专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US4959440A Polymide for high-temperature adhesive 失效
标题翻译： Polymide用于高温胶粘剂
公开(公告)号：US4959440A
公开(公告)日：1990-09-25
申请号：US6513
申请日：1987-01-23
申请人： Shoji Tamai , Saburo Kawashima , Yoshiho Sonobe , Masahiro Ohta , Hideaki Oikawa , Akihiro Yamaguchi
发明人： Shoji Tamai , Saburo Kawashima , Yoshiho Sonobe , Masahiro Ohta , Hideaki Oikawa , Akihiro Yamaguchi
IPC分类号： C08G73/00 , C08G73/10 , C09J179/08
CPC分类号： C08G73/1071 , C08G73/105
摘要： This invention relates to a novel polyimide and describes method of its preparation, adhesives of the polyimide and the method for their application.The polyimide has recurring units of the formula ##STR1## (where the positions of two carbonyl radicals in a benzene ring are meta or para, and R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).The polyimide can be prepared by reacting diamine with tetracarboxylic dianhydride in organic solvents and imidizing resultant polyamic acid.The diamine in use is ether diamine and includes 1,3-bis[4-(3-aminophenoxy)benzoyl]benzene and 1,4-bis[4-(3-aminophenoxy)benzoyl]benzene.Various tetracarboxylic dianhydrides can be used and particularly prefered are pyromellitic dianhydride and 3,3',4,4'-benzophenonetetracarboxylic dianhydride.
摘要翻译：本发明涉及一种新型聚酰亚胺及其制备方法，聚酰亚胺的粘合剂及其应用方法。聚酰亚胺具有下式的重复单元：其中苯环中的两个羰基的位置是间位或对位的，R是选自以下的四价基团：具有式不少于两个碳，环脂族基团，单芳族基团，缩合多芳族基团和非缩合多芳族基团，其中芳族基团与键或交联官能团相互连接）。聚酰亚胺可以通过二胺与四羧酸二酐在有机溶剂中反应并酰亚胺化得到的聚酰胺酸来制备。所用的二胺是醚二胺，包括1,3-双[4-（3-氨基苯氧基）苯甲酰]苯和1,4-双[4-（3-氨基苯氧基）苯甲酰基]苯。可以使用各种四羧酸二酐，特别优选的是均苯四酸二酐和3,3'，4,4'-二苯甲酮四羧酸二酐。

2. 发明授权

US4883718A Flexible copper-clad circuit substrate 失效
标题翻译：柔性铜包覆电路基板
公开(公告)号：US4883718A
公开(公告)日：1989-11-28
申请号：US159850
申请日：1988-02-05
申请人： Masahiro Ohta , Saburo Kawashima , Yoshiho Snobe , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi
发明人： Masahiro Ohta , Saburo Kawashima , Yoshiho Snobe , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi
IPC分类号： B32B15/08 , H05K1/03 , H05K3/02
CPC分类号： B32B15/08 , H05K1/0346 , H05K3/022 , Y10S428/901 , Y10T428/31681 , Y10T428/31721
摘要： This invention relates to flexible copper-clad circuit substrates where copper foil is directly and firmly jointed with a polyimide film.Polyimide used is obtained conventionally by reacting diamine components including 3,3'-diaminobenzophenone, 1,3-bis(3-aminophenoxy)-bezene, 4,4'-bis(3-aminophenoxy)biphenyl, 2,2-bis[4-(3-aminophenoxy)-phenyl]propane, 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, bis[4(3-aminophenoxy)phenyl] sulfide, bis[4-(3-aminophenoxy)phenyl] ketone and bis[4-(3-aminophenoxy)phenyl] sulfone, with tetracarboxylic acid dianhydride including pyromellitic dianhydride, 3,3',4,4'-benzophenone tetracarboxylic dianhydride, 3,3',4,4'-biphenyl tetracarboxylic dianhydride and bis(3,4-dicarboxyphenyl) ether dianhydride, in organic solvent, and by thermally or chemically imidizing resultant polyamic acid.Polyimide thus obtained has relatively lower melt viscosity and is flowable at high temperatures. Therefore, the copper foil and the polyimide film were assembled, pressed by heating under pressure and further cured to afford the flexible copper-clad circuit substrates having the polyimide film firmly jointed with the copper foil.
摘要翻译： PCT No.PCT / JP86 / 00334 Sec。 371日期1988年2月5日 102（e）日期1988年2月5日PCT Filed 1986年6月30日PCT公布。出版物WO88 / 00428 日本公开日1988年1月14日。本发明涉及铜箔与聚酰亚胺膜直接且牢固地接合的柔性铜包覆电路基板。所使用的聚酰亚胺通常通过使包括3,3'-二氨基二苯甲酮，1,3-双（3-氨基苯氧基） - 亚乙基，4,4'-双（3-氨基苯氧基）联苯，2,2-双[4 - （3-氨基苯氧基） - 苯基]丙烷，2,2-双[4-（3-氨基苯氧基）苯基] -1,1,1,3,3,3-六氟丙烷，双[4（3-氨基苯氧基）苯基 ]硫醚，双[4-（3-氨基苯氧基）苯基]酮和双[4-（3-氨基苯氧基）苯基]砜与四羧酸二酐包括均苯四酸二酐，3,3'，4,4'-二苯甲酮四羧酸二酐，3,3'，4,4'-联苯四羧酸二酐和双（3,4-二羧基苯基）醚二酐在有机溶剂中，并通过热或化学酰亚胺化得到的聚酰胺酸。如此获得的聚酰亚胺具有相对较低的熔体粘度并且可在高温下流动。因此，通过加压加压将铜箔和聚酰亚胺膜组装，加压固化，得到具有与铜箔牢固连接的聚酰亚胺膜的柔性铜包覆电路基板。

