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1. 发明授权

US5362559A Polysilane monomolecular film and polysilane built-up film 失效
标题翻译：聚硅烷单分子膜和聚硅烷成膜
公开(公告)号：US5362559A
公开(公告)日：1994-11-08
申请号：US89634
申请日：1993-07-12
申请人： Shuji Hayase , Yoshihiko Nakano , Yukihiro Mikogami , Akira Yoshizumi , Shinji Murai , Rikako Kani
发明人： Shuji Hayase , Yoshihiko Nakano , Yukihiro Mikogami , Akira Yoshizumi , Shinji Murai , Rikako Kani
IPC分类号： B05D1/20 , C09D183/16 , B32B5/00
CPC分类号： B82Y30/00 , B05D1/202 , B82Y40/00 , C09D183/16 , Y10T428/261
摘要： Disclosed are a polysilane monomolecular film and a polysilane built-up film formed by building up a plurality of said monomolecular films, said monomolecular film consisting of a polysilane having a repeating unit represented by general formula (1) given below: ##STR1## where, R.sup.1 represents a substituted or unsubstituted alkyl group having 1 to 24 carbon atoms or a substituted or unsubstituted aryl group having 6 to 24 carbon atoms, R.sup.2 represents a divalent hydrocarbon group having 1 to 4 carbon atoms which can be substituted, and X represents hydroxyl group, amino group, carboxyl group, or a hydrophilic group having at least one selected from the group consisting of hydroxyl group, amino group, carboxyl group, amide linkage, ester linkage, carbamate linkage and carbonate linkage. The polysilane monomolecular film and built-up film can be formed on a substrate by an LB technique. In the films, the molecules of the polysilane having the repeating unit (1), that is, the Si-Si backbones are oriented in a fixed direction.
摘要翻译：公开了一种聚硅烷单分子膜和聚硅烷叠层膜，其通过构建多个所述单分子膜而形成，所述单分子膜由具有由以下给出的通式（1）表示的重复单元的聚硅烷组成：＆lt; IMAGE＆gt;（1 ）其中，R1表示取代或未取代的碳原子数1〜24的烷基或碳原子数6〜24的取代或未取代的芳基，R2表示可被取代的碳原子数1〜4的二价烃基，X 表示羟基，氨基，羧基或具有选自羟基，氨基，羧基，酰胺键，酯键，氨基甲酸酯键和碳酸酯键中的至少一种的亲水基团。可以通过LB技术在基板上形成聚硅烷单分子膜和积层膜。在膜中，具有重复单元（1）的聚硅烷的分子，即Si-Si主链在固定方向上取向。

