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    • 3. 发明授权
    • Solid state imaging device using disilane
    • 使用乙硅烷的固态成像装置
    • US5574293A
    • 1996-11-12
    • US343492
    • 1994-11-22
    • Michio AraiTakashi InushimaMitsufumi CodamaKazushi SugiuraIchiro TakayamaIsamu KoboriYukio YamauchiNaoya Sakamoto
    • Michio AraiTakashi InushimaMitsufumi CodamaKazushi SugiuraIchiro TakayamaIsamu KoboriYukio YamauchiNaoya Sakamoto
    • H01L21/84H01L27/12H01L27/146H01L31/113H01L31/062
    • H01L27/14643H01L21/84H01L27/1237H01L31/1133
    • A substrate (1) has a surface covered with an insulation layer (2), on which an active layer (3') made of non-single crystal silicon through thin film technique is provided. A gate electrode layer (5') is partially provided on said active layer through a gate insulation layer (4'). Said active layer (3') is subject to injection of P-type or N-type impurities to provide an image sensor of MOS structure. Bias potential is applied to a gate electrode so that a circuit between a source and a drain is in an On state, so that input light through said substrate or said gate electrode is applied to said active layer, and electrical output depending upon said input light is obtained from said source electrode or said drain electrode. Other MOS transistors for switching element and/or shift registers for operating said image sensor are provided on said substrate (1). Said active layer (3') is obtained by crystallizing said amorphous silicon layer through a laser anneal process or a high temperature anneal process, and hydrogenation process, and the trap density of said active layer is less than 5.times.10.sup.11 /cm.sup.2. Optical response time is short, less than 500 .mu.sec, so, high speed operation ten times as high as that of a prior image sensor is possible.
    • PCT No.PCT / JP94 / 00452 Sec。 371日期:1994年11月22日 102(e)日期1994年11月22日PCT 1994年3月22日PCT公布。 WO94 / 22173 PCT出版物 日期:1994年9月29日一种衬底(1)具有被绝缘层(2)覆盖的表面,其上提供由非单晶硅通过薄膜技术制成的有源层(3')。 栅极电极层(5')通过栅极绝缘层(4')部分地设置在所述有源层上。 所述有源层(3')经受注入P型或N型杂质以提供MOS结构的图像传感器。 将偏置电位施加到栅电极,使得源极和漏极之间的电路处于导通状态,使得通过所述衬底或所述栅电极的输入光被施加到所述有源层,并且根据所述输入光输出电输出 从所述源电极或所述漏电极获得。 用于操作所述图像传感器的用于开关元件和/或移位寄存器的其它MOS晶体管设置在所述基板(1)上。 所述有源层(3')是通过激光退火工艺或高温退火工艺和氢化工艺使所述非晶硅层结晶而获得的,并且所述有源层的陷阱密度小于5×10 11 / cm 2。 光学响应时间短,小于500μs,因此可以实现高于现有图像传感器的10倍的高速度运行。
    • 6. 发明授权
    • Solid state imaging device with low trap density
    • 具有低陷阱密度的固态成像装置
    • US5591988A
    • 1997-01-07
    • US477104
    • 1995-06-07
    • Michio AraiTakashi InushimaMitsufumi CodamaKazushi SugiuraIchiro TakayamaIsamu KoboriYukio YamauchiNaoya Sakamoto
    • Michio AraiTakashi InushimaMitsufumi CodamaKazushi SugiuraIchiro TakayamaIsamu KoboriYukio YamauchiNaoya Sakamoto
    • H01L21/84H01L27/12H01L27/146H01L31/113H01L29/04H01L31/036H01L31/0376H01L31/20
    • H01L27/14643H01L21/84H01L27/1237H01L31/1133
    • A substrate (1) has a surface covered with an insulation layer (2), on which an active layer (3') made of non-single crystal silicon through thin film technique is provided. A gate electrode layer (5') is partially provided on said active layer through a gate insulation layer (4). Said active layer (3') is subject to injection of P-type or N-type impurities to provide an image sensor of MOS structure. Bias potential is applied to a gate electrode so that a circuit between a source and a drain is in an On state, so that input light through said substrate or said gate electrode is applied to said active layer, and electrical output depending upon said input light is obtained from said source electrode or said drain electrode. Other MOS transistors for switching element and/or shift registers for operating said image sensor are provided on said substrate (1). Said active layer (3') is obtained by crystallizing said amorphous silicon layer through a laser anneal process or a high temperature anneal process, and hydrogenation process, and the trap density of said active layer is less than 5.times.10.sup.11 /cm.sup.2. Optical response time is short, less than 500 .mu.sec, so, high speed operation ten times as high as that of a prior image sensor is possible.
    • 基板(1)具有被绝缘层(2)覆盖的表面,在其上提供通过薄膜技术由非单晶硅制成的有源层(3')。 栅极电极层(5')通过栅极绝缘层(4)部分地设置在所述有源层上。 所述有源层(3')经受注入P型或N型杂质以提供MOS结构的图像传感器。 将偏置电位施加到栅电极,使得源极和漏极之间的电路处于导通状态,使得通过所述衬底或所述栅电极的输入光被施加到所述有源层,并且根据所述输入光输出电输出 从所述源电极或所述漏电极获得。 用于操作所述图像传感器的用于开关元件和/或移位寄存器的其它MOS晶体管设置在所述基板(1)上。 所述有源层(3')是通过激光退火工艺或高温退火工艺和氢化工艺使所述非晶硅层结晶而获得的,并且所述有源层的陷阱密度小于5×10 11 / cm 2。 光学响应时间短,小于500μs,因此可以实现高于现有图像传感器的10倍的高速度运行。
    • 7. 发明授权
    • Method for manufacturing a semiconductor device
    • 半导体装置的制造方法
    • US5741718A
    • 1998-04-21
    • US683096
    • 1996-07-16
    • Mitsufumi CodamaIchiro TakayamaMichio Arai
    • Mitsufumi CodamaIchiro TakayamaMichio Arai
    • H01L21/77H01L21/84H01L29/786H01L21/86
    • H01L27/1214H01L29/78621Y10S148/106Y10S148/15
    • In forming a thin film transistor (TFT) having an offset structure or a lightly doped drain (LDD) structure, a blocking material having a lower etching rate than that of a material constructing a gate electrode is formed. By using the blocking material as a mask, a gate electrode material is side-etched selectively to form gate electrodes. The blocking material is processed selectively and remains in a drain region side. Also, an offset region or an LDD region is formed under the blocking material by performing an impurity ion implantation. On the other hand, after the gate electrodes are formed, a resist is added and then light exposure is performed from a source region side using a light blocking material as a mask, so that the resist remains in a drain region side of the gate electrode. Also, by implanting an impurity ion, an offset region or an LDD region is formed in the drain region side.
    • 在形成具有偏移结构或轻掺杂漏极(LDD)结构的薄膜晶体管(TFT)的情况下,形成具有比构成栅电极的材料蚀刻速率低的蚀刻速率的阻挡材料。 通过使用阻挡材料作为掩模,选择性地蚀刻栅电极材料以形成栅电极。 阻挡材料被选择性地处理并保留在漏极区域侧。 此外,通过进行杂质离子注入,在阻挡材料下方形成偏移区域或LDD区域。 另一方面,在形成栅电极之后,添加抗蚀剂,然后使用遮光材料作为掩模从源极区域进行曝光,使得抗蚀剂保留在栅电极的漏区侧 。 此外,通过注入杂质离子,在漏区侧形成偏移区域或LDD区域。