3. 发明授权

US4847349A Polyimide and high-temperature adhesive of polyimide from meta substituted phenoxy diamines 失效
标题翻译：聚酰亚胺和来自间位取代的苯氧基二胺的聚酰亚胺的高温粘合剂
公开(公告)号：US4847349A
公开(公告)日：1989-07-11
申请号：US44028
申请日：1987-06-03
申请人： Masahiro Ohta , Saburo Kawashima , Yoshiho Sonobe , Shoji Tamai , Hideaki Oikawa , Kouji Ohkoshi , Akihiro Yamaguchi
发明人： Masahiro Ohta , Saburo Kawashima , Yoshiho Sonobe , Shoji Tamai , Hideaki Oikawa , Kouji Ohkoshi , Akihiro Yamaguchi
IPC分类号： C08G73/10 , C09J179/08
CPC分类号： C08G73/1039 , C08G73/105 , C08G73/1064 , C08G73/1071 , C09J179/08
摘要： Polyimide having repeating units of the following formula (I) and its polyamic acid precursor having repeating units of the following formula (II) are disclosed; ##STR1## (where Y is a radial selected from the group consisting of a bond, divalent hydrocarbon having 1 to 10 carbons, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxide, and R is a tetra-valent radical selected from the group consisting of aliphatic radical having 2 and more carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and noncondensed polyaromatic radical wherein aromatic radicals ae mutually connected with a bond or a crosslinking function).Typical examples of polyimide and polyamic acid include where Y is thio radical and R is ##STR2## Y is a bond and R is III or IV, andy is isopropylidene radical and R is IV.The polymers can be prepared from corresponding diamine and tetracarboxylic acid dianhydride.Polyimide or polyamic acid of this invention is excellent for high-temperature adhesive.
摘要翻译： PCT No.PCT / JP86 / 00335 Sec。 371日期：1987年6月3日 102（e）1987年6月3日PCT PCT日期1986年6月30日PCT公布。出版物WO87 / 01378 公开了具有下式（I）的重复单元的聚酰亚胺及其具有下式（II）的重复单元的聚酰胺酸前体。（Ⅰ）（Ⅱ）（其中Y是选自由键，碳原子数为1〜10的二价烃，六氟化异亚丙基，羰基，硫基，亚磺酰基，磺酰基和氧化物组成的组的径向，R为是选自具有2个或更多个碳的脂族基团，环脂族基团，单芳族基团，缩合多芳族基团和非缩合多芳族基团的四价基团，其中芳族基团与键或交联官能团相互连接）。聚酰亚胺和聚酰胺酸的典型实例包括其中Y为硫基，R为Y，R为III或IV，且为异丙叉基，R为IV。聚合物可以由相应的二胺和四羧酸二酐制备。本发明的聚酰亚胺或聚酰胺酸对于高温粘合剂是优异的。