2. 发明授权

US5336736A Polysilane and polysilane composition 失效
标题翻译：聚硅烷和聚硅烷组成
公开(公告)号：US5336736A
公开(公告)日：1994-08-09
申请号：US53810
申请日：1993-04-29
申请人： Yoshihiko Nakano , Shuzi Hayase , Shinji Murai , Yukihiro Mikogami , Akira Yoshizumi
发明人： Yoshihiko Nakano , Shuzi Hayase , Shinji Murai , Yukihiro Mikogami , Akira Yoshizumi
IPC分类号： C08G18/64 , C08G59/00 , C08G59/20 , C08G59/30 , C08G59/40 , C08G59/42 , C08G77/60 , C08L63/00 , C08L83/04 , C08L83/16 , G03F7/075 , C08F283/00
CPC分类号： G03F7/0754 , C08G77/60 , C08L83/16
摘要： Disclosed is a polysilane having a repeating unit represented by general formula (1) given below. Also disclosed is a polysilane composition, comprising a polysilane having a repeating unit represented by general formula (2) given below and a cross linking agent: ##STR1## where, each of R.sup.1 and R.sup.3 is hydrogen, a substituted or unsubstituted alkyl group having 1 to 24 carbon atoms or a substituted or unsubstituted aryl group having 6 to 24 carbon atoms; R.sup.2 is a divalent hydrocarbon group having to 24 carbon atoms which can be substituted; R.sup.4 is a covalent bond, or a substituted or unsubstituted alkylene group having 1 to carbon atoms, or a substituted or unsubstituted arylene group having 6 to 24 carbon atoms; each of R.sup.5 to R.sup.9 is hydrogen, a substituted or unsubstituted alkyl group having 1 to 24 carbon atoms, a substituted or unsubstituted aryl group having 6 to 24 carbon atoms, or hydroxyl group, at least one of R.sup.5 to R.sup.9 being hydroxyl group; and X is a monovalent organic group having a reactive group capable of crosslinking upon exposure to light or by heating. If any of the polysilane and the polysilane composition of the present invention is exposed to light or heated, the polysilane molecules are crosslinked so as to provide a two or three dimensional polymer.
摘要翻译：公开了具有下述通式（1）表示的重复单元的聚硅烷。还公开了一种聚硅烷组合物，其包含具有由下述通式（2）表示的重复单元的聚硅烷和交联剂：其中，R1和R3各自为氢取代或未取代的碳原子数为1〜24的烷基或取代或未取代的碳原子数为6〜24的芳基。 R2是可被取代的具有24个碳原子的二价烃基; R4为共价键，或取代或未取代的碳原子数1〜2的亚烷基，取代或未取代的碳原子数为6〜24的亚芳基。 R5至R9各自为氢，取代或未取代的碳原子数为1〜24的烷基，取代或未取代的碳原子数为6〜24的芳基或羟基，R5〜R9中的至少一个为羟基; X是具有能够在曝光或加热时能够交联的反应性基团的一价有机基团。如果本发明的聚硅烷和聚硅烷组合物中的任何一种都被曝光或加热，则聚硅烷分子被交联以提供二维或三维聚合物。

3. 发明授权

US5637667A Thermosetting resin composition 失效
标题翻译：热固性树脂组合物
公开(公告)号：US5637667A
公开(公告)日：1997-06-10
申请号：US451065
申请日：1995-05-25
申请人： Hiroshi Shimozawa , Shinetsu Fujieda , Shuzi Hayase , Yoshihiko Nakano , Akira Yoshizumi , Ken Uchida
发明人： Hiroshi Shimozawa , Shinetsu Fujieda , Shuzi Hayase , Yoshihiko Nakano , Akira Yoshizumi , Ken Uchida
IPC分类号： C08G77/60 , C08L63/00 , C08L79/08 , C08L83/16 , C08L101/00 , C08G77/04
CPC分类号： C08L63/00 , C08G77/60 , C08L101/00 , C08L79/085 , C08L83/16
摘要： A thermosetting resin composition, containing (A) a thermosetting resin; (B) a curing agent for the thermosetting resin; (C) a polysilane copolymer; and (D) an inorganic filler; wherein the polyailane copolymer (C) is added in amount of about 0.1 to 10% by weight based on the total amount of the resin composition.
摘要翻译：一种热固性树脂组合物，其含有（A）热固性树脂; （B）热固性树脂用固化剂; （C）聚硅烷共聚物; 和（D）无机填料; 其中所述聚烯烃共聚物（C）的添加量相对于树脂组合物的总量为约0.1〜10重量％。

4. 发明授权

US5438113A Thermosetting resin composition 失效
标题翻译：热固性树脂组合物
公开(公告)号：US5438113A
公开(公告)日：1995-08-01
申请号：US40267
申请日：1993-03-30
申请人： Hiroshi Shimozawa , Shinetsu Fujieda , Shuzi Hayase , Yoshihiko Nakano , Akira Yoshizumi , Ken Uchida
发明人： Hiroshi Shimozawa , Shinetsu Fujieda , Shuzi Hayase , Yoshihiko Nakano , Akira Yoshizumi , Ken Uchida
IPC分类号： C08G77/60 , C08L63/00 , C08L79/08 , C08L83/16 , C08L101/00 , C08G77/04
CPC分类号： C08L63/00 , C08G77/60 , C08L101/00 , C08L79/085 , C08L83/16
摘要： A thermosetting resin composition containing a silane compound a) having at least one phenolic hydroxyl group, and an organic compound b) having at least two functional groups capable of reaction with the phenolic hydroxyl group of the silane compound, wherein the silane compound a) is added in an amount of more than 10 parts by weight relative to 100 parts by weight of the organic compound b).
摘要翻译：含有具有至少一个酚羟基的硅烷化合物a）和具有至少两个能够与硅烷化合物的酚羟基反应的官能团的有机化合物b）的热固性树脂组合物，其中硅烷化合物a）为相对于100重量份的有机化合物b），加入量大于10重量份。

