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1. 发明授权

US09136388B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US09136388B2
公开(公告)日：2015-09-15
申请号：US13549867
申请日：2012-07-16
申请人： Shunpei Yamazaki , Masahiro Takahashi , Tatsuya Honda , Takehisa Hatano
发明人： Shunpei Yamazaki , Masahiro Takahashi , Tatsuya Honda , Takehisa Hatano
IPC分类号： H01L29/26 , H01L29/786
CPC分类号： H01L29/7869 , H01L29/24 , H01L29/78618
摘要： Provided is a structure of a transistor, which enables a so-called normally-off switching element, and a manufacturing method thereof. Provided is a structure of a semiconductor device which achieves high-speed response and high-speed operation by improving on characteristics of a transistor, and a manufacturing method thereof. Provided is a highly reliable semiconductor device. In the transistor in which a semiconductor layer, source and drain electrode layers, a gate insulating layer, and a gate electrode layer are stacked in that order. As the semiconductor layer, an oxide semiconductor layer which contains at least four kinds of elements of indium, gallium, zinc, and oxygen, and has a composition ratio (atomic percentage) of indium as twice or more as a composition ratio of gallium and a composition ratio of zinc, is used.
摘要翻译：提供了能够实现所谓的常关断开关元件的晶体管的结构及其制造方法。提供了通过提高晶体管的特性实现高速响应和高速操作的半导体器件的结构及其制造方法。提供了一种高度可靠的半导体器件。在其中半导体层，源极和漏极电极层，栅极绝缘层和栅极电极层以该顺序堆叠的晶体管中。作为半导体层，含有铟，镓，锌和氧中的至少四种元素的氧化物半导体层，铟的组成比（原子百分比）为镓和a的组成比的两倍以上使用锌的组成比。

2. 发明授权

US08669556B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US08669556B2
公开(公告)日：2014-03-11
申请号：US13307398
申请日：2011-11-30
申请人： Shunpei Yamazaki , Masashi Tsubuku , Kengo Akimoto , Hiroki Ohara , Tatsuya Honda , Takatsugu Omata , Yusuke Nonaka , Masahiro Takahashi , Akiharu Miyanaga
发明人： Shunpei Yamazaki , Masashi Tsubuku , Kengo Akimoto , Hiroki Ohara , Tatsuya Honda , Takatsugu Omata , Yusuke Nonaka , Masahiro Takahashi , Akiharu Miyanaga
IPC分类号： H01L29/04
CPC分类号： H01L29/78696 , H01L29/045 , H01L29/1033 , H01L29/247 , H01L29/7869 , H01L29/78693
摘要： An oxide semiconductor film which has more stable electric conductivity is provided. Further, a semiconductor device which has stable electric characteristics and high reliability is provided by using the oxide semiconductor film. An oxide semiconductor film includes a crystalline region, and the crystalline region includes a crystal in which an a-b plane is substantially parallel with a surface of the film and a c-axis is substantially perpendicular to the surface of the film; the oxide semiconductor film has stable electric conductivity and is more electrically stable with respect to irradiation with visible light, ultraviolet light, and the like. By using such an oxide semiconductor film for a transistor, a highly reliable semiconductor device having stable electric characteristics can be provided.
摘要翻译：提供了具有更稳定的导电性的氧化物半导体膜。此外，通过使用氧化物半导体膜提供具有稳定的电特性和高可靠性的半导体器件。氧化物半导体膜包括结晶区域，并且结晶区域包括其中a-b平面基本上平行于膜的表面并且c轴基本上垂直于膜的表面的晶体; 氧化物半导体膜具有稳定的导电性，并且相对于可见光，紫外线等的照射而言更加电稳定。通过使用这种用于晶体管的氧化物半导体膜，可以提供具有稳定电特性的高可靠性半导体器件。

3. 发明授权

US08952379B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US08952379B2
公开(公告)日：2015-02-10
申请号：US13608044
申请日：2012-09-10
申请人： Shunpei Yamazaki , Atsuo Isobe , Hiromachi Godo , Takehisa Hatano , Sachiaki Tezuka , Suguru Hondo , Naoto Yamade , Junichi Koezuka
发明人： Shunpei Yamazaki , Atsuo Isobe , Hiromachi Godo , Takehisa Hatano , Sachiaki Tezuka , Suguru Hondo , Naoto Yamade , Junichi Koezuka
IPC分类号： H01L29/78 , H01L29/417 , H01L29/786
CPC分类号： H01L29/41733 , H01L29/78618 , H01L29/7869 , H01L29/78693
摘要： Provided is a semiconductor device in which an oxide semiconductor layer is provided; a pair of wiring layers which are provided with the gate electrode layer interposed therebetween are electrically connected to the low-resistance regions; and electrode layers are provided to be in contact with the low-resistance regions, below regions where the wiring layers are formed.
摘要翻译：提供一种半导体器件，其中提供氧化物半导体层; 设置有栅极电极层的一对布线层电连接到低电阻区域; 并且电极层设置成与低电阻区域接触，在形成布线层的区域之下。

