译：一种回流焊接方法，用于由电导体涂层材料形成的电路图案和焊盘图案。回流焊在空气气氛中在150°-190℃的范围内进行，预热时间设定在60±30秒的范围内。或者，在氮气气氛中进行预热。

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