5. 发明授权

US5747557A Method of manufacturing a castable epoxy resin composition comprising acrylic rubber particles predispersed in an anhydride hardener 失效
标题翻译：制备可分散在酸酐硬化剂中的丙烯酸橡胶颗粒的可浇铸环氧树脂组合物的方法
公开(公告)号：US5747557A
公开(公告)日：1998-05-05
申请号：US722339
申请日：1996-09-27
申请人： Koshi Hanyu , Akira Yoshizumi
发明人： Koshi Hanyu , Akira Yoshizumi
IPC分类号： C08L63/00 , C08G59/18 , C08G59/40 , C08G59/50 , C08L101/16 , H01B3/40 , C08G59/42 , C08K3/22 , C08L33/06
CPC分类号： C08L63/00 , Y10S525/902
摘要： A method of manufacturing a castable epoxy resin composition which comprises as components an epoxy resin, an acid anhydride in an amount sufficient for hardening, an inorganic filler, and acrylic rubber particles having a thermoplastic resin skin, said thermoplastic resin skin being 1 to 50 wt % of said acrylic rubber particles, wherein each of said acrylic rubber particles has epoxy groups on a surface thereof, and said acrylic rubber particles are present in an amount ranging between 2 and 40 parts by weight based on 100 parts by weight of said epoxy resin, wherein said inorganic filler is an alumina powder having a mean particle size by volume of 6 to 16 .mu.m, and a particle size of at least 10 volume % of said alumina powder particles is 20 .mu.m or greater, and wherein at least 90 volume % of said rubber particles are dispersed as discrete particles with a particle size by volume of 1 .mu.m or less, said method comprising the steps of: preparing a modified hardener by mixing said acrylic rubber particles with at least a portion of said acid anhydride by using shearing force applying means in sufficient force to uniformly disperse said rubber particles in said acid anhydride; and mixing said modified hardener and the remainder of said components.
摘要翻译：一种制造可浇铸环氧树脂组合物的方法，其包含环氧树脂，足够硬化量的酸酐，无机填料和具有热塑性树脂表皮的丙烯酸橡胶颗粒作为组分，所述热塑性树脂表层为1至50重量％％的所述丙烯酸橡胶颗粒，其中每个所述丙烯酸橡胶颗粒在其表面上具有环氧基，并且所述丙烯酸橡胶颗粒以基于100重量份所述环氧树脂为基准的2至40重量份的量存在其中所述无机填料是平均粒径为6〜16μm的氧化铝粉末，所述氧化铝粉末颗粒的至少10体积％的粒径为20μm以上，其中，至少90 所述橡胶颗粒的体积％分散为体积小于1μm的离散颗粒，所述方法包括以下步骤：通过将所述橡胶颗粒通过使用剪切力施加装置足够的力使至少一部分所述酸酐的橡胶颗粒均匀地分散在所述酸酐中; 并混合所述改性固化剂和所述组分的其余部分。

