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1. 发明授权

US5110515A Method of encapsulating semiconductor chips 失效
标题翻译：封装半导体晶片的方法
公开(公告)号：US5110515A
公开(公告)日：1992-05-05
申请号：US353256
申请日：1989-05-16
申请人： Shozo Nakamura , Aizo Kaneda , Shigeharu Tsunoda , Akio Hasebe , Masao Mitani
发明人： Shozo Nakamura , Aizo Kaneda , Shigeharu Tsunoda , Akio Hasebe , Masao Mitani
IPC分类号： B29C45/02 , B29C45/14 , B29C45/72 , B29L31/34 , H01L21/56
CPC分类号： B29C45/14655 , B29C45/1468 , B29C45/7207 , H01L21/565 , H01L2924/0002
摘要： A method for manufacturing plastic package for semiconductor according to the present invention comprises the steps of: forming a mold product of plastic package for semiconductor, which contains therein a semiconductor chip, by molding resin by means of a transfer press; heating the mold product to postcure it during transportation from the transfer press to a heating chamber while the mold product is kept by heaters at a temperature higher than a glass transition temperature of the resin for a predetermined period of time; and further heating the mold product in the heating chamber while the mold product is kept at a temperature substantially equal to the glass transition temperature of the resin for another predetermined period of time.
摘要翻译：根据本发明的用于制造半导体用塑料封装件的方法包括以下步骤：通过转印压模成型树脂来形成其中包含半导体芯片的用于半导体的塑料封装的模具产品; 在模具产品通过加热器在高于树脂的玻璃化转变温度的温度下保持预定时间段时，加热模具产品以在从转印压机传送到加热室的过程中将其后固化; 并且在模具产品保持在基本上等于树脂的玻璃化转变温度的温度另外预定时间段的情况下，进一步加热加热室中的模具产品。

2. 发明授权

US5514905A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US5514905A
公开(公告)日：1996-05-07
申请号：US329824
申请日：1994-10-27
申请人： Toshiyuki Sakuta , Kazuyuki Miyazawa , Satoshi Oguchi , Aizo Kaneda , Masao Mitani , Shozo Nakamura , Kunihiko Nishi , Gen Murakami
发明人： Toshiyuki Sakuta , Kazuyuki Miyazawa , Satoshi Oguchi , Aizo Kaneda , Masao Mitani , Shozo Nakamura , Kunihiko Nishi , Gen Murakami
IPC分类号： H01L23/29 , H01L23/495 , H01L23/48 , H01L29/41
CPC分类号： H01L23/4951 , H01L23/293 , H01L2224/05599 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48599 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01014 , H01L2924/01057 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/14
摘要： A semiconductor device is provided in connection with a semiconductor chip which has a plurality of bonding pads at a part corresponding to a centrally located area of the front or first main surface thereof, an organic insulator film which overlies the semiconductor chip and which has an opening in correspondence with the bonding pads, a plurality of leads which overly the organic insulator film, and a molding resin with which these constituents are sealed or packaged.
摘要翻译：半导体器件与半导体芯片相连，该半导体芯片在与其前表面或第一主表面的中心位置相对应的部分处具有多个接合焊盘;半导体芯片，覆盖在半导体芯片上并具有开口与接合焊盘相对应，多个有机绝缘膜上的引线以及密封或封装这些成分的成型树脂。

3. 发明授权

US5742101A Semiconductor device 失效
公开(公告)号：US5742101A
公开(公告)日：1998-04-21
申请号：US458166
申请日：1995-06-02
申请人： Toshiyuki Sakuta , Kazuyuki Miyazawa , Satoshi Oguchi , Aizo Kaneda , Masao Mitani , Shozo Nakamura , Kunihiko Nishi , Gen Murakami
发明人： Toshiyuki Sakuta , Kazuyuki Miyazawa , Satoshi Oguchi , Aizo Kaneda , Masao Mitani , Shozo Nakamura , Kunihiko Nishi , Gen Murakami
IPC分类号： H01L23/29 , H01L23/495 , H01L23/48 , H01L23/02 , H01L29/46
CPC分类号： H01L23/4951 , H01L23/293 , H01L2224/05599 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48599 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01014 , H01L2924/01057 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/14
摘要： A semiconductor device is provided in connection with a semiconductor chip which has a plurality of bonding pads at a part corresponding to a centrally located area of the front or first main surface thereof, an organic insulator film which overlies the semiconductor chip and which has an opening in correspondence with the bonding pads, a plurality of leads which overly the organic insulator film, and a molding resin with which these constituents are sealed or packaged.