4. 发明授权

US4795798A High-temperature adhesive polyimide from 2,2-bis[4-(3-amino phenoxy)phenyl]1,1,1,3,3,3-hexafluoro propane 失效
标题翻译： 2,2-双[4-（3-氨基苯氧基）苯基] 1,1,1,3,3,3-六氟丙烷的高温粘合聚酰亚胺
公开(公告)号：US4795798A
公开(公告)日：1989-01-03
申请号：US18496
申请日：1987-02-25
申请人： Shoji Tamai , Saburo Kawashima , Masahiro Ohta , Hideaki Oikawa , Kouji Ohkoshi , Akihiro Yamaguchi
发明人： Shoji Tamai , Saburo Kawashima , Masahiro Ohta , Hideaki Oikawa , Kouji Ohkoshi , Akihiro Yamaguchi
IPC分类号： C08G73/10
CPC分类号： C08G73/105
摘要： This invention discloses high-temperature adhesives having a good light-transmittance and excellent high-temperature flowability which comprises polyimide having recurring units represented by the following formula (I) ##STR1## (where R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).The polyimide is obtained by preparing polyamic acid through the reaction of 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3,-hexafluoropropane as a diamine component with tetracarboxylic dianhydride such as pyromellitic dianhydride, 3,3',4,4'- biphenyltetracarboxylic dianhydride, bis(3,4-dicarboxyphenyl) ether dianhydride and 3,3'4,4'-benzophenonetetracarboxylic dianhydride, and further conducting the ring-closing reaction of resultant polyamic acid by dehydration.
摘要翻译：本发明公开了具有良好的透光率和优异的高温流动性的高温粘合剂，其包含具有由下式（I）表示的重复单元的聚酰亚胺（I）（其中R是选自由具有不少于2个碳的脂族基团，环脂族基团，单芳族基团，缩合多芳族基团和非缩合多芳族基团组成的组，其中芳族基团与键或交联官能团相互连接）。聚酰亚胺通过以二胺组分2,2-二[4-（3-氨基苯氧基）苯基] -1,1,1,3,3,3 - 六氟丙烷与四羧酸二酐的反应制备聚酰胺酸得到，作为均苯四酸二酐，3,3'，4,4'-联苯四羧酸二酐，双（3,4-二羧基苯基）醚二酐和3,3'4,4'-二苯甲酮四羧酸二酐，进一步进行所得物的闭环反应聚酰胺酸脱水。

5. 发明授权

US5821319A Liquid crystal polyamide-imide copolymer 失效
标题翻译：液晶聚酰胺 - 酰亚胺共聚物
公开(公告)号：US5821319A
公开(公告)日：1998-10-13
申请号：US627037
申请日：1996-04-03
申请人： Atsushi Shibuya , Yuichi Okawa , Shoji Tamai , Masahiro Ohta , Akihiro Yamaguchi
发明人： Atsushi Shibuya , Yuichi Okawa , Shoji Tamai , Masahiro Ohta , Akihiro Yamaguchi
IPC分类号： C08G73/14 , C08L27/12 , C08L27/16 , C08L77/00 , C08L79/08 , C08G73/10 , C08G69/26
CPC分类号： C08L27/12 , C08G73/14 , C08L79/08 , C08L27/16 , C08L77/00 , Y10T428/1018 , Y10T428/1023 , Y10T428/29 , Y10T428/2913 , Y10T428/2969 , Y10T428/31504 , Y10T428/31721
摘要： A sliding material and a heat resistant filament which primarily comprises a liquid crystal polyimide, a liquid crystal polyamide or a liquid crystal polyamide-imide copolymer having at least one recurring structural unit selected from the formula (1) and the formula (2) and is excellent in heat resistance, mechanical characteristics and other fundamental properties of polyimides, and relates to significant improvement of heat-resistance by heat-treating the sliding material, the filament and the molded items. The liquid crystal polyamide-imide copolymer which comprises in a polymer molecule 0.05.about.0.95 mole ratio of the recurring structural units of the formula (1) and 0.95.about.0.05 mole ratio of recurring structural units of the formula (2) has excellent processing ability ##STR1##
摘要翻译：一种滑动材料和耐热丝，其主要包括具有至少一个选自式（1）和式（2）的重复结构单元的液晶聚酰亚胺，液晶聚酰胺或液晶聚酰胺 - 酰亚胺共聚物，并且是聚酰亚胺的耐热性，机械特性和其它基本性能优异，并且涉及通过热处理滑动材料，长丝和模制品而显着提高耐热性。在聚合物分子中含有式（1）的重复结构单元的0.05分子量分数0.95摩尔比和式（2）的重复结构单元的0.95摩尔比的液晶聚酰胺 - 酰亚胺共聚物具有优异的加工能力，（1）（2）

6. 发明授权

US5525704A Resin forming compositions 失效
标题翻译：树脂成型组合物
公开(公告)号：US5525704A
公开(公告)日：1996-06-11
申请号：US547517
申请日：1995-10-24
申请人： Shoji Tamai , Norimasa Yamaya , Masahiro Ohta , Akihiro Yamaguchi
发明人： Shoji Tamai , Norimasa Yamaya , Masahiro Ohta , Akihiro Yamaguchi
IPC分类号： C07C201/12 , C07C205/38 , C07C213/02 , C07C217/90 , C07D207/44 , C07D207/452 , C08G73/12 , C08G73/10
CPC分类号： C07D207/452 , C07C205/38 , C07C217/90 , C08G73/124
摘要： Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.
摘要翻译：公开了由式（I）表示的芳族二胺化合物，其中R是H或CH 3。还公开了由式（IV）表示的双马来酰亚胺化合物。其中R是H或CH 3，包含这些化合物的树脂形成组合物也被公开。这些化合物可用作树脂的原料，树脂形成组合物和树脂可以提供优异的耐热性和耐冲击性和低吸湿性。