6. 发明授权

US06645643B2 Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom 有权
公开(公告)号：US06645643B2
公开(公告)日：2003-11-11
申请号：US09844505
申请日：2001-04-27
申请人： Roberto Zafarana , Antonino Scandurra , Salvatore Pignataro , Yuichi Tenya , Akira Yoshizumi
发明人： Roberto Zafarana , Antonino Scandurra , Salvatore Pignataro , Yuichi Tenya , Akira Yoshizumi
IPC分类号： H01L2912
CPC分类号： H01L23/296 , C08K3/36 , C08L63/00 , H01L2924/0002 , H01L2924/12044 , Y10T428/12528 , C08L83/00 , H01L2924/00
摘要： A polymeric composition for making semiconductor device packaging includes at least one epoxy resin, at least one curing agent in an amount between 30 and 110 parts by weight per 100 parts by weight of the epoxy resin, at least one silica-based reinforcing filler in an amount between 300 and 2300 parts by weight per 100 parts of the epoxy resin, and at least one control agent for a rheology of the polymeric composition. The at least one control agent may be substantially free from polar groups and present in an amount between 0.1 and 50 parts by weight per 100 parts by weight of the epoxy resin. The invention also relates to a plastic packaging material for microelectronic applications which may be obtained from the above polymeric composition, and to a semiconductor electronic device including such packaging material.

7. 发明授权

US5641997A Plastic-encapsulated semiconductor device 失效
标题翻译：塑料封装的半导体器件
公开(公告)号：US5641997A
公开(公告)日：1997-06-24
申请号：US305478
申请日：1994-09-13
申请人： Hideo Ohta , Tetsuo Okuyama , Shinetsu Fujieda , Sadao Kajiura , Akira Yoshizumi
发明人： Hideo Ohta , Tetsuo Okuyama , Shinetsu Fujieda , Sadao Kajiura , Akira Yoshizumi
IPC分类号： C08L63/00 , H01L21/56 , H01L23/29 , H01L23/433
CPC分类号： C08L63/00 , H01L21/56 , H01L23/293 , H01L23/295 , H01L23/4334 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/32245 , H01L2224/45015 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L24/48 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01077 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H01L2924/1815
摘要： A semiconductor chip is positioned between encapsulating sheets. The encapsulating sheets each have a surface that is highly adhesive and a surface that is less adhesive. The surface of the encapsulating sheet that is highly adhesive contacts the chip. The surface that is less adhesive contacts a mold. Subsequently, encapsulation is carried out by molding. A soldering resistance can be improved without reducing a mold releasing property.
摘要翻译：半导体芯片位于封装片之间。封装片各自具有高粘合性的表面和较少粘合剂的表面。高度粘合的封装片的表面接触芯片。粘合剂较少的表面与模具接触。随后，通过模塑进行包封。可以在不降低脱模性的情况下改善耐焊接性。

8. 发明授权

US5216077A Rubber-modified phenolic resin composition and method of manufacturing the same 失效
标题翻译：橡胶改性酚醛树脂组合物及其制造方法
公开(公告)号：US5216077A
公开(公告)日：1993-06-01
申请号：US874226
申请日：1992-04-27
申请人： Akira Yoshizumi , Shinetsu Fujieda , Ken Uchida , Naoko Kihara , Kazuhiro Sawai , Tsutomu Nagata , Shinji Murakami , Shigeyuki Kouchiyama
发明人： Akira Yoshizumi , Shinetsu Fujieda , Ken Uchida , Naoko Kihara , Kazuhiro Sawai , Tsutomu Nagata , Shinji Murakami , Shigeyuki Kouchiyama
IPC分类号： C08L61/06 , C08L63/00 , H01B3/40
CPC分类号： H01B3/40 , C08L61/06 , C08L63/00
摘要： A rubber-modified phenolic resin composition contains a novolak-type phenolic resin in which at least one modifying agent selected from the group consisting of an ABS resin and an MBS resin is homogeneously dispersed. The composition has good impact resistance and thermal shock resistance. The composition is prepared by adding at least one modifying agent described above to a novolak-type phenolic resin which is heated and melted at its softening point or more, so that the modifying agent is homogeneous dispersed in the resin. The resin composition is suitably used as a curing agent for an epoxy resin encapsulant for sealing electronic devices.
摘要翻译：橡胶改性酚醛树脂组合物含有酚醛清漆型酚醛树脂，其中至少一种选自ABS树脂和MBS树脂的改性剂均匀分散。该组合物具有良好的抗冲击性和耐热冲击性。通过将上述至少一种改性剂加入到其软化点或更高温度下被加热和熔化的酚醛清漆型酚醛树脂来制备组合物，使得改性剂均匀分散在树脂中。树脂组合物适合用作环氧树脂密封剂用于密封电子器件的固化剂。