4. 发明授权

US5365113A Semiconductor device 无效
标题翻译：半导体器件
公开(公告)号：US5365113A
公开(公告)日：1994-11-15
申请号：US125
申请日：1993-01-04
申请人： Toshiyuki Sakuta , Kazuyuki Miyazawa , Satoshi Oguchi , Aizo Kaneda , Masao Mitani , Shozo Nakamura , Kunihiko Nishi , Gen Murakami
发明人： Toshiyuki Sakuta , Kazuyuki Miyazawa , Satoshi Oguchi , Aizo Kaneda , Masao Mitani , Shozo Nakamura , Kunihiko Nishi , Gen Murakami
IPC分类号： H01L23/29 , H01L23/495 , H01L23/48 , H01L23/02 , H01L23/28 , H01L29/46
CPC分类号： H01L23/4951 , H01L23/293 , H01L2224/05599 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48599 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01014 , H01L2924/01057 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/14
摘要： A semiconductor device is provided in connection with a semiconductor chip which has a plurality of bonding pads at a part corresponding to a centrally located area of the front or first main surface thereof, an organic insulator film which overlies the semiconductor chip and which has an opening in correspondence with the bonding pads, a plurality of leads which overly the organic insulator film, and a molding resin with which these constituents are sealed or packaged.
摘要翻译：半导体器件与半导体芯片相连，该半导体芯片在与其前表面或第一主表面的中心位置相对应的部分处具有多个接合焊盘;半导体芯片，覆盖在半导体芯片上并具有开口与接合焊盘相对应，多个有机绝缘膜上的引线，以及密封或封装这些成分的成型树脂。

5. 发明授权

US5184208A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US5184208A
公开(公告)日：1993-02-02
申请号：US640584
申请日：1991-01-14
申请人： Toshiyuki Sakuta , Kazuyuki Miyazawa , Satoshi Oguchi , Aizo Kaneda , Masao Mitani , Shozo Nakamura , Kunihiko Nishi , Gen Murakami
发明人： Toshiyuki Sakuta , Kazuyuki Miyazawa , Satoshi Oguchi , Aizo Kaneda , Masao Mitani , Shozo Nakamura , Kunihiko Nishi , Gen Murakami
IPC分类号： H01L23/29 , H01L23/495
CPC分类号： H01L23/293 , H01L23/4951 , H01L2224/05554 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48599 , H01L2224/73215 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01014 , H01L2924/01057 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/14 , H01L2924/181
摘要： A semiconductor device is provided in connection with a semiconductor chip which has a plurality of bonding pads at a part corresponding to a centrally located area of the front or first main surface thereof, an organic insulator film which overlies the semiconductor chip and which has an opening in correspondence with the bonding pads, a plurality of leads which overly the organic insulator film, and a molding resin with which these constituents are sealed or packaged.
摘要翻译：半导体器件与半导体芯片相连，该半导体芯片在与其前表面或第一主表面的中心位置相对应的部分处具有多个接合焊盘;半导体芯片，覆盖在半导体芯片上并具有开口与接合焊盘相对应，多个有机绝缘膜上的引线，以及密封或封装这些成分的成型树脂。

6. 发明授权

US4983110A Resin encapsulating apparatus for semiconductor devices 失效
标题翻译：用于半导体器件的树脂封装装置
公开(公告)号：US4983110A
公开(公告)日：1991-01-08
申请号：US323497
申请日：1989-03-13
申请人： Isamu Yoshida , Junichi Saeki , Shigeharu Tsunoda , Kunihiko Nishi , Masao Mitani
发明人： Isamu Yoshida , Junichi Saeki , Shigeharu Tsunoda , Kunihiko Nishi , Masao Mitani
IPC分类号： B29C45/02 , B29C45/14 , H01L21/56
CPC分类号： B29C45/14655 , B29C45/02 , H01L21/565 , H01L24/97 , B29C2045/024 , B29C2045/2712 , H01L2924/181
摘要： A resin encapsulating apparatus for semiconductor devices is characterized by including a rectangular pot constituted by being surrounded with two opposed wall surfaces of short side each having an outwardly projecting curved surface and two opposed wall surfaces of long side which are each substantially in the form of a straight line; a plurality of cavity lines connected respectively through gates to the bottom portion of at least one said long-side wall surface of the pot, the cavity lines each consisting of cavities connected in series; and a plunger to be inserted into the pot.
摘要翻译：一种用于半导体器件的树脂封装装置的特征在于包括矩形盆，该矩形盆由两个相对的短边的相对的壁表面围绕，每个具有向外突出的弯曲表面和两个相对的长边的相对的壁表面基本上呈直线; 多个腔体线分别通过浇口连接到所述罐的至少一个所述长边壁表面的底部，每个空腔线由空腔连接成串联连接; 以及插入锅中的柱塞。