4. 发明授权

US08809992B2 Semiconductor device and manufacturing method thereof 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08809992B2
公开(公告)日：2014-08-19
申请号：US13356012
申请日：2012-01-23
申请人： Shunpei Yamazaki , Atsuo Isobe , Toshihiko Saito , Takehisa Hatano , Hideomi Suzawa , Shinya Sasagawa , Junichi Koezuka , Yuichi Sato , Shinji Ohno
发明人： Shunpei Yamazaki , Atsuo Isobe , Toshihiko Saito , Takehisa Hatano , Hideomi Suzawa , Shinya Sasagawa , Junichi Koezuka , Yuichi Sato , Shinji Ohno
IPC分类号： H01L29/786
CPC分类号： H01L29/66969 , H01L21/02488 , H01L21/02565 , H01L27/1225 , H01L29/786 , H01L29/78606 , H01L29/7869
摘要： A semiconductor device which includes an oxide semiconductor and has favorable electrical characteristics is provided. In the semiconductor device, an oxide semiconductor film and an insulating film are formed over a substrate. Side surfaces of the oxide semiconductor film are in contact with the insulating film. The oxide semiconductor film includes a channel formation region and regions containing a dopant between which the channel formation region is sandwiched. A gate insulating film is formed on and in contact with the oxide semiconductor film. A gate electrode with sidewall insulating films is formed over the gate insulating film. A source electrode and a drain electrode are formed in contact with the oxide semiconductor film and the insulating film.
摘要翻译：提供了包括氧化物半导体并且具有良好的电特性的半导体器件。在半导体器件中，在衬底上形成氧化物半导体膜和绝缘膜。氧化物半导体膜的侧面与绝缘膜接触。氧化物半导体膜包括沟道形成区域和包含掺杂剂的区域，沟道形成区域夹在其间。栅极绝缘膜与氧化物半导体膜形成并接触。在栅绝缘膜上形成具有侧壁绝缘膜的栅电极。源电极和漏电极形成为与氧化物半导体膜和绝缘膜接触。

5. 发明授权

US09076874B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US09076874B2
公开(公告)日：2015-07-07
申请号：US13488879
申请日：2012-06-05
申请人： Shunpei Yamazaki , Tatsuya Honda
发明人： Shunpei Yamazaki , Tatsuya Honda
IPC分类号： H01L21/00 , H01L29/786 , H01L29/66 , H01L21/02 , H01L27/12
CPC分类号： H01L29/78609 , H01L21/02554 , H01L21/02565 , H01L27/1225 , H01L27/14616 , H01L29/045 , H01L29/66969 , H01L29/78621 , H01L29/7869 , H01L29/78696
摘要： An object is to provide a structure of a transistor which has a channel formation region formed using an oxide semiconductor and a positive threshold voltage value, which enables a so-called normally-on switching element. The transistor includes an oxide semiconductor stack in which at least a first oxide semiconductor layer and a second oxide semiconductor layer with different energy gaps are stacked and a region containing oxygen in excess of its stoichiometric composition ratio is provided.
摘要翻译：本发明的目的是提供一种晶体管的结构，其具有使用氧化物半导体形成的沟道形成区域和正的阈值电压值，这使得能够形成所谓的常开开关元件。晶体管包括氧化物半导体堆叠，其中至少第一氧化物半导体层和具有不同能隙的第二氧化物半导体层被堆叠，并且提供含有超过其化学计量组成比的氧的区域。