7. 发明授权

US5506311A Polyimides, process for the preparation thereof and polyimide resin compositions 失效
公开(公告)号：US5506311A
公开(公告)日：1996-04-09
申请号：US335332
申请日：1994-11-03
申请人： Shoji Tamai , Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Hideaki Oikawa , Akihiro Yamaguchi
发明人： Shoji Tamai , Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Hideaki Oikawa , Akihiro Yamaguchi
IPC分类号： C08G73/10 , C08L79/08 , C08L81/04
CPC分类号： C08G73/1042 , C08G73/105 , C08G73/1071 , C08L79/08
摘要： In one aspect, the present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carrying out condensation of 4,4'-bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a different diamine compound and optionally with a different tetracarboxylic acid dianhydride.In a second aspect, the present invention relates to a heat resistant resin composition consisting essentially of an aromatic polyetherimide and a defined polyimide.In a third aspect, the present invention relates to a polyimide resin composition comprised on a defined polyimide and a separate high-temperature engineering polymer.In a fourth aspect, the present invention relates to a resin composition comprised of a defined polyimide and an aromatic polyamideimide.

8. 发明授权

US5484948A Bismaleimide compounds 失效
标题翻译：双马来酰亚胺化合物
公开(公告)号：US5484948A
公开(公告)日：1996-01-16
申请号：US284103
申请日：1994-08-02
申请人： Keizaburo Yamaguchi , Tatsuhiro Urakami , Yoshimitsu Tanabe , Midori Yamazaki , Shoji Tamai , Norimasa Yamaya , Masahiro Ohta , Akihiro Yamaguchi
发明人： Keizaburo Yamaguchi , Tatsuhiro Urakami , Yoshimitsu Tanabe , Midori Yamazaki , Shoji Tamai , Norimasa Yamaya , Masahiro Ohta , Akihiro Yamaguchi
IPC分类号： C07C201/12 , C07C205/38 , C07C213/02 , C07C217/90 , C07D207/44 , C07D207/452 , C08G73/12 , C07D207/444
CPC分类号： C07D207/452 , C07C205/38 , C07C217/90 , C08G73/124
摘要： Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.
摘要翻译：公开了由式（I）表示的芳族二胺化合物，其中R是H或CH 3。还公开了由式（IV）表示的双马来酰亚胺化合物。其中R是H或CH 3，包含这些化合物的树脂形成组合物也被公开。这些化合物可用作树脂的原料，树脂形成组合物和树脂可以提供优异的耐热性和耐冲击性和低吸湿性。

9. 发明授权

US5268446A Readily processable polyimide and preparation process of same 失效
标题翻译：易于加工的聚酰亚胺及其制备方法相同
公开(公告)号：US5268446A
公开(公告)日：1993-12-07
申请号：US743105
申请日：1991-08-09
申请人： Shoji Tamai , Masahiro Ohta , Akihiro Yamaguchi
发明人： Shoji Tamai , Masahiro Ohta , Akihiro Yamaguchi
IPC分类号： C08G73/10 , C08G69/26
CPC分类号： C08G73/1071 , C08G73/1014
摘要： A readily melt-processable polyimide obtained by reacting diamino-diphenyl ether with 3,3',4,4'-biphenyltetracarboxylic dianhydride in the presence of phthalic anhydride and thermally or chemically imidizing the resultant polyamic acid.

10. 发明授权

US5206438A Aromatic diamine compounds, bismaleimide compounds, thermosetting resin forming compositions therefrom, resins therefrom, and methods for their preparation 失效
标题翻译：芳族二胺化合物，双马来酰亚胺化合物，形成其组合物的热固性树脂，其树脂及其制备方法
公开(公告)号：US5206438A
公开(公告)日：1993-04-27
申请号：US601424
申请日：1990-10-23
申请人： Keizaburo Yamaguchi , Tatsuhiro Urakami , Yoshimitsu Tanabe , Midori Yamazaki , Shoji Tamai , Norimasa Yamaya , Masahiro Ohta , Akihiro Yamaguchi
发明人： Keizaburo Yamaguchi , Tatsuhiro Urakami , Yoshimitsu Tanabe , Midori Yamazaki , Shoji Tamai , Norimasa Yamaya , Masahiro Ohta , Akihiro Yamaguchi
IPC分类号： C07C201/12 , C07C205/38 , C07C213/02 , C07C217/90 , C07D207/44 , C07D207/452 , C08G73/12
CPC分类号： C07D207/452 , C07C205/38 , C07C217/90 , C08G73/124
摘要： Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式