7. 发明授权

US06962407B2 Inkjet recording head, method of manufacturing the same, and inkjet printer 失效
标题翻译：喷墨记录头，其制造方法和喷墨打印机
公开(公告)号：US06962407B2
公开(公告)日：2005-11-08
申请号：US09875296
申请日：2001-06-07
申请人： Ryoichi Yamamoto , Masao Mitani
发明人： Ryoichi Yamamoto , Masao Mitani
IPC分类号： B41J2/05 , B41J2/14 , B41J2/16
CPC分类号： B41J2/14016 , B41J2/1603 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1635 , B41J2/1642 , B41J2/1643 , B41J2/1645 , B41J2/1646 , B41J2202/03 , Y10T29/49401 , Y10T29/49812
摘要： The inkjet recording head includes a head body and a metallic film is provided at least on a part of at least one side of the head body. The head body includes a plurality of orifices, an ink ejection unit arranged so as to correspond to each of the orifices, an independent ink flow path for supplying ink to each of the orifices and a common ink flow path for supplying ink to the independent ink flow path. The manufacturing method of the inkjet recording head forms the metallic film at least on a part of an opposite surface of a substrate to the individual ink flow paths, before adhering the orifice plate in which the orifices are formed. The inkjet printer uses the inkjet recording head.
摘要翻译：喷墨记录头包括头部本体，并且金属膜设置在头部本体的至少一侧的至少一部分上。头主体包括多个孔，一个喷墨单元，其布置成对应于每个孔，用于向每个孔提供油墨的独立油墨流路和用于向独立油墨供墨的公共墨流路流路。喷墨记录头的制造方法在粘附形成有孔的孔板之前，至少在基板的相对表面的一部分上与各个油墨流路形成金属膜。喷墨打印机使用喷墨记录头。

8. 发明授权

US6161924A Ink jet recording head 失效
标题翻译：喷墨记录头
公开(公告)号：US6161924A
公开(公告)日：2000-12-19
申请号：US857858
申请日：1997-05-16
申请人： Masao Mitani , Kenji Yamada , Osamu Machida , Kazuo Shimizu , Katsunori Kawasumi
发明人： Masao Mitani , Kenji Yamada , Osamu Machida , Kazuo Shimizu , Katsunori Kawasumi
IPC分类号： B41J2/05 , B41J2/14 , B41J2/16
CPC分类号： B41J2/14129 , B41J2202/03
摘要： In an ink jet recording head, the thin-film thermal resistor is covered by an electrically-insulating oxidation film. An inorganic insulation layer is formed over a part of the thin-film thermal resistor and the thin-film conductor. An organic insulation layer is formed over at least a part of the inorganic insulation layer that covers the connecting edge of the connection portion between the thin-film thermal resistor and the thin-film conductor.
摘要翻译：在喷墨记录头中，薄膜热电阻被电绝缘氧化膜覆盖。在薄膜热电阻器和薄膜导体的一部分上形成无机绝缘层。在覆盖薄膜热电阻和薄膜导体之间的连接部分的连接边缘的无机绝缘层的至少一部分上形成有机绝缘层。

9. 发明授权

US6012804A Ink jet recording head 失效
标题翻译：喷墨记录头
公开(公告)号：US6012804A
公开(公告)日：2000-01-11
申请号：US159635
申请日：1998-09-24
申请人： Masao Mitani
发明人： Masao Mitani
IPC分类号： B41J2/05 , B41J2/14 , B41J2/16
CPC分类号： B41J2/14129 , B41J2002/14387 , B41J2202/03 , B41J2202/11
摘要： In an ink jet recording head of the type in which a bubble generated in ink filling an ink channel ejects an ink droplet, a thin-film resistor that generates the bubble is protected from cavitation damage. To this effect, a particular portion of the resistor is covered with a tantalum layer. The thickness of the tantalum layer is from 0.1 to 0.2 microns.
摘要翻译：在其中在填充墨水通道的墨水中产生的气泡喷射墨滴的类型的喷墨记录头中，保护产生气泡的薄膜电阻器免于气蚀损坏。为此，电阻器的特定部分被钽层覆盖。钽层的厚度为0.1至0.2微米。

10. 发明授权

US5710583A Ink jet image recorder 失效
标题翻译：喷墨图像记录器
公开(公告)号：US5710583A
公开(公告)日：1998-01-20
申请号：US587803
申请日：1995-12-29
申请人： Masao Mitani
发明人： Masao Mitani
IPC分类号： B41J2/05 , B41J2/005 , B41J2/14 , B41J2/16 , H01C7/00
CPC分类号： B41J2/1412 , B41J2/005 , B41J2/14056 , B41J2/14129 , B41J2/1603 , B41J2/1604 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2202/03 , B41J2202/11
摘要： A liquid droplet ejecting recording head includes a wall defining a chamber for being filled with recording liquid, said wall having a portion for defining an orifice communicated with the chamber; and a thin-film resistor provided on a surface of the wall facing the chamber so as to be located in the chamber, the thin-film resistor having one surface facing the chamber with which the thin-film resistor may be exposed to the recording liquid contained in the chamber, the thin-film resistor being energized with pulsed electric current for generating pulsed heat to directly heat the recording liquid, to thereby allow the recording liquid to be ejected outside through the orifice from the chamber in the form of a droplet and to be attached onto a surface of image recording medium positioned in confrontation with the orifice.
摘要翻译：液滴喷射记录头包括限定用于填充记录液体的室的壁，所述壁具有用于限定与室连通的孔的部分; 以及薄膜电阻器，其设置在面向所述室的所述壁的表面上以位于所述室中，所述薄膜电阻器具有面向所述室的一个表面，所述薄膜电阻器可以通过所述薄膜电阻器暴露于所述记录液体薄膜电阻器通过脉冲电流被激发，用于产生脉冲热量以直接加热记录液体，从而允许记录液体以液滴的形式从腔室中通过孔口喷射到外部，被附着到与孔对置定位的图像记录介质的表面上。

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