6. 发明授权

US08541782B2 Method for evaluating oxide semiconductor and method for manufacturing semiconductor device 有权
标题翻译：氧化物半导体的评价方法及半导体装置的制造方法
公开(公告)号：US08541782B2
公开(公告)日：2013-09-24
申请号：US12940724
申请日：2010-11-05
申请人： Shunpei Yamazaki , Akiharu Miyanaga , Tatsuya Honda
发明人： Shunpei Yamazaki , Akiharu Miyanaga , Tatsuya Honda
IPC分类号： H01L23/58
CPC分类号： H01L22/20 , H01L22/14
摘要： Many of the principles of an oxide semiconductor are still unclear and therefore there is no established method for evaluating an oxide semiconductor. Thus, an object is to provide a novel method for evaluating an oxide semiconductor. Carrier density is evaluated, and hydrogen concentration is also evaluated. Specifically, a MOS capacitor (a diode or a triode) is manufactured, and the C-V characteristics of the MOS capacitor are obtained. Then, the carrier density is estimated from the C-V characteristics obtained.
摘要翻译：氧化物半导体的许多原理仍不清楚，因此没有确定的用于评价氧化物半导体的方法。因此，目的在于提供一种评价氧化物半导体的新方法。评估载体密度，并评价氢浓度。具体来说，制造MOS电容器（二极管或三极管），获得MOS电容器的C-V特性。然后，从所获得的C-V特性估计载流子浓度。

7. 发明授权

US07564058B2 Display device, manufacturing method thereof, and television set 有权
标题翻译：显示装置及其制造方法以及电视机
公开(公告)号：US07564058B2
公开(公告)日：2009-07-21
申请号：US11187988
申请日：2005-07-25
申请人： Shunpei Yamazaki , Hironobu Shoji , Shinji Maekawa , Osamu Nakamura , Tatsuya Honda , Gen Fujii , Yukie Suzuki , Ikuko Kawamata
发明人： Shunpei Yamazaki , Hironobu Shoji , Shinji Maekawa , Osamu Nakamura , Tatsuya Honda , Gen Fujii , Yukie Suzuki , Ikuko Kawamata
IPC分类号： H01L27/14
CPC分类号： H01L21/02667 , G02F1/1368 , G02F2202/104 , H01L21/2022 , H01L21/2026 , H01L27/124 , H01L27/1277 , H01L27/1292 , H01L27/3246 , H01L27/3248 , H01L27/3262 , H01L27/3276 , H01L51/56
摘要： A manufacturing method of a display device having TFTs capable of high-speed operation with few variations of threshold voltage is provided, in which materials are used with high efficiency and a small number of photomasks is required. The display device of the invention comprises a gate electrode layer and a pixel electrode layer formed over an insulating surface, a gate insulating layer formed over the gate electrode layer, a crystalline semiconductor layer formed over the gate insulating layer, a semiconductor layer having one conductivity type formed in contact with the crystalline semiconductor layer, a source electrode layer and a drain electrode layer formed in contact with the semiconductor layer having one conductivity type, an insulating later formed over the source electrode layer, the drain electrode layer, and the pixel electrode layer, a first opening formed in the insulating layer to reach the source electrode layer or the drain electrode layer, a second opening formed in the gate insulating layer and the insulating layer to reach the pixel electrode layer, and a wiring layer formed in the first opening and the second opening to electrically connect the source electrode layer or the drain electrode layer to the pixel electrode layer.
摘要翻译：提供了具有能够以极小的阈值电压变化进行高速运行的TFT的显示装置的制造方法，其中以高效率使用材料并且需要少量的光掩模。本发明的显示装置包括形成在绝缘表面上的栅极电极层和像素电极层，形成在栅极电极层上的栅极绝缘层，形成在栅极绝缘层上的结晶半导体层，具有一个导电性的半导体层形成为与结晶半导体层接触的类型，源电极层和漏极电极层，形成为与具有一种导电类型的半导体层接触，在源极电极层，漏极电极层和像素电极之后形成绝缘体在所述绝缘层中形成的第一开口到达所述源极电极层或所述漏极电极层，形成在所述栅极绝缘层和所述绝缘层中的第二开口到达所述像素电极层;以及布线层，开口和第二开口以电连接源极电极层或漏极电极呃到像素电极层。

8. 发明申请

US20070262318A1 Method for manufacturing display device 有权
公开(公告)号：US20070262318A1
公开(公告)日：2007-11-15
申请号：US11826815
申请日：2007-07-18
申请人： Hironobu Shoji , Shinji Maekawa , Kensuke Yoshizumi , Tatsuya Honda , Yukie Suzuki , Ikuko Kawamata , Shunpei Yamazaki
发明人： Hironobu Shoji , Shinji Maekawa , Kensuke Yoshizumi , Tatsuya Honda , Yukie Suzuki , Ikuko Kawamata , Shunpei Yamazaki
IPC分类号： H01L29/04
CPC分类号： H01L51/56 , H01L27/1277 , H01L27/1292 , H01L27/322 , H01L27/3244 , H01L27/3246 , H01L27/3262 , H01L27/3276 , H01L29/42384 , H01L29/458 , H01L29/66757 , H01L29/78675 , H01L29/78696 , H01L51/0005 , H01L51/524 , H01L51/5253 , H01L51/5281 , H01L51/529 , H01L2251/5315 , H01L2251/5323 , Y02P80/30
摘要： The present invention provides a method for manufacturing a display device having a TFT that can be operated at high speed while using a small number of photomasks and improving the utilization efficiency of materials, where the threshold value is difficult to be varied. In the invention, a catalytic element is applied to an amorphous semiconductor film and the amorphous semiconductor film is heated to form a crystalline semiconductor film. After removing the catalytic element from the crystalline semiconductor film, a top-gate type thin film transistor with a planar structure is manufactured. Moreover, by using the droplet discharging method where an element of a display device is formed selectively, the process can be simplified, and loss of materials can be reduced.