9. 发明授权

US5043211A Epoxy resin composition and a resin-sealed semiconductor device 失效
标题翻译：环氧树脂组合物和树脂密封半导体器件
公开(公告)号：US5043211A
公开(公告)日：1991-08-27
申请号：US175225
申请日：1988-03-30
申请人： Akira Yoshizumi , Kazutaka Matsumoto , Shinetsu Fujieda , Ken Uchida
发明人： Akira Yoshizumi , Kazutaka Matsumoto , Shinetsu Fujieda , Ken Uchida
IPC分类号： C08G59/00 , C08G59/18 , C08G59/40 , C08G59/62 , C08K9/06 , C08K9/08 , C08L63/00 , H01L23/29 , H01L23/31
CPC分类号： H01L23/296 , C08K9/08 , C08L63/00 , H01L23/295 , H01L2924/0002 , Y10T428/239 , Y10T428/259 , Y10T428/31511
摘要： An epoxy resin composition useful for sealing a semiconductor device includes 100 parts by weight of epoxy resin, 30-75 parts by weight of phenolic resin, 320-570 parts by weight of silica powder, and 2-30 parts by weight of styrene-butadiene-methyl methacrylate copolymer. The surface of the silica powder is treated, at room temperature, by 0.05-1.00% by weight of silane coupling agent, 0.05-1.00% by weight of a silicone base surface active agent, and 0.15-3.00% by weight of thermosetting silicone rubber.

10. 发明申请

US20130230294A1 IMAGE MONITORING SYSTEM AND CAMERA 审中-公开
标题翻译：图像监控系统和摄像机
公开(公告)号：US20130230294A1
公开(公告)日：2013-09-05
申请号：US13817353
申请日：2011-08-19
申请人： Atsushi Sassa , Akinori Kouchi , Tomohiro Aikawa , Masaru Fujii , Kei Takahashi , Masashi Hohya , Akira Yoshizumi , Takayuki Koizumi
发明人： Atsushi Sassa , Akinori Kouchi , Tomohiro Aikawa , Masaru Fujii , Kei Takahashi , Masashi Hohya , Akira Yoshizumi , Takayuki Koizumi
IPC分类号： H04N7/18
CPC分类号： H04N7/18 , H04N5/2354 , H04N5/33 , H04N5/77 , H04N9/8042
摘要： The purpose of the present invention is to provide an image monitoring system which can be used in a place where a network cannot be established and has excellent portability. When an image is captured during the daytime or in a bright place, a camera (10) is equipped with a near-infrared cut filter, captures an image of a subject, and outputs a color image. On the other hand, when an image is captured during the nighttime or in a dark place, the near-infrared cut filter is removed from the camera (10), an LED light (11) irradiates the subject with near-infrared light in synchronization with the shutter speed of the camera (10), and the camera (10) captures an image of the near-infrared light reflected by the subject and outputs a monochrome image. The image outputted from the camera (10) is inputted to a recording device via a dedicated cable.
摘要翻译：本发明的目的是提供一种图像监视系统，其可以在不能建立网络并且具有优异的便携性的地方使用。当在白天或在明亮的地方捕获图像时，相机（10）配备有近红外截止滤光器，捕获被摄体的图像，并输出彩色图像。另一方面，当在夜间或暗处拍摄图像时，从相机（10）去除近红外截止滤光器，LED灯（11）同步地以近红外光照射被摄体具有相机（10）的快门速度，并且相机（10）捕获由被摄体反射的近红外光的图像并输出单色图像。从照相机（10）输出的图像通过专用电缆输入到记录装置。

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