9. 发明授权

US07247529B2 Method for manufacturing display device 有权
标题翻译：显示装置制造方法
公开(公告)号：US07247529B2
公开(公告)日：2007-07-24
申请号：US11205220
申请日：2005-08-17
申请人： Hironobu Shoji , Shinji Maekawa , Kensuke Yoshizumi , Tatsuya Honda , Yukie Suzuki , Ikuko Kawamata , Shunpei Yamazaki
发明人： Hironobu Shoji , Shinji Maekawa , Kensuke Yoshizumi , Tatsuya Honda , Yukie Suzuki , Ikuko Kawamata , Shunpei Yamazaki
IPC分类号： H01L21/00
CPC分类号： H01L51/56 , H01L27/1277 , H01L27/1292 , H01L27/322 , H01L27/3244 , H01L27/3246 , H01L27/3262 , H01L27/3276 , H01L29/42384 , H01L29/458 , H01L29/66757 , H01L29/78675 , H01L29/78696 , H01L51/0005 , H01L51/524 , H01L51/5253 , H01L51/5281 , H01L51/529 , H01L2251/5315 , H01L2251/5323 , Y02P80/30
摘要： The present invention provides a method for manufacturing a display device having a TFT that can be operated at high speed while using a small number of photomasks and improving the utilization efficiency of materials, where the threshold value is difficult to be varied. In the invention, a catalytic element is applied to an amorphous semiconductor film and the amorphous semiconductor film is heated to form a crystalline semiconductor film. After removing the catalytic element from the crystalline semiconductor film, a top-gate type thin film transistor with a planar structure is manufactured. Moreover, by using the droplet discharging method where an element of a display device is formed selectively, the process can be simplified, and loss of materials can be reduced.
摘要翻译：本发明提供了一种用于制造具有TFT的显示装置的方法，所述显示装置可以在使用少量光掩模的情况下高速运转并且提高难以改变阈值的材料的利用效率。在本发明中，将催化元件施加到非晶半导体膜上，并加热非晶半导体膜以形成结晶半导体膜。在从晶体半导体膜去除催化元素之后，制造具有平面结构的顶栅型薄膜晶体管。此外，通过使用选择性地形成显示装置的元件的液滴喷射方法，可以简化该过程，并且可以减少材料的损失。

10. 发明授权

US08890152B2 Semiconductor device and manufacturing method thereof 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08890152B2
公开(公告)日：2014-11-18
申请号：US13495313
申请日：2012-06-13
申请人： Shunpei Yamazaki , Tatsuya Honda
发明人： Shunpei Yamazaki , Tatsuya Honda
IPC分类号： H01L29/04 , H01L29/786 , H01L29/778 , H01L29/267
CPC分类号： H01L29/7869 , H01L29/045 , H01L29/24 , H01L29/267 , H01L29/7782 , H01L29/78609 , H01L29/78696
摘要： One object of the present invention is to provide a structure of a transistor including an oxide semiconductor in a channel formation region in which the threshold voltage of electric characteristics of the transistor can be positive, which is a so-called normally-off switching element, and a manufacturing method thereof. A second oxide semiconductor layer which has greater electron affinity and a smaller energy gap than a first oxide semiconductor layer is formed over the first oxide semiconductor layer. Further, a third oxide semiconductor layer is formed to cover side surfaces and a top surface of the second oxide semiconductor layer, that is, the third oxide semiconductor layer covers the second oxide semiconductor layer.
摘要翻译：本发明的一个目的是提供在晶体管的电特性的阈值电压可以为正的沟道形成区域中的包括氧化物半导体的晶体管的结构，其是所谓的常关断开关元件，及其制造方法。在第一氧化物半导体层上形成具有比第一氧化物半导体层更大的电子亲和力和更小的能隙的第二氧化物半导体层。此外，形成第三氧化物半导体层以覆盖第二氧化物半导体层的侧表面和顶表面，即，第三氧化物半导体层覆盖第二氧化物半导体层。

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